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ICS30
Label
Chip Specification
Product Specification Revision Public 2000-05-02
Philips Semiconductors
Chip Specification
Rev.
2000
Contents
CONTENTS DEFINITIONS
Life Support Applications Abbreviations
SCOPE ORDERING INFORMATION FUNCTIONAL DESCRIPTION
Basic Features Block Diagram Memory Organisation. 5.3.1 Serial Number. 5.3.2 Write Access Conditions 5.3.3 Special Functions (EAS/QUIET). 5.3.4 Family Code Application Identifier. 5.3.5 Configuration delivered ICs. MECHANICAL SPECIFICATIONS MECHANICAL WAFER SPECIFICATIONS
Wafer Status Backside Treatment
DOCUMENTATION
Delivery Documentation. Fail-Die Identification. 8.2.1 Specification. 8.2.2 Wafer Mapping. QUALITY ASSURANCE
Electrical Acceptance Test. Visual Inspection. 9.2.1 After Wafer Final Test. 9.2.2 After Sawing (Film Frame Carrier). PACKING
10.1 Storage Recommendations 10.2 Possible Forms Delivery 10.2.1 Packing Unsawn Wafers. 10.2.2 Packing Sawn Wafers
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Chip Specification
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HANDLING RECOMMENDATIONS
11.1 Sawing 11.2 Attach. 11.3 Wire Bonding. COIL SPECIFICATION ELECTRICAL SPECIFICATIONS HINTS LABEL ENCAPSULATION
14.1 Protection against Visible Light. 14.2 Protection against Light. 14.3 Resistance X-Rays INLET/LABEL CHARACTERISATION TEST
15.1 Characterisation Inlet/Label 15.2 Final Test Inlet/Label. APPENDIX PLAN APPENDIX CLUSTER PLAN APPENDIX CLUSTER APPENDIX WAFER
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Chip Specification
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2000
Definitions
Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given accordance with Absolute Maximum Rating System (IEC 134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics section specification implied. Exposure limiting values extended periods affect device reliability. Application information Where application information given, advisory does form part specification. This data sheet contains target goal specifications product development. This data sheet contains preliminary data; supplementary data published later. This data sheet contains final product specifications.
Life Support Applications
These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips customers using selling these products such applications their risk agree fully indemnify Philips damages resulting from such improper sale.
Abbreviations
ASCII EEPROM ETSI MTBF American Standard Code Information Interchange Cyclic Redundancy Check European Article Number Electronic Article Surveillance Electrically Erasable Programmable Read Only Memory Electromagnetic Interference European Telecommunications Standards Institute Federal Communications Commission Film Frame Carrier Value hexadecimal notation Integrated Circuit Industrial, Scientific, Medical Least Significant Byte Most Significant Byte Mean Time Between Failure Printed Circuit Board Process Control Module Radio Frequency Root Mean Square Serial Number Ultraviolet
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Chip Specification
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2000
Scope
This specification describes electrical, physical dimensional properties unsawn sawn wafers Label Philips 6C15 IDFW process base delivery tested Label ICs. General recommendations given storage, handling processing wafers well assembly labels.
Reference documents:
MIL-STD 883D Method 3023 MIL-STD 883D Method 3015 SNW-FQ-627 PICTOH-QS007 General Specification Wafer (Prod. Spec.) General Quality Specification Label Coil Design Guide
This product specification valid VCOL1V0 from mask revision upwards.
Ordering Information
Following ordering options available:
Type Name ICS30 01W/N5D ICS30 01U/N5D ICS30 01U/L6D Description Sawn wafer foil (FFC), inked mapped Unsawn wafer, inked mapped Unsawn wafer, mapped (not inked) Ordering Code 9352 66005 9352 65025 9352 64025
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Chip Specification
Rev.
2000
Functional Description
Basic Features
Label dedicated chip intelligent label applications like logistics retail (including EAS) well baggage parcel identification airline business mail services. system offers possibility operating labels simultaneously field reader antenna (Anticollision). designed long range applications. Whenever connected very simple cheap type antenna result 13.56 carrier frequency) made windings printed, winded, etched punched coil Label operated without line sight distance (gate width).
Block Diagram
label requires internal power supply. contactless interface generates power supply system clock resonant circuitry inductive coupling reader. interface also demodulates data that transmitted from reader Label, modulates electromagnetic field data transmission from Label reader. Data stored non-volatile memory (EEPROM). EEPROM memory capacity organised blocks consisting bytes each block bits). higher blocks contain user data lowest blocks contain serial number, write access conditions some configuration bits.
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Chip Specification
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Memory Organisation
EEPROM memory divided into blocks. block smallest access unit. Each block consists bytes block bits). each byte represents least significant (LSB) most significant (MSB), respectively.
Block Block Block Block Block Block Block Block Block Block Block Block Block Block Block Block Byte SNR0 SNR4 Byte SNR1 SNR5 Byte SNR2 SNR6 Byte SNR3 SNR7 Serial Number (lower bytes) Serial Number (higher bytes) Write Access Conditions Special Functions (EAS/QUIET) Family Code/Application Identifier/User Data User Data User Data
values hexadecimal notation) shown table above stored EEPROM after wafer production process. contents blocks marked with table defined delivery.
5.3.1 Serial Number
unique serial number stored blocks programmed during production process. SNR0 table represents least significant byte SNR7 most significant byte, respectively.
5.3.2 Write Access Conditions
Write Access Condition bits block determine write access conditions each blocks. These bits only (and never changed i.e. already write protected blocks never written from this moment This also true block this block into write protected state clearing bits byte further changes write access conditions possible.
Byte
Byte
Byte
Byte
Block Write Access Conditions Block
User Data
User Data
Special Write Funct. Access
Serial Number
ones pairs bits have cleared together corresponding block wanted write protected forever (1|1 write access enabled, write access disabled). Writing pairs block allowed! extremely important particularly careful when clearing Write Access bits block lose write access blocks label case mistake. course this feature label into hardware write protected state!
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Chip Specification
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5.3.3 Special Functions (EAS/QUIET)
Special Functions block holds bits (Electronic Article Surveillance mode active label answers command) well QUIET bits (QUIET mode enabled label permanently disabled activated again with `Reset QUIET bit' command). state QUIET mode does influence functionality command. remaining bits (greyed following figure) reserved future use.
Byte
Byte
Byte
Byte
Block Special Functions
Quiet
Quiet: EAS:
QUIET mode enabled mode enabled
QUIET mode disabled mode disabled
Writing pairs block allowed! Changing Write Access Control Configuration must done secure environment reading current value block masking values positions that changed). label must moved communication field antenna during writing! recommend label close antenna remove during operation.
5.3.4 Family Code Application Identifier
system offers feature (independently) Family Codes and/or Application Identifiers with some reader commands (this allows example creation `label families'). These 8-bit values located beginning User Data (block shown following figure only evaluated corresponding bytes reader commands unequal zero. Only both corresponding parameter bytes reader commands Anticollision/Select, Unselected Read, respectively, zero, block used user data without restriction.
Byte
Byte
Byte
Byte
Family Code Application greyed bytes customer usage well remaining blocks are.
Block Family Code, Application
5.3.5 Configuration delivered
Label delivered with following configuration Philips: Serial number unique read only Write Access Conditions allow change blocks (with exception both serial number blocks) Status mode defined Status QUIET mode defined Family Code Application Identifier defined User Data memory defined
status QUIET mode defined delivery, first command executed Label should Reset QUIET command!
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Chip Specification
Rev.
2000
Mechanical Specifications
Designation: VCOL1V0 visible each location attached plan attached plan TEST, (the test pads electrically neutral sawn wafers) AlSiCu 1460 1490 1380 1410 attached plan
Bond location: Bond size: Test size:
Bond metallisation material: Metallisation thickness: dimensions (incl. scribe line) dimensions (excl. scribe line) Tolerances sawn dies: identification: Passivation attributes:
passivation protection active areas against dust (particles) humidity general contamination (whole surface chip except bond pads). side passivation material: Passivation thickness: Oxynitride
glass-like physical properties careful handling processing required. Available backside treatment: etched
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Chip Specification
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2000
Mechanical Wafer Specifications
further information described following chapters please refer following Philips documents: Dicing Guidelines Thin Wafers General Specification Wafer (Prod. Spec.) case doubt inconsistency with following chapters above mentioned specifications applicable. Designation: Wafer diameter: separation lane width: Electrical connection substrate: each wafer laser scribed with batch wafer number (6") (Scribe line)
Geometrically complete dies wafer: approx. 7400 Orientation dies relat. wafer flat: Position test structures: Wafer layout: Batch size: Process: attached cluster attached cluster attached cluster wafers 6C15 IDFW
Wafer Status
Tested, unsawn Tested, sawn Minimum yield lot:
Backside Treatment
Wafers delivered with thickness (untreated) with (approx. mil) grinded etched backside.
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Chip Specification
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2000
Documentation
Delivery Documentation
Each wafer container each larger shipment container individually marked with identification information follows: Diffusion Batch number (wafer number) Part designation (type) with revision number Ordering code (see chapter Date code acceptation Good quantity
print final test results attached packing contains good quantity related every wafer number.
Fail-Die Identification
Every electrically tested according data sheet. Identification chips, which confirm with electrical parameters data sheet done inking and/or wafer mapping (all dies wafer periphery identified `FAIL').
8.2.1 Specification
Diameter: Height: Colour: Position: Attributes: min. max. black central third direction) opaque, water resistant
NOTE: Uncompleted dies with area (wafer periphery) inked!
8.2.2 Wafer Mapping
Wafer mapping failed identification available Floppy-Disk. Format: Electroglas ESC-ASCEND Floppy-Disk
NOTE: wafer refers unsawn wafers. sawn wafers FFC) additional might inked (marked fail) damaged during sawing process (compared wafer map)! Appendix example wafer map.
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Chip Specification
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2000
Quality Assurance
Electrical Acceptance Test
electrical acceptance test performed line (`sampling fly') according test specifications. Sampling plan: according General Quality Specification
Visual Inspection
9.2.1 After Wafer Final Test
Performed according document SNW-FQ-627. Sampling plan: according General Quality Specification
9.2.2 After Sawing (Film Frame Carrier)
Performed according document PICTOH-QS007. Sampling plan wafers lot): accept
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Chip Specification
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2000
Packing
packing shipment wafers protect wafers against shock, severe impact, dust electrostatic discharge. packing unsawn wafers sawn wafers done according Philips `General Specification Wafer (Prod. Spec.)'.
10.1 Storage Recommendations
Unsawn/sawn wafers should kept their original packing whilst storage. Recommended storage conditions: Temperature: Climate atmosphere: Duration storage: r.h. dried (only unsawn wafers!) max. months
Deviating requirements have arranged between customer Philips Semiconductors.
10.2 Possible Forms Delivery
10.2.1 Packing Unsawn Wafers
Delivery form: wafer
10.2.2 Packing Sawn Wafers
Delivery form: Foil thickness: Foil material: Film Frame Carrier (standard Philips carrier type 0.55 0.85 sticky foil
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Chip Specification
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Handling Recommendations
Please refer Philips `General Specification Wafer (Prod. Spec.)' following items:
11.1 Sawing 11.2 Attach 11.3 Wire Bonding
Coil Specification
Label connected pads coil characterised electrical parameters according Philips application note `SL1 ICS30 Label Coil Design Guide'.
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Chip Specification
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Electrical Specifications
ABSOLUTE MAXIMUM RATINGS
SYMBOL Tstg VESD PARAMETER Storage Temperature Range Junction Temperature Voltage Immunity
MIL-STD-883D, Method 3015.7, Human Body Model
TEST CONDITIONS
RATING +140 +140
UNIT peak
Imax LA-LB Maximum Input Peak Current mApeak NOTES: Stresses above those listed under Absolute Maximum Ratings cause permanent damage device. This stress rating only functional operation device these conditions other than those described Operating Conditions Electrical Characteristics section this specification implied. This product includes circuitry specifically designed protection internal devices from damaging effects excessive static charge. Nonetheless, suggested that conventional precautions taken avoid applying greater than rated maxima.
OPERATING CONDITIONS
SYMBOL Tamb ILA-LB PARAMETER TEST CONDITIONS
UNIT mArms Vpeak Vpeak Vpeak
Operating Ambient Temperature Operating Junction Temperature Input Current Minimum Supply Voltage VLA-LB READ/EAS Minimum Supply Voltage VLA-LB WRITE Minimum Supply Voltage VLA-LB READ/EAS/WRITE
Standard Mode Standard Mode Fast Mode
Operating Frequency 13.553 13.560 13.567 NOTES: Typical ratings guaranteed. These values listed room temperature. voltage between limited on-chip voltage limitation circuitry (corresponding parameter ILA-LB). Bandwidth limitation kHz) according band regulations.
ELECTRICAL CHARACTERISTICS
Tamb
SYMBOL Cres Pmin mmin mmax tret nwrite
PARAMETER Input Capacitance between Minimum Operating Supply Power Minimum Modulation Voltage Demodulator Response Maximum Modulation Voltage Demodulator Response Modulation Pulse Length Voltage Modulation Start-Pulse Length Voltage Demodulator Response Time Modulator Resistance EEPROM Data Retention EEPROM Write Endurance
TEST CONDITIONS VLA-LB Vrms VLA-LB Vrms
22.3
24.7
UNIT
23.5
Vmax Vmin Vmax Vmin Vmax Vmin Vmax Vmin Standard Mode, Fast Mode, ILA-LB Tamb
3.54 15.34 5.31
9.44 21.24
Years Cycles
17.11
NOTES: Typical ratings guaranteed. These values listed room temperature. Measured with HP4285A meter 13.56 MHz. Including losses resonant capacitor rectifier. given values derived from 13.56 system frequency. Recommended values pulse duration generated read/write device.
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Chip Specification
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2000
Hints Label Encapsulation
14.1 Protection against Visible Light
result ultra power design Label some analogue circuits chip light sensitive. This means that common light impact operation label chip protected against visible light radiation. Measurements have shown that radiation Emax W/m2 (spectrum: 1000 causes reduced operating range plain chip. Measurements direct sunlight summer deliver values W/m2 ensure proper operation expected minimum radiation reduction factor approx. 260/60 8.7) must provided encapsulation. That means special care taken ensure sufficient light protection Label (e.g. translucent encapsulation underfiller, according application requirements.
14.2 Protection against Light
EEPROM memory, also used Label some principle sensitivity light (applies EEPROM-technology general). Thus strong exposure production inlets/labels avoided. protection ensured using appropriate assembly methods.
14.3 Resistance X-Rays
X-ray exposure comparable Philips (with even smaller feature size) caused neither long term influence behaviour data retention EEPROMs.
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Chip Specification
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Inlet/Label Characterisation Test
15.1 Characterisation Inlet/Label
parameters recommended characterised inlet/label are:
Parameter Resonant frequency Symbol fres Conditions Resonant frequency Tamb
command transmitted inlet/label Label generates response modulation
Threshold value UNSELECTED READ command (standard mode) Threshold value WRITE command (standard mode)
UNSELECTED READ command
WRITE (and Verifying READ) command
15.2 Final Test Inlet/Label
Basic flow production test: Production wafer Testing dies wafer Writing serial numbers pre-configuration Sawing wafer Assembly inlets/labels Final test inlets/labels Writing customer data
detect damage EEPROM cells during production inlets/labels final test EEPROM after assembly inlet/label recommended. This necessary achieve lowest failure rates.
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Appendix Plan
Measuring unit: test pads (TEST VSS) electrically neutral sawn wafers!
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Chip Specification
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Appendix Cluster Plan
Measuring unit:
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Appendix Cluster
three black lines show position structures inch wafer!
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Appendix Wafer
following screenshot shows example wafer map:
file this example:
ELECTROGLAS APPLICATIONS WAFER TEST DATA FILE COPYRIGHT ASCEND 09397 DEVICE VCOL1HE2 PRODUCT VCOL\4020 WAFER READER 09397-05-B6 XSTEP UNITS (0.1)MIL YSTEP UNITS (0.1)MIL XREF 16891 UNITS (0.1)MIL YREF -261 UNITS (0.1)MIL XDELTA YDELTA FLAT XFRST YFRST PRQUAD COQUAD DIAM 6000 UNITS DATE 2000-01-23 TIME 15:30:00 OPERATOR 4020 SETUP FILE M:\SET\VCOL1HE2.SET TEST SYSTEM VCOL\4020 TEST DATA PROBE CARD PROBER PIWP105 shortening file X40Y3 X41Y3 X42Y3 X43Y3 X44Y3 X45Y3 X46Y3 X47Y3 X48Y3 X49Y3 X50Y3 X51Y3 X52Y3 X53Y3 X54Y3 shortening file EDATE ETIME
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Philips Semiconductors worldwide company
Argentina: South America Australia: Waterloo Road, North Ryde, 2113, Tel. 9805-4455, Fax. 9805-4466 Austria: Computerstr. A-1101 WIEN, P.O. 213, Tel. 101, Fax. 1210 Belarus: Hotel Minsk Business Center, Bld. 1211, Volodarski Str. 220050 MINSK, Tel. +375 733, Fax. +375 Belgium: Netherlands Brazil: South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, James Bourchier Blvd., 1407 SOFIA, Tel. +359 211, Fax. +359 Canada: United States Romania: Italy China/Hong Kong: Hong Kong Industrial Technology Centre, Chee Avenue, Kowloon Tong, Tel. +852 2811-9111, Fax. +852 2811-9173 Colombia: South America Czech Republic: Austria Denmark: Frederikskaj, Sydhavnsgade DK-1780 Copenhagen Tel. 293333, Fax. 293905 Finland: Sinikalliontie FIN-02630 ESPOO, Tel. +358 615800, Fax. +358 61580/xxx France: Carnot BP317 92156 Suresnes Cedex, Tel. 6161, Fax. 996427 Germany Hammerbrookstrabe D-20097 HAMBURG, Tel. Fax. Greece: 25th March Street, 17778 TAVROS/ATHENS, Tel. 4894 339/239, Fax. 4814 Hungary: Austria India: Shivsagar Estate, Block 'A', Annie Besant Road, Worli, Mumbai-400 018, Tel. 492-1365, Fax. 493-8722 Indonesia Gedung Philips, Buncit Raya Kav. 99-100, Jakarta 12510, Tel. 794-0040, Fax. 794-0080 Ireland: Newstead, Clonskeagh, DUBLIN Tel. +353 7640 000, Fax. +353 7640 Israel: RAPAC Electronics, Kehilat Saloniki AVIV 61180, Tel. +972 0444, Fax. +972 1007 Italy PHILIPS SEMICONDUCTORS, Piazza Novembre 20124 MILANO, Tel. 6752 2531, Fax. 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, Tokyo 108-8507, Tel. 3740-5130, Fax. 3740-5057 Korea: 260-199 Itaewon-dong, Yongsan-ku, Seoul, Korea P.O. 3680, Tel. 709-1412, Fax. 709-1415 Malaysia Jalan Universiti, 46200 Petaling Jaya, Selangor, Tel. 5214, Fax. 757-4880 Mexico: Philips Components, Paso, Texas, Tel. 772-4020 Middle East Italy Singapore: Lorong One, Payoh, Singapore 319762, Tel. 350-2538, Fax. 251-6500/250-6010 Slovakia Austria Slovenia: Italy South Africa: S.A. PHILIPS Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. 7430 Johannesburg 2000, Tel. 5911, Fax. 5494 South America Vicente Pinzon, floor, 04547-130 Paulo, Brazil, Tel. 2333, Fax. 1849 Spain: Balmes 08007 BARCELONA, Tel. 6312, Fax. 4107 Sweden: Kottbygatan Akalla, S-16485 STOCKHOLM, Tel. Fax. 2745 Switzerland: Allmendstrasse 140, CH-8027 Tel. 2686, Fax. 7730 Taiwan R.O.C.: Floor, Chien North Road, Sec.1, Taipei, Tel. +886 2134-2865, Fax. +886 2134-2874 Thailand: 209/2 Sanpavuth-Bangna Road, Prakanong, Bangkok 10260, Tel. 745-4090 x3261, Fax. 398-0793 Turkey Talatpasa Cad. 80640 Tel. 2770, Fax. 6707 Ukraine: PHILIPS UKRAINE, Patrice Lumumba str., Building Floor 252042 KIEV, Tel. +380 2776, Fax. +380 0461 United Kingdom: Philips Semiconductors Ltd., Bath Road, Hayes, MIDDLESEX 5BX, Tel. 5000, Fax. 8421 United States: East Arques Avenue, P.O. 3409, Sunnyvale, 94088-3409, Tel. +800 7381, Fax. +800 0087 Uruguay: South America Vietnam: Singapore Yugoslavia: PHILIPS, Pasica 5/v, 11000 BEOGRAD, Tel. +381 344, Fax.+381 Russia: Philips Russia, Usatcheva 35A, 119048 MOSCOW, Tel. 6918, Fax. 6919 Poland: Lukiska 04-123 WARSZAWA, Tel. 2831, Fax. 2327 Portugal: Spain Netherlands: Postbus 90050, 5600 EINDHOVEN, Bldg. Tel. 82785, Fax. 88399 Zealand: Wagener Place, Albert, C.P.O.Box 1041, Auckland, Tel. 815-4144, Fax. 849-7811 Norway: Manglerud 0612, OSLO, Tel. 8000, Fax. 8341 Pakistan: Singapore Philippines: Valero Street, Salcedo Village, Makati City, Metro Manila, Tel. 816-6380, Fax. 817-3474
Published Philips Semiconductors Gratkorn GmbH, Mikron-Weg A-8101 Gratkorn, Austria, Fax: 3124 other countries apply Philips Semiconductors, International Marketing Sales Communications, Building BE-p, P.O. 218, 5600 EINDHOVEN, Netherlands, Fax: 24825 Internet: Royal Philips Electronics N.V. 2000 rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights.
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