Pentium® XeonProcessor with Cache Thermal Solutions Guidelines

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Pentium® XeonProcessor with Cache Thermal Solutions Guidelines

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AP-973 Application Note
Pentium® XeonProcessor with Cache
Thermal Solutions Guidelines
Order number 245489-001 May, 2000
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Table Contents
INTRODUCTION. TERMINOLOGY. REFERENCES. REFERENCE THERMAL SOLUTION. Thermal Assumptions Thermal Analysis Thermal Conclusion Pentium® XeonProcessor with Cache Thermal Update HEAT SINK SAMPLE INFORMATION COMMON QUESTIONS
INTRODUCTION
This Application Note intended provide information about Intel's reference heat sink solution Pentium® Xeonprocessor with cache. addition, alternative processor cooling approaches discussed.
TERMINOLOGY
following terms used this document defined here clarification: Pentium® Xeonprocessor with 256KB cache refers Pentium Xeon processor which utilizes Cartridge Voltage Regulator technology, "OCVR", which 256KB Level cache. OCVR regulates VCC_CORE (the appropriate cartridge input voltage) required processor core voltage (VCC_CPU). OCVR developed provide necessary regulation guarantee highest possible frequency operation Pentium Xeon processor above. Pentium® Xeonprocessor with cache refers Pentium Xeon processor which utilizes Cartridge Voltage Regulator technology, "OCVR", which either Level cache. OCVR regulates VCC_CORE (the appropriate cartridge input voltage) required processor core voltage (VCC_CPU). OCVR developed provide necessary regulation guarantee highest possible frequency operation Pentium Xeon processor frequencies above. Pentium® Xeonprocessor refers Pentium Xeon processor without OCVR, requires separate CORE voltage sources. Pentium® Xeonprocessor refers Pentium Xeon processor with 256KB cache, Pentium Xeon processor with cache, Pentium Xeon processor MHz. cache -The cache integrated directly processor core Pentium Xeon processor with 256KB cache Pentium Xeon processor with cache, located substrate Pentium Xeon processor MHz. 2.8V Pentium® Xeonprocessor refers Pentium Xeon processor with 256KB cache Pentium Xeon processor with cache which powered with +2.8 volts applied VCC_CORE pins. 5/12V Pentium® Xeonprocessor refers Pentium Xeon processor with 256KB cache Pentium Xeon processor with cache which powered with either +5.0 +12.0 volts applied VCC_CORE pins. Processor substrate structure which components mounted inside S.E.C. cartridge (with without components attached). Processor core processor's execution engine. S.E.C. cartridge processor packaging technology used Pentium® Xeonprocessor family. S.E.C. short "Single Edge Contact" cartridge. Thermal plate surface used connect heat sink other thermal solution processor.
REFERENCES
reader this Application Note should also familiar with material concepts presented datasheets, applications notes, other documents Pentium® Xeonprocessor family. These found
REFERENCE THERMAL SOLUTION
reference passive heat sink solution that designed Pentium® Xeonprocessors provide adequate cooling Pentium Xeon processor with cache (based certain airflow ambient temperature assumptions, described greater detail this document). Chapter heat sink ordering information. Thermal Assumptions
Table latest Pentium® Xeonprocessor datasheet (Order Number 245094) shows maximum cache power, which does occur simultaneously with maximum processor core power. worst case condition thermal design occurs when processor core maximum power cache idle, since power density higher this case. 40.5 Watts actual worse case power dissipation Pentium Xeon processor this condition. Since OCVR component does come into contact with processor thermal plate, power removed conduction through cartridge substrate well both natural convection radiation), thermal contribution OCVR derated worst case power dissipation. This analysis based previous data from Pentium processor S.E.C.C. package, where concluded that thermal grease removed between thermal plate cache components, cache power still dissipates through thermal plate. Since OCVR package configuration similar, OCVR power assumed dissipated through thermal plate.
Thermal Analysis
performance thermal solution defined thermal resistance between thermal plate ambient around processor plate ambient). lower thermal resistance between thermal plate ambient air, more efficient thermal solution required plate ambient dependent upon maximum allowed thermal plate temperature (TPLATE), local ambient temperature (TLA around processor) thermal plate power (PPLATE). plate ambient (TPLATE TLA) PPLATE
Figure
Thermal density areas Pentium® Xeonprocessor with cache core OCVR components
Thermal Conclusion
reference passive heat sink will keep Pentium® Xeonprocessor with cache thermal plate temperature below specified value, local ambient temperature (TLA) maintained 40°C less, with airflow least LFM.
Pentium® XeonProcessor with Cache Thermal Update Pentium® Xeonprocessor with cache OLGA-2 Integrated Heat Spreader size 1.516" 1.516", shown Figure effective heat source size Pentium® Xeonprocessor with cache with OLGA-2 Integrated Heat Spreader times that Pentium Xeon processor with 256KB cache core size (which uses OLGA-1 package) 0.448" 0.362". factor been determined analytical empirical data. performance Pentium Xeon processor reference heat sink will improve significantly heat source size increase with package change from OLGA-1 Pentium Xeon processors with 256KB cache OLGA-2 package Pentium Xeon processors with cache. Consequently, heat sink thermal resistance (PA) will decrease. Without accounting reduction present reference thermal heat sink solution satisfies TPLATE requirement 65°C Pentium Xeon processors with cache.
HEAT SINK SAMPLE INFORMATION
passive heat sink available from several vendors, including Thermalloy (part number 22730U-CP35). Figure below. more mechanical information refer Chapter latest Pentium® Xeonprocessor with cache datasheet (Order Number 248711). heat sink assembly information contact your Intel representative contact Thermalloy
Thermalloy, Inc. 2021 Valley View Lane Dallas, 75234 (972) 488-4257 (972) 488-4461 http://www.thermalloy.com/
CONCEPTUAL
Figure
Reference passive heat sink
COMMON QUESTIONS
present chassis heat sink designed accommodate Pentium® Xeonprocessor MHz, will have perform additional thermal analysis? Yes. Even though data indicates present Pentium Xeon processor heat sink will support Pentium Xeon processors with cache, local temperature held 40°C, Intel still recommends performing thermal analysis your system.
Does Intel plan enabling other heat sink solution (other than Thermalloy 22730U-CP35 equivalents)? There additional heat sink vendors Intel developer website that have solutions that could meet your needs. Refer

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