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CHANNEL 500V TO-251 PowerMESHMOSFET TYPE D4NC50 DS(on)
Top Searches for this datasheetSTD4NC50 CHANNEL 500V TO-251 PowerMESHMOSFET TYPE D4NC50 DS(on) TYPICAL RDS(on) EXTREMELY HIGH dv/dt CAPABILITY 100% AVALANCHE TESTED HIGH VOLTAGE BENCHMARK GATE CHARGE MINIMIZED IPAK TO-251 (Suffix "-1") DESCRIPTION PowerMESHTMII evolution first generation MESH OVERLAYTM. layout refinements introduced greatly improve Ron*area figure merit while keeping device leading edge what concerns switching speed, gate charge ruggedness. APPLICATIONS HIGH CURRENT, HIGH SPEED SWITCHING SWITH MODE POWER SUPPLIES (SMPS) DC-AC CONVERTERS WELDING EQUIPMENT UNINTERRUPTIBLE POWER SUPPLIES MOTOR DRIVER INTERNAL SCHEMATIC DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol dv/dt( Parameter Drain-source Voltage (VGS Drain- gate Voltage ate-source Voltage Drain Current (continuous) Drain Current (continuous) Drain Current (pulsed) otal Dissipation Derating Factor Peak Diode Recovery voltage slope Storage Temperature Max. Operating Junction Temperature Value 14.8 di/dt A/µs, V(BR)DSS, TJMAX V/ns Pulse width limited safe operating area September 1999 STD4NC50 THERMAL DATA -case Rthj -amb thc-sink Thermal Resistance Junction-case Thermal Resistance Junction-ambient Thermal Resistance Case-sink Maximum Lead Temperature Soldering Purpose oC/W AVALANCHE CHARACTERISTICS Symbo Parameter Avalanche Current, Repetitive Not-Repetitive (pulse width limited max) Single Pulse Avalanche Energy (starting Value Unit ELECTRICAL CHARACTERISTICS (Tcase unless otherwise specified) Symbo (BR)DSS IGSS Parameter Drain-source Breakdown Voltage Test ditions Min. Typ. Max. Unit Rating Zero Gate Voltage Drain Current Rating Gate-body Leakage Current (VDS Symbo GS(th) DS(on) Parameter Gate Threshold Voltage Static Drain-source Resistance State Drain Current Test ditions Min. Typ. Max. Unit ID(o DS(on DYNAMIC Symbo Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Test ditions ID(o DS(on Min. Typ. Max. Unit STD4NC50 ELECTRICAL CHARACTERISTICS (continued) SWITCHING Symbo d(on) Parameter Turn-on Time Rise Time Total Charge Gate-Source Charge Gate-Drain Charge Test ditions (see test circuit, figure Min. Typ. 11.5 Max. Unit SWITCHING Symbo (Voff) Parameter Off-voltage Rise Fall Cross-over Time Test ditions (see test circuit, figure Min. Typ. Max. Unit SOURCE DRAIN DIODE Symbo Parameter Source-drain Current Source-drain Current (pulsed) Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current di/dt A/µs (see test circuit, figure Test ditions Min. Typ. Max. 14.8 Unit Pulsed: Pulse duration duty cycle Pulse width limited safe operating area Safe Operating Area Thermal Impedance STD4NC50 Output Characteristics Transfer Characteristics Transconductance Static Drain-source Resistance Gate Charge Gate-source Voltage Capacitance Variations STD4NC50 Normalized Gate Threshold Voltage Temperature Normalized Resistance Temperature Source-drain Diode Forward Characteristics STD4NC50 Fig. Unclamped Inductive Load Test Circuit Fig. Unclamped Inductive Waveform Fig. Switching Times Test Circuits Resistive Load Fig. Gate Charge test Circuit Fig. Test Circuit Inductive Load Switching Diode Recovery Times STD4NC50 TO-251 (IPAK) MECHANICAL DATA DIM. MIN. 0.45 0.48 15.9 0.95 16.3 0.017 0.019 0.236 0.252 0.173 0.626 0.354 0.031 0.031 0.64 TYP. MAX. 0.85 0.012 0.037 0.023 0.023 0.244 0.260 0.181 0.641 0.370 0.047 0.039 MIN. 0.086 0.035 0.027 0.025 0.204 inch TYP. MAX. 0.094 0.043 0.051 0.031 0.212 0.033 0068771-E STD4NC50 Information furnished believed accurate reliable. However, STMicroelect onics assumes responsibil consequences such information infringement patents other rights third partes which result from use. license granted implication otherwise under patent patent rights STMicroelectro nics. Specific ation mentioned this publication subjec change without notice. This publication supersedes replaces informaton previously supplied. STMicroelectronics products authorized critical components life support devices systems with express written approval STMicroelectronics. logo trademark STMicroelectronics 1999 STMicroelectronics Printed Italy Rights Reserved STMicroelectronics GROUP COMPANIES Australia Brazil Canada China France Germany Italy Japan Korea Malaysi Malta Mexico Morocco Netherlands Singapore Spain Sweden Switzerland Taiwan Thailand United Kingdom U.S.A. http://www.st.com Other recent searchesSSM3K127TU - SSM3K127TU SSM3K127TU Datasheet PS21255-E - PS21255-E PS21255-E Datasheet MN102H00 - MN102H00 MN102H00 Datasheet MAX9617 - MAX9617 MAX9617 Datasheet MAX9620 - MAX9620 MAX9620 Datasheet MAX9619 - MAX9619 MAX9619 Datasheet MAX9618 - MAX9618 MAX9618 Datasheet H133CGGRD-120 - H133CGGRD-120 H133CGGRD-120 Datasheet dsPIC30F5011 - dsPIC30F5011 dsPIC30F5011 Datasheet dsPIC30F5013 - dsPIC30F5013 dsPIC30F5013 Datasheet DR5000 - DR5000 DR5000 Datasheet CDLE-039-087 - CDLE-039-087 CDLE-039-087 Datasheet 1757020000 - 1757020000 1757020000 Datasheet
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