Publication 24228 Revision: Issue Date: January 2003 2002, 2003 A

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Methodologies Measuring Temperature Athlonand DuronProcessors
Publication 24228 Revision: Issue Date: January 2003
2002, 2003 Advanced Micro Devices, Inc. rights reserved. contents this document provided connection with Advanced Micro Devices, Inc. ("AMD") products. makes representations warranties with respect accuracy completeness contents this publication reserves right make changes specifications product descriptions time without notice. license, whether express, implied, arising estoppel otherwise, intellectual property rights granted this publication. Except forth AMD's Standard Terms Conditions Sale, assumes liability whatsoever, disclaims express implied warranty, relating products including, limited implied warranty merchantability, fitness particular purpose, infringement intellectual property right. AMD's products designed, intended, authorized warranted components systems intended surgical implant into body, other applications intended support sustain life, other application which failure AMD's product could create situation where personal injury, death, severe property environmental damage occur. reserves right discontinue make changes products time without notice.
Trademarks AMD, Arrow logo, Athlon, Duron, combinations thereof, trademarks Advanced Micro Devices, Inc. HyperTransport licensed trademark HyperTransport Technology Consortium. Microsoft registered trademark Microsoft Corporation. Other product names used this publication identification purposes only trademarks their respective companies.
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Methodologies Measuring Temperature Athlonand DuronProcessors
Contents
Revision History Introduction Audience Intent Document Life Document. Additional Documents Limitations Disclaimers Ceramic Grid Array (CPGA) Processor Package Organic Grid Array (OPGA) Processor Package Chapter On-Die Thermal Diode With Motherboard Temperature Sensor Method 1-Use Software Utility Method 2-SMBus Evaluation 1.2.1 1.2.2 Chapter Connecting Evaluation On-Board Sensor Reading Temperature
Method 3-Evaluation Verifying On-Die Thermal Diode Results Troubleshooting Tips On-Die Thermal Diode Without Motherboard Temperature Sensor Choosing Temperature Sensor Evaluation Providing Power Evaluation Connecting Evaluation On-Die Thermal Diode Reading Temperature Verifying On-Die Thermal Diode Results Troubleshooting Tips
Contents
Methodologies Measuring Temperature Athlonand DuronProcessors
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Chapter
Indirect Die-Temperature Measurement-Processor Package Thermocouple Routing Thermocouple Wire 3.1.1 3.1.2 Preferred Routing Attachment Alternative Routing Attachment
Chapter Chapter
Processor Placement Socket 3.2.1 Closing Low-Profile Socket (Mobile) Indirect Die-Temperature Measurement-Desktop Indirect Temperature Measurement Steps Heat Sink Installation Ambient Thermocouple Installation Sample Desktop Correlation Indirect Die-Temperature Methods Ceramic Desktop Example Ceramic Grid Array Processors Only Perform Desktop System Measurements Interface Analysis-Post Measurements Heatsink Processor Clean-up Indirect Temperature Measurement-Mobile Mobile System Temperature Measurement Procedures 5.1.1 5.1.2 Preferred Mobile System Temperature Measurement Procedure Alternative Mobile System Temperature Measurement Procedure.
Sample Desktop Correlation Indirect Die-Temperature Methods Ceramic Mobile Example Ceramic Grid Array Processors Only Interface Analysis Clean-up
Contents
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List Figures
Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Maxim 1617A Sensor Connections Maxim 1617A Evaluation Connections.9 On-Die Thermal Diode Traces Connect Wires 2N3904 Transistor Analog Devices 1023 Evaluation Maxim 6654 Evaluation On-Die Thermal Diode Locations Connections Analog 1023 Evaluation Connections Maxim 6654 Evaluation Thermocouple Wire Length.22 Placement Thermocouple Center Package Thermocouple Attached with Kapton Tape.23 Thermocouple Secured with Kapton Tape Bent Alternate Thermocouple Placement.25 Processor Package Thermocouple Ready Insertion into Socket Lowering Processor Package into Socket Processor Package Seated Socket Low-Profile Socket Heatsink with Release Liner Place Bottom Side Views Single-Point Contact-Clip Heatsink Thermocouple Support Wire Thermocouple Centered Above Sample Desktop Correlation-Typical Residual Centered Clip.33 Interface Material After Measurements Single-Sided Mobile Implementation Thermocouple Attached Heatsink Block.39 Sample Mobile Correlation.40
List Figures
Methodologies Measuring Temperature Athlonand DuronProcessors
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List Figures
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Methodologies Measuring Temperature Athlonand DuronProcessors
Revision History
Date December 2002 October 2001 Revision Description Updated Public Release Initial Public Release
Revision History
Methodologies Measuring Temperature Athlonand DuronProcessors
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Revision History
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Introduction
This application note describes repeatable, accurate methodologies measuring processor-die temperature grid array (PGA) packaged Athlonand Duronprocessors desktop mobile personal computers.
Audience
This document intended thermal engineers testing systems based Athlon Duron processors.
Intent Document
This application note describes methodologies measuring processor-die temperature desktop mobile systems using Athlon Duron processors. Separate chapters describe methodology following situations: Processor on-die thermal diode motherboard temperature sensor Processor on-die thermal diode motherboard temperature sensor Measuring temperature indirectly desktop processor without on-die thermal diode Measuring temperature indirectly mobile processor without on-die thermal diode
Life Document
This document valid Athlon Duron processor.
Additional Documents
Thermal, Mechanical, Chassis Cooling Design Guide, order# 23794 Thermal Testing Methodology Characterized Desktop Processors, order# 24362
Introduction
Methodologies Measuring Temperature Athlonand DuronProcessors
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Limitations Disclaimers
These methodologies intended only characterization; they intended production systems. methodologies this document have been successfully tested processors with on-die thermal diode motherboard with on-board temperature sensor. However, methodologies presented provided basis makes express implied warranties effectiveness fitness particular purpose.
Ceramic Grid Array (CPGA) Processor Package
CPGA processor package on-die thermal diode, verify that diode operating correctly, attach thermocouple backside ceramic package described Chapter "Indirect Die-Temperature Measurement-Processor Package Thermocouple." thermal diode available, temperature correlations provided within this document. Note: longer sells ceramic substrate packages. information Chapter Chapter reference should applied organic substrate packages.
Organic Grid Array (OPGA) Processor Package
OPGA processor package on-die thermal diode, thermal diode available, underpackage thermocouple measurement lieu diode measurement. underpackage temperature organic packages used without offset. temperature correlations provided CPGA processors apply OPGA processors.
Introduction
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Chapter
On-Die Thermal Diode With Motherboard Temperature Sensor
This chapter describes three methods temperature measurement grid array (PGA) processor that on-die thermal diode used motherboard that on-board temperature sensor. These methods are: Read on-board temperature sensor with software utility. evaluation read on-board temperature sensor through SMBus. Disconnect traces from on-board temperature sensor read sensor using evaluation kit.
Note: These methods work systems.
Method 1-Use Software Utility
Reading on-board temperature sensor with software easiest method utility available that works with motherboard. However, general purpose utility that works with motherboards currently available. Note: temperature sensor motherboard provide accurate reading thermal diode. sure that on-board temperature sensor uses dual-sourcing currents. Single-sourcing current does provide suitable accuracy thermal testing. motherboard does come with such utility, some other software, such Motherboard Monitor, available http://mbm.livewiredev.com/, read on-board temperature sensor. temperature value displayed BIOS setup screen, this utility typically able find read on-board temperature sensor. Note: Current versions Motherboard Monitor typically work notebook computers. availabe utility works with motherboard, write software that communicates with temperature sensor across SMBus. This method requires that temperature sensor connected SMBus controller. also requires knowledge temperature sensor connected SMBus.
Method 2-SMBus Evaluation
Method Method both allow measuring recording junction temperature onboard temperature sensor accessible through software test computer.
Chapter
On-Die Thermal Diode With Motherboard Temperature Sensor
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read on-board temperature sensor through SMBus, connect evaluation SMBus data, clock, alert pins sensor. This method requires soldering onto small pins. With proper soldering, causes permanent damage motherboard. This method uses evaluation software read temperature sensor motherboard instead temperature sensor evaluation kit. Notes: remove temperature sensor motherboard computer tested. computer start on-board temperature sensor removed. This technique work with implementations on-motherboard temperature sensor. successfully used this technique with Maxim 1617A temperature sensor.
1.2.1
Connecting Evaluation On-Board Sensor
connect evaluation on-board sensor, following: Attach wires clock (SMBCLK SCLK), data (SMBDATA SDATA), ground (GND) pins on-board temperature sensor. Figure shows connections Maxim 1617A thermal sensor, which same Maxim 6654 Analog 1023 sensors. Other temperature sensors have different pinout.
14-SCLK
8-GND 12-SDATA
Figure
Maxim 1617A Sensor Connections
On-Die Thermal Diode With Motherboard Temperature Sensor
Chapter
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Connect clock data wires evaluation kit. Figure shows connections Maxim 1617A Evaluation Kit. Other evaluation kits have similar connections. Note: Maxim 1617A evaluation does require external power; obtains power through parallel port.
Figure
Maxim 1617A Evaluation Connections
minimize noise, connect ground wire GND1 evaluation kit.
1.2.2
Reading Temperature
read temperature, connect evaluation data acquisition computer install software that comes with kit, outlined following steps: Turn evaluation kit, data aquisition computer, test computer. Connect evaluation parallel port data acquisition computer. Turn evaluation data aquisition computer. Install evaluation software data acquisition computer using instructions accompanying software. software works only with evaluation accompanys. Check site evaluation vendor latest version software. Verify evaluation software. (Running software before turning test computer verifies operation remote diode. remote diode temperature should steady near ambient temperature.) Turn test computer. remote temperature should rise immediately. evaluation software provides measurements: local temperature remote. remote temperature temperature processor. local temperature temperature on-board temperature sensor. Chapter On-Die Thermal Diode With Motherboard Temperature Sensor
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Method 3-Evaluation
This method involves disconnecting on-board temperature sensor connecting evaluation directly on-die thermal diode. this method, traces processor thermal diode must accessible bottom surface board. Notes: This method causes permanent damage board. This method possible only both thermal diode traces routed external layer. test system uses processor temperature control cooling fans, those fans must powered externally when using this method because on-board temperature sensor longer measuring temperature. traces both THDA (pin THDC (pin socket pins motherboard, shown Figure thereby disconnecting on-die thermal diode from on-board sensor. Note: only surface traces. Cutting deeply penetrate damage other layers board. Alternatively, unsolder lift thermal diode pins temperature sensor disconnect diode from sensor.
trace trace
Attach wires
Figure
On-Die Thermal Diode Traces Connect Wires
evaluation described Chapter "On-Die Thermal Diode Without Motherboard Temperature Sensor."
On-Die Thermal Diode With Motherboard Temperature Sensor
Chapter
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Some systems boot without diode attached on-board temperature sensor. this case with system under test, connect discrete diode thermal diode pins on-board temperature sensor. Table shows diode wiring assignments 2N3904 transitor 2N3906 transistor. Table
Emitter Collector/Base
Transistor Diode-Wiring Assignments
2N3904 Negative Positive 2N3906 Positive Negative
Diode Connected Transistor
Figure shows 2N3904 transistor TO-92 package.
Figure
2N3904 Transistor
Verifying On-Die Thermal Diode Results
verify results obtained from on-die thermal diode, attach thermocouple backside processor package beneath die. instructions attach measure thermocouple, Chapter "Indirect Die-Temperature Measurement-Processor Package Thermocouple." under-package temperature should read within diode temperature, thermocouple temperature should increase with increasing power similar rate diode temperature. difference between diode underpackage readings large, ensure that there issues with diode measurement, such poor solder joint interference. additional help, "Troubleshooting Tips."
Troubleshooting Tips
This section describes possible solutions common problems. Remote temperature reads 127°C. temperature sense wires reversed. Switch pins which wires connected wire wire U7). On-Die Thermal Diode With Motherboard Temperature Sensor
Chapter
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Remote temperature reading rapidly changes without change processor power. Check that evaluation properly grounded digital ground (Pin processor some other source). voltage difference between digital ground evaluation card should within millivolts Look sources electromagnetic interference, such power supplies, minimize those sources. clean power supply instead switching notebook AC/DC power brick. Remote temperature less than backside package. difference small, check with evaluation manufacturer ensure that proper offset being used. Diode temperature should within package temperature. difference large, then sure that processor thermal diode being read another remote diode evaluation kit. Remote temperature does change with changes processor power. sure that processor thermal diode being read another remote diode evaluation kit. Check other temperature sensors motherboard connected processor thermal diode. Remove wires from evaluation kit. Measure resistance voltage drop across evaluation wires connected diode pins with processor inserted socket. (Use either resistance diode function multimeter). circuit open, then other temperature sensor connected on-die thermal diode. resistance voltage drop present when processor socket, then another device connected processor thermal diode pins.
On-Die Thermal Diode With Motherboard Temperature Sensor
Chapter
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Chapter
On-Die Thermal Diode Without Motherboard Temperature Sensor
This chapter describes temperature measurement methodology grid array (PGA) processor that on-die thermal diode used motherboard that does have on-board temperature sensor.
Choosing Temperature Sensor Evaluation
read temperature from on-die thermal diode, temperature sensor evaluation that been designed read from remote thermal diode. recommends using temperature sensor that sources currents along differential pair wires. dual sourcing current methodology limits impact external noise provides more accurate readings than does single sourcing current methodology. successfully used following evaluation kits with on-die diode: Analog Devices 1023 Evaluation (shown Figure http://www.analog.com/ Maxim 6654 Evaluation (shown Figure page http://www.maxim-ic.com/
Suitable evaluation kits available from other vendors.
Figure
Analog Devices 1023 Evaluation
Chapter
On-Die Thermal Diode Without Motherboard Temperature Sensor
Methodologies Measuring Temperature Athlonand DuronProcessors
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Power Supply Connections
Figure
Maxim 6654 Evaluation
Providing Power Evaluation
Analog 1023 receives power from parallel port does require external power source. Maxim 6654 only, attach external power source evaluation board shown Figure
Connecting Evaluation On-Die Thermal Diode
Connect evaluation on-die thermal diode, using high-quality shielded twisted-pair wire. resistance wire offsets temperature measurement °C/, depending temperature sensor used. Attach temperature sense wires socket pins. THDA (Pin (Analog 1023) (Maxim 6654) (Pin other pin) THDC (Pin (Analog 1023) (Maxim 6654) pins locations Figure page shows locations (+), (GND), pins.
On-Die Thermal Diode Without Motherboard Temperature Sensor
Chapter
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(GND)
Figure
On-Die Thermal Diode Locations
Connect digital ground system evaluation using (Pin T6). Note: Connecting system digital ground (pin VSS) evaluation using (Pin reduces impact external noise temperature measurements. Attach temperature sense wires evaluation kit.
Chapter
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Table Figure Figure show connect temperature sense wires evaluation kit. Table Temperature Sense Wire Connections
Signal Name THDA THDC Analog 1023 Connection* Maxim 6654 Connection
Location (GND)
Note: *Attach wires Analog 1023 using wire block. Analog 1023 Kit, Switch (SW1) position, shown Figure Maxim 6654 Kit, trace, shown Figure
Wire Block Position
Positive Terminal (D+)
Negative Terminal (D-)
Ground Terminal (GND)
Figure
Connections Analog 1023 Evaluation
On-Die Thermal Diode Without Motherboard Temperature Sensor
Chapter
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Ground Terminal (GND)
Trace
Positive Terminal (DXP) Negative Terminal (DXN)
Figure
Connections Maxim 6654 Evaluation
Refer evaluation documentation specific usage instructions.
Reading Temperature
read temperature, connect evaluation data acquisition computer install software that comes with kit, outlined following steps: Turn evaluation kit, data aquisition computer, test computer. Connect evaluation parallel port data acquisition computer. Turn evaluation data aquisition computer. Install evaluation software data acquisition computer using instructions accompanying software. software works only with evaluation accompanys. Check site evaluation vendor latest version software. Verify evaluation software. (Running software before turning test computer verifies operation remote diode. remote diode temperature should steady near ambient temperature.) Turn test computer. remote diode temperature should rise immediately. evaluation software provides measurements-local temperature remote. temperature sensor chip local temperature package (Analog 1023, Maxim 6654, etc.). evaluation properly connected processor, remote temperature temperature processor thermal diode. Check installation evaluation sure remote temperature coming from diode evaluation kit. Chapter On-Die Thermal Diode Without Motherboard Temperature Sensor
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variations temperature sensor designs, necessary account small offset. Contact manufacturer temperature sensor information whether offsets needed. necessary, correct temperature measurement offset.
Verifying On-Die Thermal Diode Results
verify results obtained from on-die thermal diode, attach thermocouple backside processor package beneath die. instructions attach measure thermocouple, Chapter "Indirect Die-Temperature Measurement-Processor Package Thermocouple." under-package temperature should read within diode temperature, thermocouple temperature should increase with increasing power similar rate diode temperature. difference between diode underpackage readings large, ensure that there issues with diode measurement, such poor solder joint interference. additional help, "Troubleshooting Tips."
Troubleshooting Tips
This section describes possible solutions common problems. Remote temperature reads 127°C. temperature sense wires reversed. Switch pins which wires connected wire wire U7). Remote temperature reading rapidly changes without change processor power. Check that evaluation properly grounded digital ground (Pin processor some other source). voltage difference between digital ground evaluation card should within millivolts Look sources electromagnetic interference, such power supplies, minimize those sources. clean power supply instead switching notebook AC/DC power brick. Remote temperature less than backside package. difference small, check with evaluation manufacturer ensure that proper offset being used. Diode temperature should within package temperature. difference large, then sure that processor thermal diode being read another remote diode evaluation kit. Remote temperature does change with changes processor power. sure that processor thermal diode being read another remote diode evaluation kit. Check other temperature sensors motherboard connected processor thermal diode. Remove wires from evaluation kit.
On-Die Thermal Diode Without Motherboard Temperature Sensor
Chapter
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Measure resistance voltage drop across evaluation wires connected diode pins with processor inserted socket. (Use either resistance diode function multimeter). circuit open, then other temperature sensor connected on-die thermal diode. resistance voltage drop present when processor socket, then another device connected processor thermal diode pins.
Chapter
On-Die Thermal Diode Without Motherboard Temperature Sensor
Methodologies Measuring Temperature Athlonand DuronProcessors
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Chapter
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Chapter
Indirect Die-Temperature Measurement-Processor Package Thermocouple
systems without on-die thermal diode, temperature must measured indirectly. temperature calculated from package temperature either ambient temperature above inlet side heatsink heatsink block temperature. Chapter "Indirect Die-Temperature Measurement-Desktop" contains procedure attaching thermocouple read ambient temperature above inlet side heatsink fan. Chapter "Indirect Temperature Measurement-Mobile" contains procedures attaching thermocouple read heatsink block temperature. This chapter describes procedures attaching thermocouple back side grid array (PGA) processor that does have on-die thermal diode. This method involves attaching thermocouple directly processor package. this method, 36-gauge smaller thermocouple (T/C). twist exposed wire thermocouple. proper thermocouple usage, should welded together only with thermocouple fine wire welder. When completed, there should more than exposed wire.
Routing Thermocouple Wire
There ways route thermocouple wire. preferred method thread wire under socket. alternative method route wire between pins processor package that ends between processor package socket. alternative method only unable thread wire under socket.
3.1.1
Preferred Routing Attachment
Thread thermocouple (T/C) wire between motherboard socket along line shown Figure page until reaches open area middle socket. Pull enough wire through ease attachment thermocouple backside processor package, shown Figure page Measure mark center processor package with pencil. calipers assist finding center package. sure thermocouple clean. Figure page Note wire package orientation; there corner pins left side. Chapter Indirect Die-Temperature Measurement-Processor Package Thermocouple
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Position thermocouple bead over center mark processor package. Note: accurate temperature measurements, critical that thermocouple bead exact center package. Clean surface package where bead located with isopropyl alcohol acetone. Attach thermocouple package with small piece Kapton tape, shown Figure page Press tape down near thermocouple bead with dull instrument. place tape, thermal epoxy. Note: accurate temperature measurements, thermocouple bead must contact with package surface. Apply additional tape prevent thermocouple from moving. tape corner; leave some room. Figure page Bend thermocouple gently allow wire follow smooth path when placed socket. Figure page Note: careful kink sharply bend thermocouple wire. Figure shows path between motherboard socket along which thermocouple threaded.
Thread wire between pins along this line.
Figure Thermocouple Wire Length Indirect Die-Temperature Measurement-Processor Package Thermocouple Chapter
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Figure shows placement thermocouple center processor die.
Figure Placement Thermocouple Center Package Figure shows thermocouple attached processor with Kapton tape.
Figure Thermocouple Attached with Kapton Tape
Chapter Indirect Die-Temperature Measurement-Processor Package Thermocouple
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Figure shows thermocouple secured processor with additional Kapton tape. thermocouple also bent follow smooth path when placed socket.
Figure Thermocouple Secured with Kapton Tape Bent
3.1.2
Alternative Routing Attachment
alternative method route thermocouple wire between pins processor package that ends between processor package socket. this alternative method only wire cannot threaded under socket. This method often useful low-profile sockets used mobile applications. Remove Teflon insulation surrounding both thermocouple wires; remove insulation from each individual wire. insulation removed ensure that processor seated properly socket. Attach thermocouple back processor shown steps through "Preferred Routing Attachment" page 21". Place thermocouple wires between processor pins shown Figure page After processor installation, thermocouple wires located between processor socket.
Indirect Die-Temperature Measurement-Processor Package Thermocouple Chapter
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Figure shows alternate placement thermocouple wires between processor pins.
Thermocouple Wires
Figure Alternate Thermocouple Placement
Processor Placement Socket
After thermocouple been attached back processor package, package inserted into socket. Figure shows relative position thermocouple wire "escape" route wire location back processor package.
processor will rotated about edge before insertion.
Figure Processor Package Thermocouple Ready Insertion into Socket
Chapter Indirect Die-Temperature Measurement-Processor Package Thermocouple
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Lower processor package slowly onto socket. Pull thermocouple wire carefully back through socket, removing excess wire slack processor slowly lowered into position. allow thermocouple wire pinched between processor package socket, pull thermocouple wire hard undo tape securing wire processor package. Figure shows processor package being lowered into socket.
Figure Lowering Processor Package into Socket Insert processor into socket. processor package should flat socket with between bottom package socket. Lower cam-lever lock processor package into socket. Clean processor carefully, using lint free cloth dipped isopropyl alcohol. Tape wire near socket stress relief. Figure page shows processor package seated socket thermocouple wire extending from between socket motherboard.
Indirect Die-Temperature Measurement-Processor Package Thermocouple Chapter
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Tape wire here stress relief.
Figure Processor Package Seated Socket
3.2.1
Closing Low-Profile Socket (Mobile)
Low-profile sockets have lever close socket, instead, socket actuated using flat-head screwdriver. Some sockets have screwdriver contact socket that contacts package distribute load. sockets without this feature, distribute actuation load prevent damaging package. screwdriver should contact processor package when closing socket. Figure shows low-profile socket being closed with screwdriver.
Screwdriver contacts socket.
Screwdriver closes socket.
Figure Low-Profile Socket
Chapter Indirect Die-Temperature Measurement-Processor Package Thermocouple
Methodologies Measuring Temperature Athlonand DuronProcessors
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Chapter
Indirect Die-Temperature Measurement-Desktop
This chapter describes method indirect temperature measurement grid array (PGA) processor desktop form factor that does have on-die thermal diode used motherboard that does have on-board temperature sensor.
Indirect Temperature Measurement Steps
Attach thermocouple under ceramic package install processor described Chapter "Indirect Die-Temperature Measurement-Processor Package Thermocouple." Install heat sink. ambient thermocouple. Measure under ceramic ambient temperatures. Find temperature using desktop correlation ceramic grid array.
Heat Sink Installation
heatsink described this section release liner protecting phase-change interface material. Figure page shows release liner place. Other heatsinks differ appearance.
Chapter
Indirect Die-Temperature Measurement-Desktop
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Figure Heatsink with Release Liner Place Figure shows bottom side views single-point contact-clip heatsink.
Bottom-view showing phase-change interface material without release liner.
Side-view showing step cam-box clearance
Side-view showing support pads that prevent unclipped heatsink from touching die.
Figure Bottom Side Views Single-Point Contact-Clip Heatsink Indirect Die-Temperature Measurement-Desktop Chapter
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Follow these steps install heatsink. Remove release liner from interface material with quick pull from heat sink base. Attach clip non-cam side socket. Attach clip cam-side socket using small screwdriver. Position clip over socket with screwdriver. Pull screwdriver back push down install clip socket tab.
Ambient Thermocouple Installation
record ambient temperature, thermocouple must installed above inlet side heatsink fan. thermocouple wire must supported stiff bendable support wire. Attach support wire with tape convenient surface heatsink. interfere with natural airflow heatsink. Bend support wire locate thermocouple bead approximately 0.75 inch inch above surface inlet side fan. This location avoids dead zone air. Tape thermocouple wire support wire that thermocouple centered above hub. side-mounted fans, thermocouple should mounted inlet side centered relative hub.
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Figure shows support wire attached heatsink.
Figure Thermocouple Support Wire Figure shows thermocouple centered above hub.
Figure Thermocouple Centered Above
Indirect Die-Temperature Measurement-Desktop
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Sample Desktop Correlation Indirect DieTemperature Methods Ceramic
Figure shows example desktop correlation indirect die-temperature methods ceramic grid array (CPGA) processors. This example applies only CPGA processors reference only. measurements were performed interface attachment thermal test vehicle natural convection environment. Power varied create correlation. interface material used Chometrics T725. asymmetric single-point clip used loading. centered-diode locations; edge toward CAM.
Figure Sample Desktop Correlation-Typical Residual Centered Clip
Chapter
Indirect Die-Temperature Measurement-Desktop
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Desktop Example Ceramic Grid Array Processors Only
1.209 ceramic 1.3778
formula Equation calculate temperature processor die.
Where Tamb ambient temperature, local heatsink measurement inlet temperature before fan.), Tceramic temperature measured back side processor. example, measurement Tceramic Tamb From Equation above, 1.209 1.3778 Therefore, This example shows offset from ceramic temperature temperature particular offset will vary depending processor power particular thermal performance heatsink used. Compare Tdie determined Equation temperature specification processor under test, ensure that system does allow processor operate over temperature rating.
Perform Desktop System Measurements
information perform desktop system thermal measurements, Thermal Testing Methodology Characterized Desktop Processors Application Note, order# 24362.
Interface Analysis-Post Measurements
Remove heatsink compare interface material bottom heatsink with that processor die. interface thickness should uniform, with voids should matching excess material other. interface material more transparent side, then clip load have been applied center die.
Indirect Die-Temperature Measurement-Desktop
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Figure shows heatsink processor like sandwich that been "unfolded" along hinge line.
Figure Interface Material After Measurements
Heatsink Processor Clean-up
After measurements have been taken interface material should cleaned from heatsink processor. bulk material will heatsink scraped with plastic scraper edge printed circuit board. careful aluminum surface heatsink. alcohol remove remaining interface material from heatsink. Very carefully clean surface processor with alcohol. remove support pads contaminate them with solvent.
Chapter
Indirect Die-Temperature Measurement-Desktop
Methodologies Measuring Temperature Athlonand DuronProcessors
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Indirect Die-Temperature Measurement-Desktop
Chapter
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Chapter
Indirect Temperature Measurement-Mobile
This chapter describes method indirect temperature measurement grid array (PGA) processor mobile form factor that does have on-die thermal diode used motherboard that does have on-board temperature sensor. This mobile system temperature measurement methodology been verified single-sided thermal implementations that contact back side ceramic grid array (PGA) processor. back-side ceramic temperature referenced temperature measurement heatsink block, about above surface. Figure shows single-sided mobile implementation.
Figure Single-Sided Mobile Implementation This methodology does apply dual-sided ceramic designs where design aluminum block direct contact with underside ceramic package remove heat heatsink below motherboardas well heat block contacting back processor die. Also, this methodology inappropriate organic processors. This methodology intended system characterization. intended production measurement method controlling temperature processor.
Mobile System Temperature Measurement Procedures
There ways measure temperature mobile system. preferred method involves drilling hole heatsink block which thermocouple placed. alternative method attach thermocouple side heatsink block that contacts processor die. alternative method only heatsink block cannot drilled.
Chapter
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5.1.1
Preferred Mobile System Temperature Measurement Procedure
heatsink block drilled, following temperature measurement procedure. Attach thermocouple bottom ceramic package same fashion previously shown Chapter "Indirect Die-Temperature Measurement-Processor Package Thermocouple." Insert thermocouple into heatsink block. Drill above position that directly over center processor. 0.053" diameter drill bit, comparable substitute. Measure verify depth position hole. Fill hole with high conductivity thermal grease. Mark thermocouple wire depth needed reach hole directly over center processor. Insert thermocouple into hole. Ensure that thermocouple reaches depth hole directly over center processor checking mark thermocouple wire. Thermal, Mechanical, Chassis Cooling Design Guide, order# 23794, more details. Record backside ceramic heatsink block temperatures during system characterization. Calculate temperature using correlation equations.
5.1.2
Alternative Mobile System Temperature Measurement Procedure.
heatsink block cannot drilled, following temperature measurement procedure. Attach thermocouple heatsink block side that contacts processor die. Route thermocouple out, that does interfere with components processor package.
Indirect Temperature Measurement-Mobile
Chapter
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Figure shows thermocouple attached outside heatsink block.
Figure Thermocouple Attached Heatsink Block
Chapter
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Sample Desktop Correlation Indirect DieTemperature Methods Ceramic
Figure shows example mobile correlation indirect die-temperature methods ceramic grid array (CPGA) processors. This example applies only CPGA processors reference only. measurements were performed interface attachment thermal test vehicle. Power varied create correlation. interface material used Chometrics T725.
Figure Sample Mobile Correlation
Indirect Temperature Measurement-Mobile
Chapter
24228
Rev. January 2003
Methodologies Measuring Temperature Athlonand DuronProcessors
Mobile Example Ceramic Grid Array Processors Only
1.6894 ceramic heatsink block heatsink block
formula Equation calculate temperature processor die.
Where Theatsink bloc temperature heatsink block, Tceramic temperature measured back side ceramic package. example, measurement Tceramic Theatsink block From Equation above, 1.6894 Therefore, This example shows offset from ceramic temperature temperature This offset will vary depending processor power actual thermal performance heatsink. Compare this number temperature specification processor being tested, ensure that system does allow processor operate over temperature rating.
Interface Analysis Clean-up
Remove heatsink compare interface material bottom heatsink with that processor die. interface thickness should uniform, with voids should matching excess material other. After measurements have been taken interface material should cleaned from heatsink processor. bulk material will heatsink scraped with plastic scraper edge printed circuit board. careful aluminum surface heatsink. alcohol remove remaining interface material from heatsink. Very carefully clean surface processor with alcohol. remove support pads contaminate them with solvent.
Chapter
Indirect Temperature Measurement-Mobile
Methodologies Measuring Temperature Athlonand DuronProcessors
24228
Rev. January 2003
Indirect Temperature Measurement-Mobile
Chapter

Publication 24228 Revision: Issue Date: January 2003 2002, 2003 A

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