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CHANNEL 0.012 TO-252 STripFETPOWER MOSFET TYPE STD40NE03L DS
Top Searches for this datasheetSTD40NE03L CHANNEL 0.012 TO-252 STripFETPOWER MOSFET TYPE STD40NE03L DS(o 0.016 TYPICAL RDS(on) 0.012 EXCEPTIONAL dv/dt CAPABILITY 100% AVALANCHE TESTED GATE CHARGE APPLICATION ORIENTED CHARACTERIZATION SUFFIX "T4" ORDERING TAPE REEL DESCRIPTION This Power MOSFET latest development STMicroelectronics unique "Single Feature SizeTM" strip-based process. resulting transistor shows extremely high packing density on-resistance, rugged avalanche characteristics less critical alignment steps therefore remarkable manufacturing reproducibility. APPLICATIONS HIGH CURRENT, HIGH SPEED SWITCHING SOLENOID RELAY DRIVERS MOTOR CONTROL, AUDIO AMPLIFIERS DC-DC DC-AC CONVERTERS DPAK TO-252 (Suffix "T4") INTERNAL SCHEMATIC DIAGRAM ABSOLUTE MAXIMUM RATINGS Symb Parameter Drain-source Voltage (VGS Drain- gate Voltage ate-source Voltage Drain Current (continuous) Drain Current (continuous) Drain Current (pulsed) otal Dissipation Derating Factor Peak Diode Recovery voltage slope Storage Temperature Max. Operating Junction Temperature Value 20** 20** 0.37 20A, di/dt A/µs, V(BR)DSS, TJMAX Unit V/ns Pulse width limited safe operating area (**) Value limi only package September 1999 STD40NE03L THERMAL DATA j-pc -amb hj-s Thermal Resistance Junction-PC Board Thermal Resistance Junction-ambient Thermal Resistance Case-sink Maximum Lead Temperature Soldering Purpose AVALANCHE CHARACTERISTICS Symbo Parameter Avalanche Current, Repetitive Not-Repetitive (pulse width limited max) Single Pulse Avalanche Energy (starting Value Unit ELECTRICAL CHARACTERISTICS (Tcase unless otherwise specified) Symbo (BR)DSS IGSS Parameter Drain-source Breakdown Voltage Test ditions Min. Typ. Max. Unit Rating Zero Gate Voltage Drain Current Rating Gate-body Leakage Current (VDS Symbo GS(th) DS(on) Parameter Gate Threshold Voltage Static Drain-source Resistance State Drain Current Test ditions Min. Typ. 0.012 Max. 0.016 0.022 Unit ID(o DS(on DYNAMIC Symbo Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Test ditions ID(o DS(on Min. Typ. 2200 Max. Unit STD40NE03L ELECTRICAL CHARACTERISTICS (continued) SWITCHING Symbo d(on) Parameter Turn-on Delay Rise Time Total Charge Gate-Source Charge Gate-Drain Charge Test ditions (Resistive Load, fig. Min. Typ. Max. Unit SWITCHING Symbo d(of (Voff) Parameter Turn-off Delay Fall Off-voltage Rise Fall Cross-over Time Test ditions (Resistive Load, fig. (Induct Load, fig. Min. Typ. Max. Unit SOURCE DRAIN DIODE Symbo Parameter Source-drain Current Source-drain Current (pulsed) Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current di/dt A/µs (see test circuit, fig. Test ditions Min. Typ. Max. Unit Pulsed: Pulse duration duty cycle Pulse width limited safe operating area Safe Operating Area Thermal Impedance STD40NE03L Output Characteristics Transfer Characteristics Transconductance Static Drain-source Resistance Gate Charge Gate-source Voltage Capacitance Variations STD40NE03L Normalized Gate Threshold Voltage Temperature Normalized Resistance Temperature Source-drain Diode Forward Characteristics STD40NE03L Fig. Unclamped Inductive Load Test Circuit Fig. Unclamped Inductive Waveform Fig. Switching Times Test Circuits Resistive Load Fig. Gate Charge test Circuit Fig. Test Circuit Inductive Load Switching Diode Recovery Times STD40NE03L TO-252 (DPAK) MECHANICAL DATA MIN. 0.03 0.64 0.45 0.48 9.35 0.023 TYP. MAX. 0.23 10.1 MIN. 0.086 0.035 0.001 0.025 0.204 0.017 0.019 0.236 0.252 0.173 0.368 0.031 0.039 inch TYP. MAX. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.260 0.181 0.397 DIM. DETAIL DETAIL 0068772-B STD40NE03L Information furnished believed accurate reliable. However, STMicroelect onics assumes responsibil consequences such information infringement patents other rights third partes which result from use. license granted implication otherwise under patent patent rights STMicroelectro nics. Specific ation mentioned this publication subjec change without notice. This publication supersedes replaces informaton previously supplied. STMicroelectronics products authorized critical components life support devices systems with express written approval STMicroelectronics. logo trademark STMicroelectronics 1999 STMicroelectronics Printed Italy Rights Reserved STMicroelectronics GROUP COMPANIES Australia Brazil China Finland France Germany Hong Kong India Italy Japa Malaysia Malta Morocco Singapore Spain Sweden Switzerland United Kingdom U.S.A. http://www.st.com Other recent searchesVCO190-2453T - VCO190-2453T VCO190-2453T Datasheet SY89202U - SY89202U SY89202U Datasheet SPL300CWAG3KH - SPL300CWAG3KH SPL300CWAG3KH Datasheet MG400Q1US65H - MG400Q1US65H MG400Q1US65H Datasheet KA78LXXA - KA78LXXA KA78LXXA Datasheet KA78L05AA - KA78L05AA KA78L05AA Datasheet ISO9002 - ISO9002 ISO9002 Datasheet EMW576P - EMW576P EMW576P Datasheet
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