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M3D088 PMBD2837; PMBD2838 High-speed double diodes Product s


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book, halfpage
M3D088
PMBD2837; PMBD2838 High-speed double diodes
Product specification Supersedes data April 1996 1996
Philips Semiconductors
Product specification
High-speed double diodes
FEATURES Small plastic package High switching speed: max. Continuous reverse voltage: max. respectively Repetitive peak reverse voltage: max. respectively Repetitive peak forward current: max.
handbook, columns
PMBD2837; PMBD2838
PINNING MARKING CODE DESCRIPTION anode (a1) anode (a2) common cathode
MARKING TYPE NUMBER PMBD2837 PMBD2838
APPLICATIONS High-speed switching e.g. surface mounted circuits. DESCRIPTION PMD2837, PMD2838 consist high-speed switching diodes with common cathodes, fabricated planar technology, encapsulated small plastic SOT23 packages.
view
MAM108
Fig.1 Simplified outline (SOT23) symbol.
1996
Philips Semiconductors
Product specification
High-speed double diodes
LIMITING VALUES accordance with Absolute Maximum Rating System (IEC 134). SYMBOL diode VRRM repetitive peak reverse voltage PMBD2837 PMBD2838 continuous reverse voltage PMBD2837 PMBD2838 continuous forward current PARAMETER CONDITIONS
PMBD2837; PMBD2838
MIN.
MAX.
UNIT
single diode loaded; Fig.2; note double diode loaded; Fig.2; note
IFRM IFSM
repetitive peak forward current non-repetitive peak forward current square wave; prior surge; Fig.4 t=1s
+150
Ptot Tstg Note
total power dissipation storage temperature junction temperature
Tamb note
Device mounted printed-circuit board.
1996
Philips Semiconductors
Product specification
High-speed double diodes
ELECTRICAL CHARACTERISTICS unless otherwise specified. SYMBOL diode forward voltage Fig.3 reverse current PMBD2837 PMBD2838 diode capacitance reverse recovery time Fig.5 MHz; Fig.6 PARAMETER CONDITIONS
PMBD2837; PMBD2838
MIN.
MAX.
UNIT
1.25
when switched from measured Fig.7 when switched from Fig.8
forward recovery voltage
1.75
THERMAL CHARACTERISTICS SYMBOL j-tp Note Device mounted printed-circuit board. PARAMETER thermal resistance from junction tie-point thermal resistance from junction ambient note CONDITIONS VALUE UNIT
1996
Philips Semiconductors
Product specification
High-speed double diodes
GRAPHICAL DATA
PMBD2837; PMBD2838
(mA)
MBD033
handbook, halfpage
MBG382
(mA)
single diode loaded
double diode loaded
Device mounted printed-circuit board.
typical values. typical values. maximum values.
Fig.2
Maximum permissible continuous forward current function ambient temperature.
Fig.3
Forward current function forward voltage.
handbook, full pagewidth IFSM
MBG704
10-1
(µs)
Based square wave currents. prior surge.
Fig.4 Maximum permissible non-repetitive peak forward current function pulse duration.
1996
Philips Semiconductors
Product specification
High-speed double diodes
PMBD2837; PMBD2838
handbook, halfpage (nA)
MBG375
handbook, halfpage
MBG446
(pF)
(oC)
maximum values. typical values. typical values.
MHz;
Fig.5
Reverse current function junction temperature.
Fig.6
Diode capacitance function reverse voltage; typical values.
1996
Philips Semiconductors
Product specification
High-speed double diodes
PMBD2837; PMBD2838
handbook, full pagewidth
D.U.T. SAMPLING OSCILLOSCOPE
MGA881
input signal
output signal
Fig.7 Reverse recovery voltage test circuit waveforms.
D.U.T.
OSCILLOSCOPE
MGA882
input signal
output signal
Fig.8 Forward recovery voltage test circuit waveforms.
1996
Philips Semiconductors
Product specification
High-speed double diodes
PACKAGE OUTLINE
PMBD2837; PMBD2838
full pagewidth
0.150 0.090 0.95 0.48 0.38 VIEW
0.55 0.45
MBC846
Dimensions
Fig.9 SOT23.
DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values Limiting values given accordance with Absolute Maximum Rating System (IEC 134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections specification implied. Exposure limiting values extended periods affect device reliability. Application information Where application information given, advisory does form part specification. LIFE SUPPORT APPLICATIONS These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips customers using selling these products such applications their risk agree fully indemnify Philips damages resulting from such improper sale. This data sheet contains target goal specifications product development. This data sheet contains preliminary data; supplementary data published later. This data sheet contains final product specifications.
1996

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