Power Amplifier Module Mobile Phone ADE-208-097A Edition July 199

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

Power Amplifier Module Mobile Phone ADE-208-097A Edition July 199

Datasheet Thumbnail

Top Searches for this datasheet

PF0121
Power Amplifier Module Mobile Phone
ADE-208-097A Edition July 1996 Application
CLASS2
Features
power control current: High speed switching: µsec Wide power control range:
Arrangement
RF-B2 VAPC Pout
PF0121
Internal Diagram External Circuit
Pin1 Pin2 VAPC Pin3 Pin4 Pout
VAPC
Pout
0.01 (Ceramic chip capacitor) (Aluminum Electrolyte Capacitor) Ferrite bead BL01RN1-A62-001 (Manufacture: MURATA) equivalent (Microstrip line)
Absolute Maximum Ratings 25°C)
Item Supply voltage Supply current voltage Input power Operating case temperature Storage temperature Symbol VAPC (op) Tstg Rating +110 +110 Unit
PF0121
Electrical Characteristics 25°C)
Item Drain cutoff current Total efficiency harmonic distortion harmonic distortion Input VSWR Output power Output power Isolation Switching time Stability Symbol H.D. H.D. Unit 12.5 VAPC 25°C 10.3V, VAPC 80°C 12.5 VAPC 25°C 12.5 Pout 25°C 12.5 Pout controlled), 25°C, Output VSWR 20:1 phases Test Condition VAPC 12.5 Pout controlled), 25°C
VSWR (in) Pout Pout
parasitic oscillation
Test System Diagram
Power Meter L.P.F
VAPC Spectrum Analyzer Test Fixture Directional Coupler Directional Coupler
Power Meter
Phase Shifter
Short
PF0121
Switching Time Test Diagram
VDD=12.5 f=10 D.U.T Pout 1SS106 Z=50 1SS106 Power Meter VAPC Duty=1/8
VAPC
100p Oscillo Scope Vout
Vout
PF0121
Test Fixture Pattern
Unit:
26.5 2.88 2.88
VAPC
2.88
Grass Epoxy Double sided 4.8) C1=0.01µF (Ceramic Chip Capacitor) C2=330µF (Aluminum Electrolyte Capacitor) L1=L2 BLO2RN1-R62 (Manufacturer MURATA) equivalent (Ferrite Bead Inductor) coefficient line loss P.C.B showed bellow. (S21)2 (0.9805)2 1.068
Mechanical Characteristics
Item Torque screw heatsink flange Warp size heatsink flange: Conditions Screw Bolts Spec +0.3/-0
16.5
2.88
PF0121
Note
Unevenness distortion surface heatsink attached module should less than 0.05 should existed dust between module heatsink. MODULE should separated from less than Soldering temperature soldering time should less than 230°C, sec. (Soldering position spaced from root point lead frame: Recommendation thermal joint compounds TYPE G746. (Manufacturer: Shin-Etsu Chemical, Co., Ltd.) protect devices from electro-static damage, soldering iron, measuring-equipment human body etc. should grounded. Torque screw heatsink flange should with screw bolts. Don't solder flange directly. should make lead frame straight possible. module should screwed before lead soldering. should given mechanical thermal stress lead flange module. When external parts (Isolator, Duplexer, etc.) module changed, electrical characteristics should evaluated enough. Don't washing module except lead pins. good stability, ground impedance between module flange pattern should designed possible.
PF0121
Characteristic Curves
VAPC, VSWR (in) f=890 MHz, Pin=2 Pout=13 Tc=25°C, Rg=Rl=50 Voltage VAPC Efficiency Efficiency
V.S.W.R. (in)
VAPC
VSWRin
Supply Voltage VAPC, VSWR (in) f=915 MHz, Pin=2 Pout=13 Tc=25°C, Rg=Rl=50 Voltage VAPC
V.S.W.R. (in)
VAPC
VSWRin
Supply Voltage
PF0121
Pout VAPC VDD=12.5 =15.6 25°C 10.8 15.6 12.5 10.8 Pout Voltage VAPC Pout VAPC 25°C VDD=15.6 VDD=15.6 12.5 10.8 12.5 10.8 Pout Voltage VAPC Output Power Pout
Efficiency
Efficiency
Output Power Pout
PF0121
VAPC, VSWR (in) f=890 MHz, VDD=12.5 Pout=13 Tc=25°C, Rg=Rl=50 Voltage VAPC Efficiency Efficiency
V.S.W.R. (in)
VAPC
VSWRin
Input Power (mW) VAPC, VSWR (in) f=915 MHz, VDD=12.5 Pout=13 Tc=25°C, Rg=Rl=50 Voltage VAPC
V.S.W.R. (in)
VAPC VSWRin
Input Power (mW)
PF0121
VAPC, VSWR (in) Frequency Pin=2 VDD=12.5 Pout=13 Tc=25°C, Rg=Rl=50 Voltage VAPC Efficiency
V.S.W.R. (in)
VAPC VSWRin
Frequency (MHz)
PF0121
Package Dimensions
Unit:
12.7
11.0
60.5 57.5
R1.6
13.0
Hitachi Code JEDEC EIAJ Weight (reference value) RF-B2
0.25
22.0
49.8
6.35
Cautions
Hitachi neither warrants grants licenses rights Hitachi's third party's patent, copyright, trademark, other intellectual property rights information contained this document. Hitachi bears responsibility problems that arise with third party's rights, including intellectual property rights, connection with information contained this document. Products product specifications subject change without notice. Confirm that have received latest product standards specifications before final design, purchase use. Hitachi makes every attempt ensure that products high quality reliability. However, contact Hitachi's sales office before using product application that demands especially high quality reliability where failure malfunction directly threaten human life cause risk bodily injury, such aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment medical equipment life support. Design your application that product used within ranges guaranteed Hitachi particularly maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions other characteristics. Hitachi bears responsibility failure damage when used beyond guaranteed ranges. Even within guaranteed ranges, consider normally foreseeable failure rates failure modes semiconductor devices employ systemic measures such failsafes, that equipment incorporating Hitachi product does cause bodily injury, fire other consequential damage operation Hitachi product. This product designed radiation resistant. permitted reproduce duplicate, form, whole part this document without written approval from Hitachi. Contact Hitachi's sales office questions regarding this document Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
NorthAmerica http:semiconductor.hitachi.com/ Europe Asia (Singapore) Asia (Taiwan) Asia (HongKong) Japan further information write
Hitachi Semiconductor (America) Inc. East Tasman Drive, Jose,CA 95134 Tel: (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9180-0 Fax: <49> (89) Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office Hung Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> 2718-3666 Fax: <886> 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Tsui, Kowloon, Hong Kong Tel: <852> 9218 Fax: <852> 0281 Telex: 40815 HITEC
Copyright Hitachi, Ltd., 1999. rights reserved. Printed Japan.

Power Amplifier Module Mobile Phone ADE-208-097A Edition July 199

Top Searches for this datasheet

Other recent searches