Semiconductor MSC7166 16-Bit Grid Driver with 16-Decoder Thi
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E2C0032-27-Y2 Semiconductor
Semiconductor MSC7166
16-Bit Grid Driver with 16-Decoder
This version: Nov. 1997 MSC7166 Previous version: Jul. 1996
GENERAL DESCRIPTION
MSC7166 driver designed directly drive grids vacuum fluorescent display tube. Since this built-in 16-line decoder output circuits, signal device MSC7166 replace following three: devices either MSL912 MSL918 device either MSM4514 MSM74HC4514. Setting DUTY level makes driver outputs "L". Blanking using this function.
FEATURES
Logic supply voltage Driver supply voltage Driver output current directly connected display tube without pull-down resistor Built-in 16-line decoder Brightness adjusted DUTY Package 24-pin plastic (SOP24-P-430-1.27-K) (Product name: MSC7166GS-K)
Semiconductor
MSC7166
BLOCK DIAGRAM
DISP(+) SEL0 SEL1 SEL2 DECODER SEL3 DUTY GRID GRID GRID GRID GRID GRID GRID GRID GRID GRID10 GRID11 GRID12 GRID13 GRID14 GRID15 GRID16
Semiconductor
MSC7166
INPUT OUTPUT CONFIGURATION
Schematic Diagram Logic Input Circuit
Input
Schematic Diagram Driver Output Citcuit
VDISP(+) VDISP(+)
Output
Semiconductor
MSC7166
CONFIGURATION (TOP VIEW)
GRID GRID GRID GRID GRID GRID GRID GRID GRID GRID10 GRID11 GRID12
DUTY VDISP(+) GRID GRID GRID GRID
24-pin Plastic
DESCRIPTIONS
Symbol SEL0-3 Type 16-line decoder input pins. input 4-bit binary signals converted into hexadecimal signals, then output through driver output pins. DUTY Duty control signal input pin. Setting this makes driver outputs "L", this used brightness control. GRID1-16 High withstand voltage driver output pins driving fluorescent display tube. These pins directly connected grid fluorescent display tude without pull-down resistor. VDISP(+) Power supply fluorescent display tube driver circuit. Logic power supply pin. Ground pin. Description
Semiconductor
MSC7166
ABSOLUTE MAXIMUM RATINGS
Parameter Logic Supply Voltage Driver Supply Voltage Input Voltage Power Dissipation Thermal Resistance Package Storage Temperature Symbol VDISP(+) Rj-a TSTG Condition Applied logic supply Applied driver supply Applied input pins Ta<25°C Rating -0.3 +6.5 -0.3 -0.3 VDD+0.3 +150 *1,2 Unit °C/W
maximum supply voltage VSS. Permanent damage device caused voltage supplied over absolute maximum rating value. Thermal resistance package (between junction atmosphere). junction temperature (Tj) given equation indicated below should exceed 150°C. Tj=P Rj-a maximum power consumption
RECOMMENDED OPERATING CONDITIONS
Parameter Logic Supply Voltage Driver Supply Voltage High Level Input Voltage Level Input Voltage High Level Output Current Level Output Current Operating Temperature Input Pulse Rise Time Input Pulse Fall Time Symbol VDISP(+) Condition Applied logic supply Applied driver supply Applied input pins Applied input pins Applied driver output pins Applied driver output pins Applied input pins Applied input pins Min. Max. Unit
Semiconductor
MSC7166
ELECTRICAL CHARACTERISTICS
Characteristics
(VDD=4.5 5.5V,VDISP(+)=8 65V,Ta=-40 +85°C) Parameter Logic Supply Current Driver Supply Current High Level Input Current Level Input Current High Level Output Voltage Level Output Voltage Symbol IDD1 IDD2 IDISP1 IDISP2 Condition load, output load, DUTY=L load, output load, DUTY=L IOH=-40mA IOL=1mA Min. VDISP(+) Typ. Max. Unit
Characteristics
(VDD=4.5 5.5V,VDISP(+)=8 65V,Ta=-40 +85°C) Parameter Delay Time Transient Time Delay Time Transient Time Symbol tDLH tTLH tDHL tTHL Condition CL=10pF, figure below CL=10pF, figure below CL=10pF, figure below CL=10pF, figure below Min. Typ. Max. Unit
DUTY SELn tDLH GRIDn tTLH
tDHL tTHL
Semiconductor
MSC7166
FUNCTION DESCRIPTION
Functional Table
GRID
DUTY
Semiconductor
MSC7166
PACKAGE DIMENSIONS
(Unit
SOP24-P-430-1.27-K
Mirror finish
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 0.58 TYP.
Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, SOJ, (PLCC), surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
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