Semiconductor MSC7165 16-Bit Grid Driver with 16-Decoder Thi
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E2C0031-27-Y2 Semiconductor
Semiconductor MSC7165
16-Bit Grid Driver with 16-Decoder
This version: Nov. 1997 MSC7165 Previous version: Jul. 1996
GENERAL DESCRIPTION
MSC7165 driver designed directly drive grids vacuum fluorescent display tube. Since this built-in 16-line decoder output circuits, single device MSC7165 replace following three: devices either MSL915 MSL917 device either MSM4514 MSM74HC4514. Setting DUTY level makes driver outputs "L". Blanking using this function.
FEATURES
Logic supply voltage Driver supply voltage Driver output current -60V
-40mA connected directly without pull-down resistor Built-in 16-line decoder Brightness adjusted DUTY Package: 24-pin plastic (SOP24-P-430-1.27-K) (Product name: MSC7165GS-K)
Semiconductor
MSC7165
BLOCK DIAGRAM
DUTY DECODER
GRID GRID GRID GRID GRID GRID GRID GRID GRID GRID GRID GRID GRID GRID GRID GRID
VDISP(-)
Semiconductor
MSC7165
INPUT OUTPUT CONFIGURATION
Schematic Diagrams Logic Portion Input Circuit
Input
VDISP(-)
Schematic Diagram Driver Output Circuit
Output
VDISP(-)
VDISP(-)
Semiconductor
CONFIGURATION (TOP VIEW)
GRID GRID GRID GRID GRID GRID GRID GRID GRID GRID GRID GRID
24-Pin Plastic
MSC7165
VDISP(-) DUTY GRID GRID GRID GRID
DESCRIPTIONS
Symbol SEL0-3 Type 16-line decoder input pins input 4-bit binary signals converted into hexadecimal signals, then output through driver output pins. DUTY Duty control signal input Setting this makes driver outputs "L", this used brightness control. GRID1-16 High withstand voltage driver output pins driving fluorescent display tube These pins connected directly grid fluorescent display tube. pull-down resistor required. VDISP(-) Power supply fluorescent display tube driver circuit Logic power supply Ground Description
Semiconductor
MSC7165
ABSOLUTE MAXIMUM RATINGS
Parameter Logic Supply Voltage Driver Supply Voltage Input Voltage Power Dissipation Package Thermal Resistance Storage Temperature Symbol VDISP(-) Rj-a TSTG Condition Applied logic supply Applied driver supply Applied input pins Ta<25°C Rating -0.3 +6.5 Unit °C/W
-0.3 VDD+0.3 +150
maximum supply voltage Permanent damage device caused voltage supplied over absolute maximum rating value. Thermal resistance package (between junction atmosphere) junction temperature (Tj) given equation indicated below should exceed 150°C. Maximum power consumption
RECOMMENDED OPERATING CONDITIONS
Parameter Logic Supply Voltage Driver Supply Voltage High Level Input Voltage Level Input Voltage High Level Output Current Level Output Current Operating Temperature Input Pulse Rise time Input Pulse Fall Time Symbol VDISP(-) Condition Applied logic supply Applied driver supply Applied input pins Applied input pins Applied driver output pins Applied driver output pins Applied input pins Applied input pins Min. Max. Unit
Semiconductor
MSC7165
ELECTRICAL CHARACTERISTICS
Characteristics
(VDD=4.5 5.5V, VDISP(-)=-60 -5V, Ta=-40 +85°C) Parameter Logic Supply Voltage Driver Supply Voltage High Level Input Current Level Input Current High Level Output Voltage Level Output Voltage Symbol IDD1 IDD2 IDISP1 IDISP2 Condition load, output load, DUTY=L load, output load, DUTY=L IOH=-40mA IOL=1mA Min. -6.0 -6.0 VDD-4 Typ. Max. VDISP(-) +2.5 Unit
Characteristics
(VDD=4.5 5.5V, VDISP(-)=-60 -5V, Ta=-40 +85°C) Parameter Delay Time Transient Time Delay Time Transient Time Symbol tDLH tTLH tDHL tTHL Condition CL=10pF, figure below CL=10pF, figure below CL=10pF, figure below CL=10pF, figure below Min. Typ. Max. Unit
tDLH GRIDn tTLH
DUTY SELn
tDHL tTHL
Semiconductor
MSC7165
FUNCTIONAL DESCRIPTION
Function Table
GRID
DUTY
Semiconductor
MSC7165
PACKAGE DIMENSIONS
(Unit
SOP24-P-430-1.27-K
Mirror finish
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 0.58 TYP.
Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, SOJ, (PLCC), surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
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