Semiconductor MSC1218 This version: Nov. 1997 MSC1218 Previous ve

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Semiconductor MSC1218 This version: Nov. 1997 MSC1218 Previous ve

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E2C0023-27-Y3 Semiconductor
Semiconductor MSC1218
This version: Nov. 1997 MSC1218 Previous version: Jul. 1996
63-Bit Triplex Controller/Driver with Digital Dimming Function
MSC1218 Bi-CMOS driver duty vacuum fluorescent display tube. contains 64-bit shift register, 63-bit latch, 10-bit digital dimming circuit, three grids. MSC1218 only three microcontroller interface signal lines: D-IN, CLOCK. chip select function enables D-IN CLOCK lines shared with other peripheral circuits.
FEATURES
Power supply Voltage (built-in regulator logic circuit) Operating temperature +85°C 21-segment driver outputs IOH=-6mA VOH=VDD-0.8V 3-grid driver outputs IOH=-16mA VOH=VDD-0.8V Built-in digital dimming circuit 10-bit resolution Built-in oscillation circuit External Built-in Power-On-Reset circuit Package: 32-pin plastic SSOP(SSOP32-P-430-1.00-K) (Product name: MSC1218GS-K)
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Semiconductor
MSC1218
BLOCK DIAGRAM
SEG21 VDD1 VDD2 REG. Control Circuit DATA-IN CLOCK 63-bit Latch 63-bit data 64-bit Shift Register 10-bit data 10-bit Latch
SEG1 GRID3
GRID1
21-bit Segment Driver 21-Segment Control 21-bit data
3-bit Grid Driver VDD=8
VCC=5.0V (Regurator)
10-bit data OSC0 OSC1 10-bit Digital Diming
Timing Generator bits=0: Digital Dimming Mode bits=1: Data Input Mode
INPUT OUTPUT CONFIGURATION
Schematic Diagrams Logic Portion Input Schematic Diagrams Driver Output Circuit Circuit
Reg.)
INPUT
OUTPUT
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Semiconductor
MSC1218
CONFIGURATION (TOP VIEW)
SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 32-Pin Plastic SSOP
GRID1 GRID2 GRID3 VDD2 OSC0 OSC1 DATA-IN CLOCK VDD1 SEG21 SEG20 SEG19 SEG18
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Semiconductor
MSC1218
DESCRIPTIONS
Symbol SEG1 GRID1 D-IN CLOCK OSC0 OSC1 VDD1 VDD2 Type Decription Output pins segment signals driving display tube (anode). Output pins grid signals driving display tube (grid). Serial data input (positive logic). Shift clock input pin. Serial data shifts rising edge CLOCK. oscillator connecting pins. Oscillation frequency 3.2MHz. Connect resistor between OSC1 OSC0 pins capacitor between OSC0 ground. Chip select input pin. Data transfer inhibited when this "H". Power supply pins. When using these pins, connect each them power supply. Ground pin.
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Semiconductor
MSC1218
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Input Voltage Storage Temperature Power Dissipation Symbol TSTG Condition input pins +85°C Rating -0.3 -0.3 +6.0 +150 Unit
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage High Level Input Voltage High Level Input Voltage Level Input Voltage Level Input Voltage Clock Frequency Oscillation Frequency Frame Frequency Operating Temperature Symbol VIH1 VIH2 VIL1 VIL2 fOSC Condition inputs except OSC0 OSC0 inputs except OSC0 OSC0 4.7kW, 10pF fosc 3.2MHz Min. Typ. Max. Unit
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Semiconductor
MSC1218
ELECTRICAL CHARACTERISTICS
Characteristics
+85°C, (Unless otherwise noted) Parameter High Level Input Voltage (All inputs except OSC0) High Level Input Voltage (All inputs except OSC0) Level Input Voltage (OSC0) Level Input Voltage (OSC0) High Level Input Current (All inputs) Level Input Current (All inputs) High Level Output Voltage (SEG1-20) High Level Output Voltage (GRID1-3) Level Output Voltage (SEG1-20, GRID1-3) Level Output Voltage (SEG1-20, GRID1-3) Level Output Voltage (SEG1-20, GRID1-3) Current Consumption Symbol VIH1 VIH2 VIL1 VIL2 VOH1 VOH2 VOL1 VOL2 VOL3 Condition External input only External input only VIH1 5.0V 0.0V VDD= 9.5V IOH1 -6mA VDD= 9.5V IOH2 -16mA VDD= 9.5V IOL1 500mA VDD= 9.5V IOL2 200mA VDD= 9.5V IOL3 fOSC= 3.2MHz load Min. VDD-0.8 VDD-0.8 Max. Unit
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Semiconductor Characteristics
MSC1218
+85°C, (Unless otherwise noted) Parameter Oscillation Frequency External Input Frequency OSC0 Clock Frequency Clock Pulse Width Data Setup Time Data Hold Time Pulse Width Time Setup Time Clock) Hold Time (Clock CS-All Output Delay Time Slew Rate (All Drivers) Power Time Power-on Hold Time Power-off Rise Time Power-on Symbol fOSC fOSCI tCSW tCSL tCSS tCSH tODS tPCS tPOF tPRZ Condition R=4.7kW, C=10pF External input only CI=100pF CI=100pF t=20% When mounted unit 0.0V When mounted unit Min. Max. Unit
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Semiconductor
MSC1218
TIMING DIAGRAM
Data Input Timing
tCSS CLOCK DATA-IN VALID VALID VALID VALID tCSW tCSH -3.8V -0.8V -3.8V -0.8V tCSL -3.8V -0.8V
Data Output Timing
tCSW tODS tODS -3.8V -0.8V -80% -20%
SEG1-21, GRID1-3
Power-on Timing
tPRZ tPCS tPOF -80%VDD -0.0V -3.8V -0.8V
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Semiconductor
MSC1218
FUNCTIONAL DESCRIPTION
Power-on Reset built-in Power-on-Reset (POR) circuit initializes internal circuits when power applied. following condition established after POR. Contents shift register latches "0". Duty cycle digital dimming "0". outputs OFF. Function Mode function mode selected according output last shift register. function modes follows.
(Last bit) Function Digital dimming data input mode Display data input mode
Digital Dimming Data Input When M0="0", digital dimming data input mode selected input data length bits. digital dimming data input valid only when level applied pin. digital dimming data that input DATA-IN input into shift register rising edge CLOCK. Data automatically loaded latches from shift register rising edge digital dimming data consists bits. output duty varies from 0/1024 (0%) 1016/1624 (99%) each grid. 10-bit digital dimming data should input starting with LSB. [Data Configuration] Digital dimming data input mode Input data: 16bits Digital dimming data: bits Mode selector:
(First INPUT DATA
MODE DATA (MSB)
DIMMING DATA INPUT DATA (LSB) DUTY CYCLE 0/1024 1/1024
1016/1024
1016/1024
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Semiconductor [Input Configuration] Dimming data
BYTE
MSC1218
Display Data Input When M0="1", display data input mode selected input data length bits. display data input valid only when level applied pin. display data that input DATA-IN input into shift register rising edge CLOCK. data automatically loaded latched from shift register rising edge [Data Configuration] Display data input mode Input data: Display data: Mode selector:
64bits bits
(First INPUT DATA
MODE DATA
DISPLAY DATA
[Input Configuration] Display data
BYTE
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Semiconductor [Configuration Segment output Shift Register]
Segment SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 GRID GRID GRID Segment SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 GRID GRID GRID Segment SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 GRID GRID GRID
MSC1218
Output Timing
GRID1 GRID2 GRID3 GRID1-21
*1bit time=4fOSC
3072bit times display cycle) -GND -VDD -VDD 3bit times 5bit times 8bit times -GND
1019bit times
1024bit times
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Semiconductor
MSC1218
PACKAGE DIMENSIONS
(Unit
SSOP32-P-430-1.00-K
Mirror finish
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 0.60 TYP.
Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, SOJ, (PLCC), surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
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Semiconductor MSC1218 This version: Nov. 1997 MSC1218 Previous ve

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