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Semiconductor MSC1157 Semiconductor Speaker Drive Amplifier
Top Searches for this datasheetE2D0048-39-22 Semiconductor MSC1157 Semiconductor Speaker Drive Amplifier This version: Feb. 1999 MSC1157 Previous version: May. 1997 GENERAL DESCRIPTION MSC1157, designed specifically operate voltage with current consumption, power amplifier developed driving speaker voice voltage gains adjusted over range ten. differential output directly drive speaker without output coupling capacitors. 1157, because ability stand ideally suitable portable equipment applications powered battery. FEATURES voltage operation current dissipation Operating current Standby function High output current Differential outputs (Single power supply) 1.6mA without load (typ.) Current dissipation less than standby 350mA peak speaker directly connected between differential outputs. Gain adjusted external resistor. Adjustable gain Package options: 8-pin plastic (DIP8-P-300-2.54) (Product name MSC1157RS) 8-pin plastic (SOP8-P-250-1.27-K) (Product name MSC1157MS-K) Chip BLOCK DIAGRAM Logic STBY 1/13 Semiconductor MSC1157 CONFIGURATION (TOP VIEW) STBY 8-Pin Plastic 8-Pin Plastic DESCRIPTIONS Symbol Type Power supply pin. Ground pin. Signal input analog signal inputs, etc. Digital input pins. Setting these pins configures standby status. table below pins. STBY Clock STBY, Clock Clock Clock Status Operation Standby Operation Standby Operation Operation Operation Operation Unstable Operation Description Applying clock between 32kHz 4MHz either STBY leads operation status regardless status other pin. Applying clocks both pins same time cause malfunction. Refer section, RECOMMENDED OPERATING CONDITIONS since clock frequencies changed setting pin. Bias output internal circuits. This potential during standby. Connecting capacitor between reduces pop-up noise power improves ripple elimination ratio. Speaker output pin. This outputs negative phase with respect input signal. Speaker output pin. This outputs positive phase with respect input signal. 2/13 Semiconductor ABSOLUTE MAXIMUM RATINGS Parameter Power Supply Voltage Input Voltage Maximum Output Current Power Dissipation Junction Temperature Storage Temperature Symbol MSC1157 Condition Ta=25°C Ta=25°C Ta=25°C Ta=25°C Rating -0.3 +6.5 -0.3 VCC+0.3 (*1) ±400 +150 Unit Remark STBY AIN, type type Chip IOMAX TjMAX TSTG Avoid shorting output pins because damaged. RECOMMENDED OPERATING CONDITIONS Parameter Power Supply Voltage Load Impedance (*2) Peak Load Current Input Voltage Input Voltage Symbol Condition STBY pins clock input Min. Max. 4.096 Unit IO-P STBY Operating Frequency (*3) fSTBY clock input Operating Temperature speaker (standard) more should used. input clocks cause little noise output waveforms. recommended input voltage inprove voice quality. 3/13 Semiconductor ELECTRICAL CHARACTERISTICS Parameter Input Resistance Voltage Gain Symbol MSC1157 Unless otherwise specified, Ta=25°C, VCC=2 Condition SP-SP) VCC=3 RL=8 THD10% VCC=6 RL=32 THD10% VCC=3 RL=8 kHz, POUT=45 VCC=6 RL=32 kHz, POUT=125 kHz, C2=4.7 Min. 13.44 -1.94 19.46 0.53 2.49 VCC-1.15 Typ. 0.37 0.65 2.61 VCC-1.04 0.17 Max. 14.49 +1.58 20.51 0.77 2.73 ±0.1 ±0.1 Unit POUT1 Output Power POUT2 THD1 Total Harmonic Distortion THD2 Ripple Elimination Ratio Output Voltage (*4) Output Offset Voltage Output Voltage Output Voltage STBY, Input Current Equivalent Resistance Circuit Current During Operation ICCS signal state VCC=2 VCC=6 Between SP-SP AIN=VCC IOUT=-100 AIN=VCC IOUT=100 VI=VCC VI=GND VCC=6 Circuit Current During Standby typical value output voltage signal state determined from following equation. (VCC 0.67) 4/13 Semiconductor APPLICATION CIRCUIT MSC1157 Standby Select Input Standby Input STBY Speaker Audio Input parasitic capacitance 60pF more exists between speaker output oscillation occur. Implement circuit mount design less than 60pF. coupling capacitor. Cutoff frequency frequency side determined following equation. Choose value according bandwidth. (Hz) Choose value that times large that When standby function used, connect pins STBY GND. recommended that capacitor (approximately 0.1mF) having better high frequency characteristics capacitor (approximately 10mF) placed between pins GND. 5/13 Semiconductor MSC1157 GAIN ADJUSTMENT Gain Adjustment Using Input Resistance (This approach allows gain adjustment with fewer external components) Standby Select Input Standby Input Audio Input STBY Speaker Cutoff frequency frequency side determined from equation: (Hz) 20k) Voltage gain determined from equation: 100k (V/V) Gain Adjustment Using Feedback Resistance (This approach advantage over above approach (less noise approach), number components increased) Standby Select Input Standby Input Audio Input STBY Speaker Cutoff frequency frequency side determined from equation: (Hz) 120k Voltage gain determined from equation: (V/V) 6/13 Semiconductor MSC1157 OPERATING CHARACTERISTICS Power Dissipation Ambient Temperature Maximum Output Amplitude Maxiumum Output Amplitude Voltage Supply RL=64W RL=32W RL=16W RL=8W Power Dissipation [mW] Ambient Temperature [°C] Supply Voltage Power Dissipation Output Power 1000 RL=8W Power Dissipation [mW] Power Dissipation Output Power 1000 VCC=6.0V RL=16W Power Dissipation [mW] VCC=4.5V VCC=6.0V VCC=4.5V VCC=3.0V VCC=3.0V Output Power POUT [mW] Output Power POUT [mW] Power Dissipation Output Power 1000 RL=32W 1000 RL=64W Power Dissipation Output Power Power Dissipation [mW] Power Dissipation [mW] VCC=6.0V VCC=3.0V VCC=4.5V VCC=3.0V VCC=6.0V VCC=4.5V Output Power POUT [mW] Output Power POUT [mW] 7/13 Semiconductor MSC1157 Circuit Current Voltage Supply 2E-3 10000 Rise Time Capacitor Value (C2) 1000 Rise Time 90%) [ms] 1.5E-3 Circuit Current 1E-3 5E-4 1E-2 Capacitor [mF] Supply Voltage Output Voltage Load Current Output Voltage Output Voltage Load Current Output Output Output Voltage (VCC-VO) -0.2 -0.4 -0.6 -0.8 -1.2 -1.4 -1.6 -1.8 VCC=3.0V VCC=6.0V VCC=2.0V VCC=6.0V VCC=3.0V VCC=2.0V Load Current IOUT [mA] Load Current IOUT [mA] Output Voltage Load Current Output -0.2 Output Output Voltage Load Current Output Voltage (VCC-VO) Output Voltage -0.4 -0.6 -0.8 VCC=6.0V VCC=3.0V VCC=3.0V VCC=6.0V VCC=2.0V =2.0V -1.2 -1.4 -1.6 -1.8 Load Current IOUT [mA] Load Current IOUT [mA] 8/13 Semiconductor MSC1157 Circuit Curent Ambient Temperature Circuit Current [mA] Range Ambient Temp. 2.0V 6.0V Ambient Temperature [°C] Resistance Ambient Temperature Resistance [kW] Range Ambient Temp. Ambient Temperature [°C] Circuit Current during standby ICCS [mA] Circuit Current during Standby Ambient Temperature (VCC 6.0V) -0.2 Range Ambient Temp. Ambient Temperature [°C] 9/13 Semiconductor MSC1157 Total Harmonic Distortion Output Total Harmonic Distortion VCC=3V RL=16W VCC=3V RL=8W VCC=4.5V RL=16W VCC=6V RL=32W VCC=4.5V RL=8W f=1kHz VCC=6V RL=16W Output Power POUT [mW] Total Harmonic Distortion Output Total Harmonic Distortion VCC=3V RL=16W VCC=3V RL=8W VCC=4.5V RL=16W VCC=6V RL=32W VCC=4.5V RL=8W f=3kHz VCC=6V RL=16W Output Power POUT [mW] Voltage Gain Frequency C1=0 Ripple Elimination Ratio Frequency C2=0 Voltage Gain [dB] Ripple Elimination Ratio [dB] .47m STBY STBY Frequency [Hz] Frequency [Hz] 10/13 Semiconductor CONFIGURATION Layout Chip size Chip thickness size aperture) Substrate potential location diagram X=2.3mm, Y=2.4mm 350±30mm MSC1157 Y-Axis X-Axis Coordinates (Chip center located Y=0.) Name STBY X-AXIS -133 -985 -950 -180 (Unit: Y-AXIS 1035 1035 -263 -1027 -914 -263 1035 1035 11/13 Semiconductor MSC1157 PACKAGE DIMENSIONS (Unit DIP8-P-300-2.54 Package material Lead frame material treatment Solder plate thickness Package weight Epoxy resin alloy Solder plating more 0.46 TYP. 12/13 Semiconductor MSC1157 (Unit SOP8-P-250-1.27-K Mirror finish Package material Lead frame material treatment Solder plate thickness Package weight Epoxy resin alloy Solder plating more 0.10 TYP. Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times). 13/13 E2Y0002-29-11 NOTICE information contained herein change without notice owing product and/or technical improvements. Before using product, please make sure that information being referred up-to-date. outline action examples application circuits described herein have been chosen explanation standard action performance product. When planning product, please ensure that external conditions reflected actual circuit, assembly, program designs. When designing your product, please product below specified maximum ratings within specified operating ranges including, limited operating voltage, power dissipation, operating temperature. assumes responsibility liability whatsoever failure unusual unexpected operation resulting from misuse, neglect, improper installation, repair, alteration accident, improper handling, unusual physical electrical stress including, limited exposure parameters beyond specified maximum ratings operation outside specified operating range. Neither indemnity against license third party's industrial intellectual property right, etc. granted connection with product and/or information drawings contained herein. responsibility assumed infringement third party's right which result from thereof. products listed this document intended general electronics equipment commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products authorized system application that requires special enhanced quality reliability characteristics system application where failure such system application result loss damage property, death injury humans. Such applications include, limited traffic automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, life-support systems. Certain products this document need government approval before they exported particular countries. purchaser assumes responsibility determining legality export these products will take appropriate necessary steps their expense these. part contents cotained herein reprinted reproduced without prior permission. MS-DOS registered trademark Microsoft Corporation. Copyright 1999 Electric Industry Co., Ltd. Printed Japan Other recent searchesPDU-V113 - PDU-V113 PDU-V113 Datasheet MN673274 - MN673274 MN673274 Datasheet HCF4018B - HCF4018B HCF4018B Datasheet GVXO-55F - GVXO-55F GVXO-55F Datasheet AP-LDLD1226-01 - AP-LDLD1226-01 AP-LDLD1226-01 Datasheet 74ACQ574 - 74ACQ574 74ACQ574 Datasheet 74ACTQ574 - 74ACTQ574 74ACTQ574 Datasheet 2SC5343EF - 2SC5343EF 2SC5343EF Datasheet
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