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Semiconductor MSC1157 Semiconductor Speaker Drive Amplifier


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E2D0048-39-22
Semiconductor MSC1157
Semiconductor Speaker Drive Amplifier
This version: Feb. 1999 MSC1157 Previous version: May. 1997
GENERAL DESCRIPTION
MSC1157, designed specifically operate voltage with current consumption, power amplifier developed driving speaker voice voltage gains adjusted over range ten. differential output directly drive speaker without output coupling capacitors. 1157, because ability stand ideally suitable portable equipment applications powered battery.
FEATURES
voltage operation current dissipation Operating current Standby function High output current Differential outputs (Single power supply) 1.6mA without load (typ.) Current dissipation less than standby 350mA peak speaker directly connected between differential outputs. Gain adjusted external resistor.
Adjustable gain Package options: 8-pin plastic (DIP8-P-300-2.54) (Product name MSC1157RS) 8-pin plastic (SOP8-P-250-1.27-K) (Product name MSC1157MS-K) Chip
BLOCK DIAGRAM
Logic
STBY
1/13
Semiconductor
MSC1157
CONFIGURATION (TOP VIEW)
STBY
8-Pin Plastic 8-Pin Plastic
DESCRIPTIONS
Symbol Type Power supply pin. Ground pin. Signal input analog signal inputs, etc. Digital input pins. Setting these pins configures standby status. table below pins. STBY Clock STBY, Clock Clock Clock Status Operation Standby Operation Standby Operation Operation Operation Operation
Unstable Operation
Description
Applying clock between 32kHz 4MHz either STBY leads operation status regardless status other pin. Applying clocks both pins same time cause malfunction. Refer section, RECOMMENDED OPERATING CONDITIONS since clock frequencies changed setting pin. Bias output internal circuits. This potential during standby. Connecting capacitor between reduces pop-up noise power improves ripple elimination ratio. Speaker output pin. This outputs negative phase with respect input signal. Speaker output pin. This outputs positive phase with respect input signal.
2/13
Semiconductor ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Input Voltage Maximum Output Current Power Dissipation Junction Temperature Storage Temperature
Symbol
MSC1157
Condition Ta=25°C Ta=25°C Ta=25°C Ta=25°C
Rating -0.3 +6.5 -0.3 VCC+0.3 (*1) ±400 +150
Unit
Remark STBY AIN, type type Chip
IOMAX TjMAX TSTG
Avoid shorting output pins because damaged.
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage Load Impedance (*2) Peak Load Current Input Voltage Input Voltage
Symbol
Condition STBY pins clock input
Min.
Max. 4.096
Unit
IO-P
STBY Operating Frequency (*3)
fSTBY
clock input
Operating Temperature
speaker (standard) more should used. input clocks cause little noise output waveforms. recommended input voltage inprove voice quality.
3/13
Semiconductor ELECTRICAL CHARACTERISTICS
Parameter Input Resistance Voltage Gain
Symbol
MSC1157
Unless otherwise specified, Ta=25°C, VCC=2 Condition SP-SP) VCC=3 RL=8 THD10% VCC=6 RL=32 THD10% VCC=3 RL=8 kHz, POUT=45 VCC=6 RL=32 kHz, POUT=125 kHz, C2=4.7 Min. 13.44 -1.94 19.46 0.53 2.49 VCC-1.15 Typ. 0.37 0.65 2.61 VCC-1.04 0.17 Max. 14.49 +1.58 20.51 0.77 2.73 ±0.1 ±0.1 Unit
POUT1
Output Power POUT2 THD1 Total Harmonic Distortion THD2 Ripple Elimination Ratio Output Voltage (*4) Output Offset Voltage Output Voltage Output Voltage STBY, Input Current Equivalent Resistance
Circuit Current During Operation
ICCS
signal state
VCC=2 VCC=6
Between SP-SP AIN=VCC IOUT=-100 AIN=VCC IOUT=100 VI=VCC VI=GND VCC=6
Circuit Current During Standby
typical value output voltage signal state determined from following equation.
(VCC 0.67)
4/13
Semiconductor APPLICATION CIRCUIT
MSC1157
Standby Select Input Standby Input
STBY
Speaker
Audio Input
parasitic capacitance 60pF more exists between speaker output oscillation occur. Implement circuit mount design less than 60pF. coupling capacitor. Cutoff frequency frequency side determined following equation. Choose value according bandwidth.
(Hz) Choose value that times large that When standby function used, connect pins STBY GND. recommended that capacitor (approximately 0.1mF) having better high frequency characteristics capacitor (approximately 10mF) placed between pins GND.
5/13
Semiconductor
MSC1157
GAIN ADJUSTMENT
Gain Adjustment Using Input Resistance (This approach allows gain adjustment with fewer external components)
Standby Select Input Standby Input Audio Input STBY Speaker
Cutoff frequency frequency side determined from equation:
(Hz) 20k) Voltage gain determined from equation:
100k (V/V)
Gain Adjustment Using Feedback Resistance (This approach advantage over above approach (less noise approach), number components increased)
Standby Select Input Standby Input Audio Input STBY Speaker
Cutoff frequency frequency side determined from equation: (Hz) 120k Voltage gain determined from equation:
(V/V)
6/13
Semiconductor
MSC1157
OPERATING CHARACTERISTICS
Power Dissipation Ambient Temperature
Maximum Output Amplitude
Maxiumum Output Amplitude Voltage Supply RL=64W RL=32W RL=16W RL=8W
Power Dissipation [mW]
Ambient Temperature [°C]
Supply Voltage
Power Dissipation Output Power 1000 RL=8W
Power Dissipation [mW]
Power Dissipation Output Power 1000 VCC=6.0V RL=16W
Power Dissipation [mW]
VCC=4.5V
VCC=6.0V VCC=4.5V VCC=3.0V
VCC=3.0V
Output Power POUT [mW]
Output Power POUT [mW]
Power Dissipation Output Power 1000 RL=32W 1000 RL=64W
Power Dissipation Output Power
Power Dissipation [mW]
Power Dissipation [mW]
VCC=6.0V VCC=3.0V VCC=4.5V
VCC=3.0V
VCC=6.0V VCC=4.5V
Output Power POUT [mW]
Output Power POUT [mW]
7/13
Semiconductor
MSC1157
Circuit Current Voltage Supply 2E-3 10000
Rise Time Capacitor Value (C2)
1000
Rise Time 90%) [ms]
1.5E-3
Circuit Current
1E-3
5E-4
1E-2
Capacitor [mF]
Supply Voltage
Output Voltage Load Current
Output Voltage
Output Voltage Load Current Output
Output
Output Voltage (VCC-VO)
-0.2 -0.4 -0.6 -0.8 -1.2 -1.4 -1.6 -1.8
VCC=3.0V VCC=6.0V VCC=2.0V
VCC=6.0V VCC=3.0V VCC=2.0V
Load Current IOUT [mA]
Load Current IOUT [mA]
Output Voltage Load Current Output -0.2 Output
Output Voltage Load Current
Output Voltage (VCC-VO)
Output Voltage
-0.4 -0.6 -0.8 VCC=6.0V VCC=3.0V
VCC=3.0V VCC=6.0V VCC=2.0V
=2.0V -1.2 -1.4 -1.6 -1.8
Load Current IOUT [mA]
Load Current IOUT [mA]
8/13
Semiconductor
MSC1157
Circuit Curent Ambient Temperature
Circuit Current [mA]
Range Ambient Temp. 2.0V 6.0V
Ambient Temperature [°C]
Resistance Ambient Temperature
Resistance [kW]
Range Ambient Temp.
Ambient Temperature [°C]
Circuit Current during standby ICCS [mA]
Circuit Current during Standby Ambient Temperature (VCC 6.0V) -0.2 Range Ambient Temp.
Ambient Temperature [°C]
9/13
Semiconductor
MSC1157
Total Harmonic Distortion Output
Total Harmonic Distortion
VCC=3V RL=16W VCC=3V RL=8W VCC=4.5V RL=16W VCC=6V RL=32W VCC=4.5V RL=8W
f=1kHz
VCC=6V RL=16W
Output Power POUT [mW]
Total Harmonic Distortion Output
Total Harmonic Distortion
VCC=3V RL=16W VCC=3V RL=8W VCC=4.5V RL=16W VCC=6V RL=32W VCC=4.5V RL=8W
f=3kHz
VCC=6V RL=16W
Output Power POUT [mW]
Voltage Gain Frequency
C1=0
Ripple Elimination Ratio Frequency
C2=0
Voltage Gain [dB]
Ripple Elimination Ratio [dB]
.47m
STBY
STBY
Frequency [Hz]
Frequency [Hz]
10/13
Semiconductor CONFIGURATION Layout Chip size Chip thickness size aperture) Substrate potential location diagram X=2.3mm, Y=2.4mm 350±30mm
MSC1157
Y-Axis
X-Axis
Coordinates (Chip center located Y=0.)
Name STBY X-AXIS -133 -985 -950 -180
(Unit: Y-AXIS 1035 1035 -263 -1027 -914 -263 1035 1035
11/13
Semiconductor
MSC1157
PACKAGE DIMENSIONS
(Unit
DIP8-P-300-2.54
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 0.46 TYP.
12/13
Semiconductor
MSC1157
(Unit
SOP8-P-250-1.27-K
Mirror finish
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 0.10 TYP.
Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
13/13
E2Y0002-29-11
NOTICE
information contained herein change without notice owing product and/or technical improvements. Before using product, please make sure that information being referred up-to-date. outline action examples application circuits described herein have been chosen explanation standard action performance product. When planning product, please ensure that external conditions reflected actual circuit, assembly, program designs. When designing your product, please product below specified maximum ratings within specified operating ranges including, limited operating voltage, power dissipation, operating temperature. assumes responsibility liability whatsoever failure unusual unexpected operation resulting from misuse, neglect, improper installation, repair, alteration accident, improper handling, unusual physical electrical stress including, limited exposure parameters beyond specified maximum ratings operation outside specified operating range. Neither indemnity against license third party's industrial intellectual property right, etc. granted connection with product and/or information drawings contained herein. responsibility assumed infringement third party's right which result from thereof. products listed this document intended general electronics equipment commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products authorized system application that requires special enhanced quality reliability characteristics system application where failure such system application result loss damage property, death injury humans. Such applications include, limited traffic automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, life-support systems. Certain products this document need government approval before they exported particular countries. purchaser assumes responsibility determining legality export these products will take appropriate necessary steps their expense these. part contents cotained herein reprinted reproduced without prior permission. MS-DOS registered trademark Microsoft Corporation.
Copyright 1999 Electric Industry Co., Ltd.
Printed Japan

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