Semiconductor ML9203-xx This version: ML9203-xx Jun. 1999 Ch

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Semiconductor ML9203-xx This version: ML9203-xx Jun. 1999 Ch

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E2C0041-19-64 Semiconductor
Semiconductor ML9203-xx
This version: ML9203-xx Jun. 1999
Character 16-Digit 2-Line Display Controller/Driver with Character
ML9203-xx matrix type vacuum fluorescent display tube controller driver which displays characters, numerics symbols maximum digits lines. matrix vacuum fluorescent display tube drive signals generated serial data sent from micro-controller. display system easily realized internal character display. ML9203-xx power consumption since made CMOS process technology. available general-purpose code. Custom codes provided customer's request.
FEATURES
Logic power supply (VDD) V±10% V±10% tube drive power supply (VDISP) driver output current (VFD driver output connected directly tube. pull-down resistor required.) Segment driver (SEGA1 A35, SEGB1 B35) Only driver output high (VDISP=60V) driver outputs high -350 (VDISP=60V) Segment driver (ADA, ADB) (VDISP=60V) Grid driver (COM1 (VDISP=60V) Content display SEGA1 SEGA35 CGROM_A dots types (character data) CGRAM_A dots types (character data) ADRAM_A (display digit) (symbol data; used cursor.) DCRAM_A (display digit) bits (register character data display) SEGB1 SEGB35 CGROM_B dots types (character data) CGRAM_B dots types (character data) ADRAM_B (display digit) (symbol data; used cursor.) DCRAM_B (display digit) bits (register character data display) Display control function Display digit digits Display duty (brightness adjustment) 1024 stages lights ON/OFF interfaces with microcontroller interfaces when RESET added) Built-in oscillation circuit Crystal oscillation ceralock oscillation (Typ) Package options: 100-pin plastic (QFP100-P-1420-0.65-BK) (Product name: ML9203-xxGA)
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Semiconductor
ML9203-xx
BLOCK DIAGRAM
VDISP D-GND L-GND RESET 8bit Shift Register
DCRAM_A
CGROM_A 240w Segment Driver CGRAM_A
SEGA1
SEGA35 Segment Driver
ADRAM_B
DCRAM_B
CGROM_B 240w Segment Driver CGRAM_B
SEGB1
SEGB35 Segment Driver
Command Decoder Control Circuit Address Selector Write Address Counter Timing Generator Read Address Counter
ADRAM_B
Digit Control Duty Control
COM1 Grid Driver COM16
Timing Generator OSC0 OSC1 Oscillator
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Semiconductor
ML9203-xx
INPUT OUTPUT CONFIGURATION
Schematic Diagram Logic Portion Input Circuit
INPUT
L-GND
L-GND
Schematic Diagram Driver Output Circuit
VDISP VDISP
OUTPUT
D-GND
D-GND
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Semiconductor
ML9203-xx
CONFIGURATION (TOP VIEW)
SEGA16 SEGA17 SEGA18 SEGA19 SEGA20 SEGA21 SEGA22 SEGA23 SEGA24 SEGA25 SEGA26 SEGA27 SEGA28 SEGA29 SEGA30 SEGA31 SEGA32 SEGA33 SEGA34 SEGA35
SEGA15 SEGA14 SEGA13 SEGA12 SEGA11 SEGA10 SEGA9 SEGA8 SEGA7 SEGA6 SEGA5 SEGA4 SEGA3 SEGA2 SEGA1 SEGB1 SEGB2 SEGB3 SEGB4 SEGB5 SEGB6 SEGB7 SEGB8 SEGB9 SEGB10 SEGB11 SEGB12 SEGB13 SEGB14 SEGB15
VDISP COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 D-GND RESET OSC1 OSC0 L-GND D-GND COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1 VDISP
SEGB16 SEGB17 SEGB18 SEGB19 SEGB20 SEGB21 SEGB22 SEGB23 SEGB24 SEGB25 SEGB26 SEGB27 SEGB28 SEGB29 SEGB30 SEGB31 SEGB32 SEGB33 SEGB34
100-Pin Plastic
SEGB35
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Semiconductor
ML9203-xx
DESCRIPTION
Symbol SEGA1 SEGB1 COM1 Type Connects tube anode electrode tube grid electrode tube anode electrode Description tube anode electrode drive output. Directly connected fluorescent display tube pull-down resistor necessary. IOH>-5 tube grid electrode drive output. Directly connected fluorescent display tube pull-down resistor necessary. IOH>-50 tube anode electrode drive output. Directly connected fluorescent display tube pull-down resistor necessary. IOH>-20 VDD-L-GND power supplies internal logic. VDISP-D-GND power supplies driving fluorescent tubes. Apply VDISP after applied. same power supply L-GND D-GND. Serial data input (positive logic). Input from LSB. Shift clock input. Serial data shifted rising edge Chip select input. Serial data transfer disabled when level. Reset input. "Low" initializes functions. Initial status follows. address "00"H Address each Content undefined Data each digits Display digit 0/1024 Brightness adjusment mode lights circuit when connected externally, Application Circuit. Pins oscillation. Connect crystal capacitors ceralock resonator capacitors. (Use built-in feedback resistor.) target oscillation frequency MHz. external circuit, APPLICATION CIRCUIT.
ADA, L-GND VDISP D-GND
Power supply
Microcontroller Microcontroller Microcontroller
RESET
Microcontroller
OSC0 OSC1
Crystal ceralock resonator
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Semiconductor
ML9203-xx
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Supply Voltage Input Voltage Power Dissipation Storage Temperature Symbol VDISP TSTG Output Current Condition Ta25°C COM1 COM16 ADA, SEGA1 SEGA35, SEGB1 SEGB35 Rating -0.3 -0.3 -0.3 VDD+0.3 Unit
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Condition When power supply voltage (typ.) When power supply voltage 3.3V (typ.) Oscillation DIGIT=1 oscillation Min. Typ. Max. Unit
Supply Voltage
Supply Voltage Operating Frequency Frame Frequency Operating Temperature
VDISP fOSC
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Semiconductor
ML9203-xx
ELECTRICAL CHARACTERISTICS
Characteristics
(VDD=5.0V±10%, VDD=3.3V±10%, VDISP=20 60V, Ta=-40 +85°C, unless otherwise specified) Parameter High Level Input Voltage Level Input Voltage High Level Input Current Level Input Current High Level Output Voltage Level Output Voltage Symbol VOH1 VOH2 VOH3 VOL1 IDD1 Current Consumption IDD2 IDISP1 IDISP2 Applied COM1 ADA, SEG1 VDISP Condition VDD=5.0V±10% VDD=3.3V±10% VDD=5.0V±10% VDD=3.3V±10% VIH=VDD VIL=0.0V VDISP=60V, IOH1=-50mA VDISP=60V, IOH2=-20mA VDISP=60V, IOH3=-5mA VDD=5.0V±10%, fOSC=4.0MHz VDD=3.3V±10%, fOSC=4.0MHz
fOSC=4.0MHz, output lights load output lights
Min. 0.7VDD 0.8VDD -1.0 -1.0 VDISP-1.5 VDISP-1.5 VDISP-1.5
Max. 0.3VDD 0.2VDD T.B.D
Unit
RESET SEGA1 A35, SEGB1 B35, ADA, COM1
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Semiconductor Characteristics
ML9203-xx
(VDD=5.0V±10%, VDD=3.3V±10%, VDISP=20 60V, Ta=-40 +85°C, unless otherwise specified) Parameter Frequency Pulse Width Setup Time Hold Time Setup Time Hold Time Wait Time Data Processing Time RESET Pulse Width RESET Time Wait Time Output Slew Rate Rise Time Time Symbol tCSS tCSH tCSW tDOFF tWRES tRSON tRSOFF tPRZ tPOF Cl=100pF Condition Oscillating state Oscillating state When RESET signal input from microcontroller etc. externally tR=20% tF=80% Min. Max. Unit
When mounted unit When mounted unit, VDD=0.0V
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Semiconductor
ML9203-xx
TIMING DIAGRAM
Symbol VDD=3.3V±10% VDD=5.0V±10%
Data Timing
tCSS 1/fC VALID VALID tDOFF VALID VALID tCSH tCSW
Reset Timing
RESET
tPRZ tRSON tRSOFF tPOF
When input externally
tWRES
When external connected
tRSOFF
Output Timing
outputs
VDISP VDISP
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Semiconductor
ML9203-xx
Digit Output Timing (for 16-digit display, duty 976/1024)
T=16/ fOSC
Frame cycle t1=1024T Display timing t2=61T Blank timing t3=3T
COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 ADA, ADB, SEGA1 A35, SEGB1
(t1=4.096 when fosc=4.0 MHz) (t2=240 when fosc=4.0 MHz) (t3=16 when fosc=4.0 MHz)
VDISP D-GND
VDISP D-GND
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Semiconductor
ML9203-xx
FUNCTIONAL DESCRIPTION
Commands List
Command
byte
byte
DCRAM_A data write
CGRAM_A data write
byte byte byte byte byte
ADRAM_A data write Display duty Number digits lights ON/OFF
DCRAM_B data write
CGRAM_B data write
byte byte byte byte byte
ADRAM_B data write
Test mode When data written (DCRAM, CGRAM, ADRAM) continuously, addresses internally incremented automatically. Therefore necessary specify byte write data later bytes. Note: test mode used inspection before shipment. user function.
Don't care Address specification each Character code specification each Display duty specification Number digits specification lights instruction lights instruction
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Semiconductor Positional Relationship Between SEGn (one digit)
ML9203-xx
SEGA1
Corresponds byte ADRAM_A data write command.
SEGA5
SEGA2
SEGA3
SEGA4
SEGA6
SEGA7
SEGA8
SEGA9
SEGA10
SEGA11
SEGA12
SEGA13
SEGA14
SEGA15
SEGA16
SEGA17
SEGA18
SEGA19
SEGA20
SEGA21
SEGA22
SEGA23
SEGA24
SEGA25
SEGA26
SEGA27
SEGA28
SEGA29
SEGA30
SEGA31
SEGA32
SEGA33
SEGA34
SEGA35
Corresponds byte CGRAM_A data write command. Corresponds byte CGRAM_A data write command. Corresponds byte CGRAM_A data write command. Corresponds byte CGRAM_A data write command. Corresponds byte CGRAM_A data write command.
SEGB1
Corresponds byte ADRAM_B data write command.
SEGB5
SEGB2
SEGB3
SEGB4
SEGB6
SEGB7
SEGB8
SEGB9
SEGB10
SEGB11
SEGB12
SEGB13
SEGB14
SEGB15
SEGB16
SEGB17
SEGB18
SEGB19
SEGB20
SEGB21
SEGB22
SEGB23
SEGB24
SEGB25
SEGB26
SEGB27
SEGB28
SEGB29
SEGB30
SEGB31
SEGB32
SEGB33
SEGB34
SEGB35
Corresponds byte CGRAM_B data write command. Corresponds byte CGRAM_B data write command. Corresponds byte CGRAM_B data write command. Corresponds byte CGRAM_B data write command. Corresponds byte CGRAM_B data write command.
COMn
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Semiconductor Data Transfer Method Command Write Method Display control command data written 8-bit serial transfer. Write timing shown figure below.
ML9203-xx
Setting "Low" level enables data transfer. Data bits sequentially input into from (LSB first). shown figure below, data read shift register rising edge shift clock, which input into pin. 8-bit data input, internal load signals automatically generated data written each register RAM. Therefore necessary input load signals from outside. Setting "High" disables data transfer. Data input from point when changes from "High" "Low" recognized 8-bit units.
tDOFF tCSH
byte
byte
byte
When data written DCRAM* Command address data
Character code data
Character code data next address
When data written (DCRAM, ADRAM, CGRAM) continuously, addresses internally incremented automatically. Therefore necessary specify byte write data later bytes.
Reset Function Reset executed when RESET "L", (when turning power example) initializes functions. Initial status follows. Address each address "00"H Data each contents undefined Display digit digits Brightness adjustment 0/1024 display lights mode Segment output segment outputs "Low" output outputs "Low" Please again according "Setting Flowchart" after reset.
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Semiconductor Description Commands Functions
ML9203-xx
DCRAM data write (Specifies address DCRAM writes character code CGROM CGRAM.) DCRAM (Data Control RAM) 4-bit address store character code CGROM CGRAM. character code specified DCRAM converted matrix character pattern CGROM CGRAM. (The DCRAM store characters.) [Command format]
byte (1st)
Select DCRAM_A Select DCRAM_B selects DCRAM data write mode specifies DCRAM address (Ex: Specifies DCRAM address specifies character code CGROM CGRAM (written into DCRAM address
byte (2nd)
specify character code CGROM CGRAM continuously next address, specify only character code follows. addresses DCRAM automatically incremented. Specification address unnecessary.
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Semiconductor
ML9203-xx
byte (3rd)
specifies character code CGROM CGRAM (written into DCRAM address
byte (4th) specifies character code CGROM CGRAM (written into DCRAM address
byte (17th)
specifies character code CGROM CGRAM (written into DCRAM address
byte (18th) specifies character code CGROM CGRAM (DCRAM address rewritten)
(LSB) (MSB): DCRAM addresses bits: characters) (LSB) (MSB): Character code CGROM CGRAM bits: characters) [COM positions DCRAM addresses]
position COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16
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Semiconductor CGRAM data write (Specifies addresses CGRAM writes character pattern data.)
ML9203-xx
CGRAM (Character Generator RAM) 4-bit address store matrix character patterns. character pattern stored CGRAM displayed specifying character code (address) DCROM. address CGRAM assigned 0FH. (All other addresses CGROM addresses.) (The CGRAM store types character patterns.) [Command format]
byte (1st)
Select CGRAM_A Select CGRAM_B selects CGRAM data write mode specifies CGRAM address. (Ex: specifies CGRAM address 00H) specifies column data (rewritten into CGRAM address 00H)
byte (2nd)
byte (3rd)
specifies column data (rewritten into CGRAM address 00H)
byte (4th)
specifies column data (rewritten into CGRAM address 00H)
byte (5th)
specifies column data (rewritten into CGRAM address 00H)
byte (6th)
specifies column data (rewritten into CGRAM address 00H)
specify character pattern data continuously next address, specify only character pattern data follows. addresses CGRAM automatically incremented. Specification address unnecessary. byte (character pattern data) regarded data item, sufficient tDOFF time between bytes.
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Semiconductor
ML9203-xx
byte (7th)
specifies column data (rewritten into CGRAM address 01H)
byte (11th)
specifies column data (rewritten into CGRAM address 01H)
(LSB) (MSB): CGRAM addresses bits: characters) (LSB) (MSB) Character pattern data bits: outputs digit) Don't care [CGROM addresses CGRAM addresses] Refer code tables.
CGROM address RAM00(00000000B) RAM01(00000001B) RAM02(00000010B) RAM30(00000011B) RAM04(00000100B) RAM05(00000101B) RAM06(00000110B) RAM70(00000111B)
CGROM address RAM08(00001000B) RAM09(00001001B) RAM0A(00001010B) RAM0B(00001011B) RAM0C(00001100B) RAM0D(00001101B) RAM0E(00001110B) RAM0F(00001111B)
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Semiconductor Positional relationship between output area CGRAM
SEGn1
ML9203-xx
SEGn2
SEGn3
SEGn4
SEGn5
SEGn6
SEGn7
SEGn8
SEGn9
SEGn10
SEGn6
SEGn8
SEGn9
SEGn11
SEGn12
SEGn13
SEGn14
SEGn15
SEGn11
SEGn12
SEGn14
SEGn15
SEGn16
SEGn17
SEGn18
SEGn19
SEGn20
SEGn16
SEGn17
SEGn18
SEGn20
SEGn21
SEGn22
SEGn23
SEGn24
SEGn25
SEGn21
SEGn22
SEGn24
SEGn25
SEGn26
SEGn27
SEGn28
SEGn29
SEGn30
SEGn26
SEGn28
SEGn29
SEGn31
SEGn32
SEGn33
SEGn34
SEGn35
area that corresponds byte (1st column) (Input 1000001*B) area that corresponds byte (2nd column) (Input 1100011*B) area that corresponds byte (3rd column) (Input 1010101*B) area that corresponds byte (4th column) (Input 1001001*B) area that corresponds byte (5th column) (Input 1100011*B)
Note: CGROM_A CGROM_B (Character Generator have 8-bit address generate matrix character patterns. Each CGROM_A CGROM_B store types character patterns. contents CGROM_A CGROM_B separately. General-purpose code available (see code tables) custom codes provided customer's request.
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Semiconductor ADRAM data write (specifies address ADRAM writes symbol data)
ML9203-xx
ADRAM (Additional Data RAM) 1-bit address store symbol data. Symbol data specified ADRAM directly output without CGROM CGRAM. (The ADRAM store type symbol patterns each digit.) terminal which contents ADRAM output used cursor. [Command format]
byte (1st)
Select ADRAM_A Select ADRAM_B selects ADRAM data write mode specifies ADRAM address (Ex: specifies ADRAM address sets symbol data (written into ADRAM address
byte (2nd)
specify symbol data continuously next address, specify only character data follows. address ADRAM automatically incremented. Specification addresses unnecessary.
byte (3rd) byte (4th)
sets symbol data (written into ADRAM address sets symbol data (written into ADRAM address
byte (17th) byte (18th)
sets symbol data (written into ADRAM address sets symbol data (ADRAM address rewritten.)
(LSB) (MSB) ADRAM addresses bits: characters) Symbol data bit: 1-symbol data digit) Don't care
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Semiconductor [COM positions ADRAM addresses]
position COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16
ML9203-xx
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Semiconductor Display duty (writes display duty value duty cycle register)
ML9203-xx
Display duty adjusts brightness 1024 stages using 10-bit data. When power turned when RESET signal input, duty cycle register value "0". Always execute this instruction before turning display then desired duty value. [Command format]
byte
selects display duty mode sets duty value (lower bits)
byte (2nd) sets duty value (upper bits)
(LSB) (MSB) Display duty data bits: 1024 stages) Don't care [Relation between setup data controlled duty]
duty 0/1024 1/1024 2/1024
974/1024 975/1024 976/1024 976/1024
976/1024
state when power turned when RESET signal input.
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Semiconductor Number digits (writes number display digits display digit register)
ML9203-xx
number digits display digits using 4-bit data. When power turned when RESET signal input, number digit register value "0". Always execute this instruction change number digits before turning dispaly [Command format]
byte selects number digit mode specifies number digit value
(LSB) (MSB) Number digit data bits: digits) Don't care [Relation between setup data controlled COM]
Number digits COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1 Number digits COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1
state when power turned when RESET signal input.
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Semiconductor display lights ON/OFF (turns dispaly lights OFF)
ML9203-xx
display lights used primarily display testing. display lights primarily used display blink prevent malfunction when power turned [Command format]
byte selects display lights mode
display operation data Don't care
[Set data display state
Display state Normal display Sets outputs Sets outputs High Sets outputs High (The state when power applied when RESET input.)
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Semiconductor Setting Flowchart (Power applying included)
Apply
ML9203-xx
Apply VDISP
display lights
Status outputs RESET signal input
Number digits setting
Display duty setting Select used
DCRAM_A Data write mode (with address setting)
Address automatically incremented
CGRAM_A Data write mode (with address setting)
Address automatically incremented
ADRAM_A Data write mode (with address setting)
Address automatically incremented
DCRAM_A Character code DCRAM character code write ended?
CGRAM_A Character code CGRAM character code write ended?
ADRAM_A Character code ADRAM character code write ended?
Another set?
Releases display lights mode
setting
Display operation mode
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Semiconductor Power-off Flowchart
Display operation mode
ML9203-xx
Turn VDISP
Turn
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Semiconductor
ML9203-xx
APPLICATION CIRCUIT
matrix fluorescent display tube
ANODE ANODE ANODE GRID (SEGMENT) (SEGMENT) (SEGMENT) (DIGIT)
Output Ports RESET
VDISP
ADA,ADB SEGB1-B35 SEGA1-A35 COM1-16 VDISP
MSM9203-xx
OSC0 OSC1
L-GND
D-GND
Crystal oscillator ceraloc oscillator
Notes: value depends power supply voltage microcontroller used. Adjust values constants input RESET power supply voltage used. VDISP value depends fluorescent display tube used. Adjust values constants power supply voltage used.
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Semiconductor Reference data
ML9203-xx
figure below shows relationship between VDISP voltage output current each driver. Take care that total power consumption used does exceed power dissipation.
(mA)
[VDISP Voltage-Output Current Each Driver]
[Output Current]
T.B.D
[VDISP Voltage]
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Semiconductor
ML9203-xx
ML9203-01 CGROM_A Code
00000000B (00H) 00000111B (0FH) CGRAM_A addresses.
0000 0000 RAM00 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111
0001 RAM01
0010 RAM02
0011 RAM03
0100 RAM04
0101 RAM05
0110 RAM06
0111 RAM07
1000 RAM08
1001 RAM09
1010 RAM0A
1011 RAM0B
1100 RAM0C
1101 RAM0D
1110 RAM0E
1111 RAM0F
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Semiconductor
ML9203-xx
ML9203-01 CGROM_B Code
00000000B (00H) 00000111B (0FH) CGRAM_B addresses.
0000 0000 RAM00 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111
0001 RAM01
0010 RAM02
0011 RAM03
0100 RAM04
0101 RAM05
0110 RAM06
0111 RAM07
1000 RAM08
1001 RAM09
1010 RAM0A
1011 RAM0B
1100 RAM0C
1101 RAM0D
1110 RAM0E
1111 RAM0F
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Semiconductor
ML9203-xx
PACKAGE DIMENSIONS
(Unit
QFP100-P-1420-0.65-BK
Mirror finish
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 1.29 TYP.
Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
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E2Y0002-29-11
NOTICE
information contained herein change without notice owing product and/or technical improvements. Before using product, please make sure that information being referred up-to-date. outline action examples application circuits described herein have been chosen explanation standard action performance product. When planning product, please ensure that external conditions reflected actual circuit, assembly, program designs. When designing your product, please product below specified maximum ratings within specified operating ranges including, limited operating voltage, power dissipation, operating temperature. assumes responsibility liability whatsoever failure unusual unexpected operation resulting from misuse, neglect, improper installation, repair, alteration accident, improper handling, unusual physical electrical stress including, limited exposure parameters beyond specified maximum ratings operation outside specified operating range. Neither indemnity against license third party's industrial intellectual property right, etc. granted connection with product and/or information drawings contained herein. responsibility assumed infringement third party's right which result from thereof. products listed this document intended general electronics equipment commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products authorized system application that requires special enhanced quality reliability characteristics system application where failure such system application result loss damage property, death injury humans. Such applications include, limited traffic automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, life-support systems. Certain products this document need government approval before they exported particular countries. purchaser assumes responsibility determining legality export these products will take appropriate necessary steps their expense these. part contents cotained herein reprinted reproduced without prior permission. MS-DOS registered trademark Microsoft Corporation.
Copyright 1999 Electric Industry Co., Ltd.
Printed Japan

Semiconductor ML9203-xx This version: ML9203-xx Jun. 1999 Ch

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