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June 2001 PRELIMINARY FDS6574A N-Channel PowerTrench MOSFET
Top Searches for this datasheetFDS6574A June 2001 PRELIMINARY FDS6574A N-Channel PowerTrench MOSFET General Description This N-Channel MOSFET been designed specifically improve overall efficiency DC/DC converters using either synchronous conventional switching controllers. been optimized gate charge, RDS(ON) fast switching speed. Features RDS(ON) RDS(ON) RDS(ON) gate charge High performance trench technology extremely RDS(ON) High power current handling capability Applications DC/DC converter SO-8 Absolute Maximum Ratings Symbol VDSS VGSS Drain-Source Voltage Gate-Source Voltage Drain Current Continuous Pulsed TA=25oC unless otherwise noted Parameter Ratings (Note Units +175 Power Dissipation Single Operation (Note (Note (Note TSTG Operating Storage Junction Temperature Range Thermal Characteristics Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case (Note (Note °C/W °C/W Package Marking Ordering Information Device Marking FDS6574A Device FDS6574A Reel Size 13'' Tape width 12mm Quantity 2500 units 2001 Fairchild Semiconductor Corporation FDS6574A FDS6574A Electrical Characteristics Symbol BVDSS BVDSS IDSS IGSSF IGSSR 25°C unless otherwise noted Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage, Forward Gate-Body Leakage, Reverse (Note Test Conditions Units Characteristics Referenced 25°C -100 mV/°C Characteristics VGS(th) VGS(th) RDS(on) Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance VGS, -2.7 mV/°C Referenced 25°C 12.5 A,TJ=125°C ID(on) On-State Drain Current Forward Transconductance Dynamic Characteristics Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance (Note 10V, 7657 1432 Switching Characteristics td(on) td(off) Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge RGEN 19.5 Drain-Source Diode Characteristics Maximum Ratings Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage (Note 0.56 Notes: junction-to-case case-to-ambient thermal resistance where case thermal reference defined solder mounting surface drain pins. guaranteed design while determined user's board design. 50°C/W when mounted 1in2 copper 105°C/W when mounted copper 125°C/W when mounted minimum pad. Scale letter size paper Pulse Test: Pulse Width 300µs, Duty Cycle 2.0% FDS6574A B(W) FDS6574A Typical Characteristics 4.5V 3.5V RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 2.5V 1.8V 1.5V DRAIN CURRENT 1.5V 1.8V 2.5V 3.0V 3.5V 4.5V VDS, DRAIN SOURCE VOLTAGE DIRAIN CURRENT Figure On-Region Characteristics. Figure On-Resistance Variation with Drain Current Gate Voltage. 0.012 RDS(ON), ON-RESISTANCE (OHM) RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 4.5V 0.01 0.008 125oC 0.006 0.004 25oC 0.002 JUNCTION TEMPERATURE VGS, GATE SOURCE VOLTAGE Figure On-Resistance Variation with Temperature. Figure On-Resistance Variation with Gate-to-Source Voltage. REVERSE DRAIN CURRENT DRAIN CURRENT -55oC 125oC 25oC 125oC 0.01 0.001 0.0001 25oC -55oC VGS, GATE SOURCE VOLTAGE VSD, BODY DIODE FORWARD VOLTAGE Figure Transfer Characteristics. Figure Body Diode Forward Voltage Variation with Source Current Temperature. FDS6574A B(W) FDS6574A Typical Characteristics VGS, GATE-SOURCE VOLTAGE 10000 8000 CAPACITANCE (pF) CISS 6000 4000 COSS 2000 CRSS GATE CHARGE (nC) VDS, DRAIN SOURCE VOLTAGE Figure Gate Charge Characteristics. 1000 P(pk), PEAK TRANSIENT POWER Figure Capacitance Characteristics. DRAIN CURRENT RDS(ON) LIMIT 100µs 10ms 100ms SINGLE PULSE 125°C/W 25°C 4.5V SINGLE PULSE 125oC/W 25oC 0.01 0.01 0.001 0.01 VDS, DRAIN-SOURCE VOLTAGE TIME (sec) Figure Maximum Safe Operating Area. Figure Single Pulse Maximum Power Dissipation. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE RJA(t) r(t) P(pk) SINGLE PULSE 0.05 0.02 0.01 0.01 RJA(t) Duty Cycle, 0.001 0.0001 0.001 0.01 TIME (sec) 1000 Figure Transient Thermal Response Curve. Thermal characterization performed using conditions described Note Transient thermal response will change depending circuit board design. FDS6574A B(W) SOIC-8 Tape Reel Data SOIC(8lds) Packaging Configuration: Figure ATTENTION OBSER PRECAUTIONS HANDLING ELECTROSTATIC SENSITIVE DEVICES TERVE ECAUTIO OBSE HAND TATIC TROS ELEC ITIVE SENS DEVIC LING Packaging Description: SOIC-8 parts shipped tape. carrier tape made from dissipative (carbon filled) polycarbonate resin. cover tape multilayer film (Heat Activated Adhesive nature) primarily composed polyester film, adhesive layer, sealant, anti-static sprayed agent. These reeled parts standard option shipped with 2,500 units 330cm diameter reel. reels dark blue color made polystyrene plastic (antistatic coated). Other option comes units 177cm diameter reel. This some other options further described Packaging Information table. These full reels individually barcode labeled placed inside standard intermediate (illustrated figure 1.0) made recyclable corrugated brown paper. contains reels maximum. these boxes placed inside barcode labeled shipping which comes different sizes depending number parts shipped. Embossed Marking Antistatic Cover Tape Static Dissipative Embossed Carrier Tape F63TNR Label Customized Label F852 9959 F852 9959 F852 9959 F852 9959 SOIC (8lds) Packaging Information Packaging Option Packaging type Reel/Tube/Bag Reel Size Dimension (mm) Weight unit(gm) Weight Reel (kg) Note/Comments Standard flow code) 2,500 355x333x40 5,000 0.0774 0.6060 L86Z Rail/Tube 530x130x83 30,000 0.0774 F011 4,000 355x333x40 8,000 0.0774 0.9696 D84Z 193x183x80 2,000 0.0774 0.1182 F852 9959 SOIC-8 Unit Orientation Barcode Label Barcode Label Barcode Label 355mm 333mm 40mm Intermediate container reel option Barcode Label sample 193mm 183mm 80mm Pizza Standard Option SOIC(8lds)Tape Leader Trailer Configuration: Figure CBVK741B019 FDS9953A FSID: FDS9953A LOT: CBVK741B019 3000 QTY: 2500 SPEC: (F63T D/C1: Z9842AB QTY1: SPEC REV: D/C2: QTY2: CPN: FAIRCHILD SEMICONDUCTOR CORPORATION Carrier Tape Cover Tape Components ailer 640mm minimum empty pockets Leader Tape 1680mm minimum empty pockets ©2001 Fairchild Semiconductor Corporation June 2001, Rev. SOIC-8 Tape Reel Data, continued SOIC(8lds) Embossed Carrier Tape Configuration: Figure User Direction Feed Dimensions millimeter type SOIC(8lds) (12mm) 5.30 +/-0.10 6.50 +/-0.10 12.0 +/-0.3 1.55 +/-0.05 1.60 +/-0.10 1.75 +/-0.10 10.25 5.50 +/-0.05 +/-0.1 +/-0.1 +/-0.10 0.450 +/0.150 +/-0.3 0.06 +/-0.02 Notes: dimensions determined with respect EIA/Jedec RS-481 rotational lateral movement requirements (see sketches maximum Typical component cavity center line 0.5mm maximum maximum component rotation 0.5mm maximum Sketch (Side Front Sectional View) Component Rotation Sketch (Top View) Typical component center line Sketch (Top View) Component lateral movement SOIC(8lds) Reel Configuration: Figure Component Rotation Measured detail Diameter Option detail Diameter Option Measured DETAIL Dimensions inches millimeters Tape Size 12mm Reel Option 7.00 177.8 13.00 0.059 0.059 +0.020/-0.008 +0.5/-0.2 +0.020/-0.008 +0.5/-0.2 0.795 20.2 0.795 20.2 2.165 7.00 0.488 +0.078/-0.000 12.4 +2/0 0.488 +0.078/-0.000 12.4 +2/0 0.724 18.4 0.724 18.4 (LSL-USL) 0.469 0.606 11.9 15.4 0.469 0.606 11.9 15.4 12mm 1998 Fairchild Semiconductor Corporation January 2001, Rev. SOIC-8 Package Dimensions SOIC-8 Code Scale letter size paper Dimensions shown below inches [millimeters] Part Weight unit (gram): 0.0774 ©2000 Fairchild Semiconductor International September 1998, Rev. TRADEMARKS following registered unregistered trademarks Fairchild Semiconductor owns authorized intended exhaustive list such trademarks. Quiet SeriesDISCLAIMER FAST QFETQSQT OptoelectronicsQuiet SeriesSILENT SWITCHER SMART SuperSOTTM-6 SuperSOTTM-8 VCX STAR*POWER used under license FAIRCHILD SEMICONDUCTOR RESERVES RIGHT MAKE CHANGES WITHOUT FURTHER NOTICE PRODUCTS HEREIN IMPROVE RELIABILITY, FUNCTION DESIGN. FAIRCHILD DOES ASSUME LIABILITY ARISING APPLICATION PRODUCT CIRCUIT DESCRIBED HEREIN; NEITHER DOES CONVEY LICENSE UNDER PATENT RIGHTS, RIGHTS OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL FAIRCHILD SEMICONDUCTOR CORPORATION. used herein: Life support devices systems devices critical component component life systems which, intended surgical implant into support device system whose failure perform body, support sustain life, whose reasonably expected cause failure life failure perform when properly used accordance support device system, affect safety with instructions provided labeling, effectiveness. reasonably expected result significant injury user. PRODUCT STATUS DEFINITIONS Definition Terms Datasheet Identification Advance Information Product Status Formative Design Definition This datasheet contains design specifications product development. Specifications change manner without notice. This datasheet contains preliminary data, supplementary data will published later date. Fairchild Semiconductor reserves right make changes time without notice order improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves right make changes time without notice order improve design. Preliminary First Production Identification Needed Full Production Obsolete Production This datasheet contains specifications product that been discontinued Fairchild semiconductor. datasheet printed reference information only. Rev. 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