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Integrated Relay/Solenoid Driver
Optimized Switch Relays from Rail Compatible with "TX'' "TQ'' Series Telecom Relays Rated Features Input Drive Current Internal Zener Clamp Routes Induced Current Ground Rather Than Back Supply Guaranteed State with Input Connection Supports Large Systems with Minimal Off-State Leakage Resistant Accordance with 2000 Human Body Model Provides Robust Driver Interface Between Relay Coil Sensitive Logic Circuits Applications include: Telecom Line Cards Telephony Industrial Controls Security Systems Appliances White Goods Automated Test Equipment Automotive Controls This device intended replace array three discrete components with integrated part. available SOT-23 package. used switch other Inductive Loads such solenoids small motors. MAXIMUM RATINGS
Rating Power Supply Voltage Recommended Operating Supply Voltage Input Voltage Reverse Input Voltage Output Sink Current Continuous Junction Temperature Operating Ambient Temperature Range Storage Temperature Range Symbol Vin(fwd) Vin(rev) Tstg
MDC3105LT1
Motorola Preferred Device
RELAY/SOLENOID DRIVER SILICON MONOLITHIC CIRCUIT BLOCK
CASE 318-08, STYLE SOT-23 (TO-236AB)
INTERNAL CIRCUIT DIAGRAM Vout
Value 2.0-5.5 -0.5 +150
Unit
THERMAL CHARACTERISTICS
Characteristic Total Device Dissipation(1) Derate above 25°C Thermal Resistance Junction Ambient FR-5 0.75 0.062, 25°C Thermal Clad trademark Bergquist Company.
Preferred devices Motorola recommended choices future best overall value. This document contains information product. Specifications information herein subject change without notice.
Symbol RqJA
Unit °C/W
Motorola, Small-Signal Transistors, FETs Diodes Device Data Motorola Inc. 1996
MDC3105LT1
ELECTRICAL CHARACTERISTICS 25°C unless otherwise noted)
Characteristic Symbol Unit
CHARACTERISTICS
Output Zener Breakdown Voltage Pulse) Output Leakage Current Input Voltage (Vout Vdc, O.C., 25°C) (Vout Vdc, O.C., 85°C) V(BRout) V(-BRout) -0.7
CHARACTERISTICS
Input Bias Current Vout Vdc, -40°C) (correlated measurement 25°C) Output Saturation Voltage Vdc, -40°C) (correlated measurement 25°C) Output Sink Current Continuous -40°C, Vdc, (correlated measurement 25°C) IC(on) mAdc
TYPICAL APPLICATION-DEPENDENT SWITCHING PERFORMANCE SWITCHING CHARACTERISTICS
Characteristic Propagation Delay Times: High Propagation Delay; Figures (5.0 74HC04) High Propagation Delay; Figures (5.0 74HC04) High Propagation Delay; Figures (3.0 74HC04) High Propagation Delay; Figures (3.0 74HC04) High Propagation Delay; Figures (5.0 74LS04) High Propagation Delay; Figures (5.0 74LS04) Transition Times: Fall Time; Figures (5.0 74HC04) Rise Time; Figures (5.0 74HC04) Fall Time; Figures (3.0 74HC04) Rise Time; Figures (3.0 74HC04) Fall Time; Figures (5.0 74LS04) Rise Time; Figures (5.0 74LS04) Input Slew Rate(1) Symbol tPHL tPLH tPHL tPLH tPHL tPLH 2385 2400 V/ms Units
Minimum input slew rate must followed avoid overdissipating device.
tPLH tTHL tTLH tPHL
Vout
Figure Switching Waveforms
Motorola Small-Signal Transistors, FETs Diodes Device Data
MDC3105LT1
+4.5 +5.5
AROMAT TX2-L2-3
Vout MDC3105LT1
Vout MDC3105LT1
74HC04 EQUIVALENT
74HC04 EQUIVALENT
Figure 3.0-V, 200-mW Dual Coil Latching Relay Application with V-HCMOS Interface
+3.0 +3.75 +4.5 +5.5
AROMAT TX2-L2-3
Vout MDC3105LT1
Vout MDC3105LT1
74HC04 EQUIVALENT
74HC04 EQUIVALENT
Figure 3.0-V, 200-mW Dual Coil Latching Relay Application with V-HCMOS Interface
Motorola Small-Signal Transistors, FETs Diodes Device Data
MDC3105LT1
+4.5 +5.5
AROMAT TX2-L2-3
Vout MDC3105LT1 BAL99LT1
Vout MDC3105LT1 BAL99LT1
74LS04
74LS04
Figure 3.0-V, 200-mW Dual Coil Latching Relay Application with Interface
+4.5 +5.5
AROMAT TX2-5
AROMAT TX2-5
Continuous Current Calculation Nominal 25°C Vout Assuming ±10% Make Tolerance, (178 (0.9) 25°C
74HC04 EQUIVALENT
Annealed Copper Wire 0.4%/°C (160 [1+(0.004) (-40°-25°)] -40°C Parallel with -40°C V59Max Min0.4
spec.
Figure Typical Coil Dual Relay Application
Motorola Small-Signal Transistors, FETs Diodes Device Data
MDC3105LT1
TYPICAL OPERATING WAVEFORMS
(Circuit Figure
(VOLTS) (mA) TIME (ms)
500M
TIME (ms)
Figure Square Wave Input
Figure Square Wave Response
Vout (VOLTS) (mA) TIME (ms)
TIME (ms)
Figure Square Wave Response
Figure Square Wave Response
OUTPUT SINK CURRENT (mA) 1000 0.25 85°C 25°C 125°C
25°C OUTPUT VOLTAGE
40°C
1E-5
1E-4 1E-3 INPUT CURRENT
1E-2
Figure Pulsed Current Gain Motorola Small-Signal Transistors, FETs Diodes Device Data
Figure Collector Saturation Region
MDC3105LT1
INFORMATION USING SOT-23 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT SURFACE MOUNTED APPLICATIONS
Surface mount board layout critical portion total design. footprint semiconductor packages must correct size insure proper solder connection interface between board package. With correct geometry, packages will self align when subjected solder reflow process.
0.037 0.95
0.037 0.95
0.079 0.035 0.031
inches
SOT-23 SOT-23 POWER DISSIPATION
power dissipation SOT-23 function size. This vary from minimum size soldering size given maximum power dissipation. Power dissipation surface mount device determined J(max), maximum rated junction temperature die, RJA, thermal resistance from device junction ambient, operating temperature, Using values provided data sheet SOT-23 package, calculated follows: TJ(max)
SOLDERING PRECAUTIONS
melting temperature solder higher than rated temperature device. When entire device heated high temperature, failure complete soldering within short time could result device failure. Therefore, following items should always observed order minimize thermal stress which devices subjected. Always preheat device. delta temperature between preheat soldering should 100°C less.* When preheating soldering, temperature leads case must exceed maximum temperature ratings shown data sheet. When using infrared heating with reflow soldering method, difference shall maximum 10°C. soldering temperature time shall exceed 260°C more than seconds. When shifting from preheating soldering, maximum temperature gradient shall less. After soldering been completed, device should allowed cool naturally least three minutes. Gradual cooling should used forced cooling will increase temperature gradient result latent failure mechanical stress. Mechanical stress shock should applied during cooling. Soldering device without preheating cause excessive thermal shock stress which result damage device.
values equation found maximum ratings table data sheet. Substituting these values into equation ambient temperature 25°C, calculate power dissipation device which this case milliwatts. 150°C 25°C 556°C/W milliwatts
556°C/W SOT-23 package assumes recommended footprint glass epoxy printed circuit board achieve power dissipation milliwatts. There other alternatives achieving higher power dissipation from SOT-23 package. Another alternative would ceramic substrate aluminum core board such Thermal CladTM. Using board material such Thermal Clad, aluminum core board, power dissipation doubled using same footprint.
Motorola Small-Signal Transistors, FETs Diodes Device Data
MDC3105LT1
PACKAGE DIMENSIONS
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. MAXIUMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS MINIMUM THICKNESS BASE MATERIAL.
INCHES 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0140 0.0285 0.0350 0.0401 0.0830 0.1039 0.0177 0.0236
MILLIMETERS 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.35 0.69 0.89 1.02 2.10 2.64 0.45 0.60
STYLE BASE EMITTER COLLECTOR
CASE 318-08 ISSUE
Motorola Small-Signal Transistors, FETs Diodes Device Data
MDC3105LT1
Motorola reserves right make changes without further notice products herein. Motorola makes warranty, representation guarantee regarding suitability products particular purpose, does Motorola assume liability arising application product circuit, specifically disclaims liability, including without limitation consequential incidental damages. "Typical" parameters vary different applications. operating parameters, including "Typicals" must validated each customer application customer's technical experts. Motorola does convey license under patent rights rights others. Motorola products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure Motorola product could create situation where personal injury death occur. Should Buyer purchase Motorola products such unintended unauthorized application, Buyer shall indemnify hold Motorola officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that Motorola negligent regarding design manufacture part. Motorola registered trademarks Motorola, Inc. Motorola, Inc. Equal Opportunity/Affirmative Action Employer.
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JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, Toshikatsu Otsuki, Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-3521-8315 HONG KONG: Motorola Semiconductors H.K. Ltd.; Ping Industrial Park, Ting Road, N.T., Hong Kong. 852-26629298
Motorola Small-Signal Transistors, FETs Diodes MDC3105LT1/D Device Data
*MDC3105LT1/D*

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