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Build Biasing Circuit UHF/VHF Amplifier ADE-208-608D 5th. Edition
Top Searches for this datasheetBB305C Build Biasing Circuit UHF/VHF Amplifier ADE-208-608D 5th. Edition 2001 Features Build Biasing Circuit; reduce using parts cost board space. Superior cross modulation characteristics. High gain; typ. MHz) Wide supply voltage range; Applicable with supply voltage. Withstanding ESD; Build absorbing diode. Withstand 200V conditions. Provide mini mold packages; CMPAK-4 (SOT-343mod) Outline CMPAK-4 Source Gate1 Gate2 Drain Notes: Marking BB305C individual type number HITACHI BBFET. BB305C Absolute Maximum Ratings 25°C) Item Drain source voltage Gate1 source voltage Symbol VG1S VG2S Tstg Ratings Gate2 source voltage Drain current Channel power dissipation Channel temperature Storage temperature +150 Unit BB305C Electrical Characteristics 25°C) Item Drain source breakdown voltage Gate1 source breakdown voltage Gate2 source breakdown voltage Symbol V(BR)DSS V(BR)G1SS V(BR)G2SS +100 ±100 Unit Test Conditions 200µA, VG1S VG2S +10µA, VG2S ±10µA, VG1S VG1S +9V, VG2S ±9V, VG1S VG2S 100µA VG1S 100µA VG2S =4V, 1MHz VG2S VG2S =6V, 220k VG2S =82k, 1kHz VG2S =6V, 220k, 1kHz VG2S =4V, 82k, 200MHz VG2S =6V, 220k, 200MHz VG2S =4V, 82k, 200MHz VG2S =6V, 220k, 200MHz Gate1 source cutoff current G1SS Gate2 source cutoff current G2SS Gate1 source cutoff voltage VG1S(off) Gate2 source cutoff voltage VG2S(off) Input capacitance Output capacitance Ciss Coss Reverse transfer capacitance Crss Drain current D(op) D(op) Forward transfer admittance |yfs|1 |yfs|2 Power gain Noise figure 0.017 0.04 BB305C Main Characteristics Test Circuit Operating Items D(op) |yfs|, Ciss, Coss, Crss, Gate Gate Drain Source 200MHz Power Gain, Noise Figure Test Circuit 1000p 1000p 1000p Input(50) 1000p 1000p BBFET 1000p Output(50) 1000p 1SV70 1SV70 1000p Unit Resistance Capacitance Enameled Copper Wire,Inside 10mm, 2Turns Enameled Copper Wire,Inside 10mm, 2Turns Enameled Copper Wire,Inside 5mm, 2Turns BB305C Maximum Channel Power Dissipation Curve (mW) (mA) Typical Output Characteristics Channel Power Dissipation Drain Current (°C) Ambient Temperature Drain Source Voltage Drain Current Gate2 Source Voltage (mA) Drain Current Gate1 Voltage (mA) Drain Current Drain Current Gate1 Voltage Gate2 Source Voltage VG2S BB305C Drain Current Gate1 Voltege (mA) (mA) Drain Current Gate1 Voltege Drain Current Gate1 Voltage Drain Current Gate1 Voltage Forward Transfer Admittance (mS) Forward Transfer Admittance Gate1 Voltage Forward Transfer Admittance (mS) Forward Transfer Admittance Gate1 Voltage Gate1 Voltage Gate1 Voltage BB305C Forward Transfer Admittance Gate1 Voltage Forward Transfer Admittance (mS) Power Gain (dB) Gate1 Voltage 1000 Gate Resistance Power Gain Gate Resistance Noise Figure Gate Resistance Noise Figure (dB) Power Gain (dB) Power Gain Drain Current variable 1000 Gate Resistance Drain Current (mA) BB305C Noise Figure Drain Current Noise Figure (dB) variable (mA) 1000 Drain Current Gate Resistance Drain Current Drain Current (mA) Gate Resistance Gain Reduction Gate2 Source Voltage Input Capacitance Ciss (pF) Gain Reduction (dB) Input Capacitance Gate2 Source Voltage Gate2 Source Voltage VG2S Gate2 Source Voltage VG2S BB305C Parameter Frequency -1.5 -120° -90° -60° 180° 150° Parameter Frequency 120° Scale: div. -150° -30° Test Condition 1000 step) Test Condition 1000 step) Parameter Frequency 120° Parameter Frequency Scale: 0.002 div. 150° 180° -150° -30° -120° -90° -60° -1.5 Test Condition 1000 step) Test Condition 1000 step) BB305C Sparameter (VDS VG2S 82k, (MHz) 1000 0.991 0.991 0.982 0.975 0.972 0.956 0.942 0.928 0.920 0.906 0.894 0.880 0.868 0.854 0.842 0.835 0.820 0.802 0.801 0.789 -4.8 -9.9 -15.4 -20.7 -25.6 -30.6 -35.5 -40.1 -44.9 -49.2 -53.6 -57.8 -62.1 -66.2 -70.3 -73.9 -77.7 -81.5 -84.7 -87.9 2.69 2.68 2.66 2.62 2.60 2.54 2.47 2.42 2.38 2.32 2.25 2.18 2.12 2.06 2.00 1.94 1.89 1.83 1.78 1.73 174.9 169.3 163.4 157.5 152.0 146.3 140.9 135.7 130.5 125.7 120.8 116.2 111.5 106.8 102.5 98.4 94.0 89.6 85.6 82.1 0.00090 0.00153 0.00243 0.00293 0.00370 0.00444 0.00478 0.00535 0.00551 0.00549 0.00584 0.00542 0.00562 0.00509 0.00465 0.00427 0.00416 0.00289 0.00288 0.00241 91.4 90.5 73.8 74.9 70.1 69.0 63.7 64.8 56.8 58.6 54.4 53.3 49.5 48.6 49.7 51.6 53.3 57.9 72.9 78.9 0.991 0.992 0.991 0.989 0.985 0.981 0.977 0.973 0.967 0.962 0.957 0.952 0.944 0.939 0.933 0.927 0.921 0.915 0.909 0.904 -2.2 -4.8 -7.5 -9.9 -12.6 -15.0 -17.3 -19.7 -22.0 -24.5 -26.9 -29.2 -31.5 -33.8 -36.1 -38.3 -40.5 -42.7 -44.9 -47.1 BB305C Package Dimensions January, 2001 Unit: 0.05 0.05 0.425 0.65 0.65 0.16- 0.06 1.25 0.65 1.25 0.425 0.05 0.05 Hitachi Code JEDEC EIAJ Mass (reference value) CMPAK-4(T) Conforms 0.006 BB305C Cautions Hitachi neither warrants grants licenses rights Hitachi's third party's patent, copyright, trademark, other intellectual property rights information contained this document. Hitachi bears responsibility problems that arise with third party's rights, including intellectual property rights, connection with information contained this document. Products product specifications subject change without notice. Confirm that have received latest product standards specifications before final design, purchase use. Hitachi makes every attempt ensure that products high quality reliability. However, contact Hitachi's sales office before using product application that demands especially high quality reliability where failure malfunction directly threaten human life cause risk bodily injury, such aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment medical equipment life support. Design your application that product used within ranges guaranteed Hitachi particularly maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions other characteristics. Hitachi bears responsibility failure damage when used beyond guaranteed ranges. Even within guaranteed ranges, consider normally foreseeable failure rates failure modes semiconductor devices employ systemic measures such failsafes, that equipment incorporating Hitachi product does cause bodily injury, fire other consequential damage operation Hitachi product. This product designed radiation resistant. permitted reproduce duplicate, form, whole part this document without written approval from Hitachi. Contact Hitachi's sales office questions regarding this document Hitachi semiconductor products. Hitachi, Ltd. Semiconductor Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 NorthAmerica Europe Asia Japan http://sicapac.hitachi-asia.com Hitachi Asia Ltd. Hitachi Tower Collyer Quay #20-00, Singapore 049318 <65>-538-6533/538-8577 <65>-538-6933/538-3877 http://www.hitachi.com.sg Hitachi Asia Ltd. (Taipei Branch Office) 4/F, 167, North Road, Hung-Kuo Building, Taipei (105), Taiwan <886>-(2)-2718-3666 <886>-(2)-2718-8180 Telex 23222 HAS-TP http://www.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road Tsim Tsui, Kowloon, Hong Kong <852>-(2)-735-9218 <852>-(2)-730-0281 http://www.hitachi.com.hk further information write Hitachi Semiconductor (America) Inc. East Tasman Drive, Jose,CA 95134 Tel: (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic Components Group Dornacher Strae D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9180-0 Fax: <49> (89) Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 585160 Copyright Hitachi, Ltd., 2000. rights reserved. Printed Japan. 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