BUFFER (OPEN DRAIN) HIGH SPEED (TYP.) POWER DISSIPATION (MAX.) HI

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BUFFER (OPEN DRAIN) HIGH SPEED (TYP.) POWER DISSIPATION (MAX.) HI

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M54HC07 M74HC07
BUFFER (OPEN DRAIN)
HIGH SPEED (TYP.) POWER DISSIPATION (MAX.) HIGH NOISE IMMUNITY VNIH VNIL (MIN.) OUTPUT DRIVE CAPABILITY LSTTL LOADS WIDE OPERATING VOLTAGE RANGE (OPR) FUNCTION COMPATIBLE WITH 54/74LS07
(Plastic Package)
(Ceramic Package)
(Micro Package)
(Chip Carrier)
ORDER CODES M54HC07F1R M74HC07M1R M74HC07B1R M74HC07C1R
CONNECTIONS (top view) DESCRIPTION M54/74HC07 high speed CMOS OPEN DRAIN BUFFER fabricated silicon gate technology. same high speed performance LSTTL combined with true CMOS power consumption. internal circuit composed stages including buffer output, which enables high noise immunity stable output. inputs equipped with circuits against static discharge transient excess voltage. INPUT OUTPUT EQUIVALENT CIRCUIT
Internal Connection
February 1993
M54/M74HC07
TRUTH TABLE
High impedance
LOGIC SYMBOL
DESCRIPTION
SYMBOL NAME FUNCTION Data Inputs Data Outputs Ground (0V) Positive Supply Voltage
LOGIC DIAGRAM (Per Gate)
ABSOLUTE MAXIMUM RATINGS
Symbol IGND Tstg Supply Voltage Input Voltage Output Voltage Input Diode Current Output Diode Current Output Sink Current Output Ground Current Power Dissipation Storage Temperature Lead Temperature sec) Parameter Value -0.5 -0.5 -0.5 +150 Unit
Absolute Maximum Ratings those values beyond which damage device occur. Functional operation under these condition isnotimplied. derate 10mW/oC:
M54/M74HC07
RECOMMENDED OPERATING CONDITIONS
Symbol Supply Voltage Input Voltage Output Voltage Operating Temperature: M54HC Series M74HC Series Input Rise Fall Time Parameter Value +125 1000 Unit
SPECIFICATIONS
Test Conditions Symbol Parameter Input Leakage Current Output Leakage Current Quiescent Supply Current 0.17 0.18 54HC 74HC Min. 3.15 1.35 0.26 0.26 ±0.1 ±0.5 Typ. Max. Value 74HC 54HC Min. 3.15 1.35 0.33 0.33 Max. Min. 3.15 1.35 0.40 0.40 Max. Unit
High Level Input Voltage Level Input Voltage Level Output Voltage
M54/M74HC07
ELECTRICAL CHARACTERISTICS Input
Test Conditions Symbol Parameter tPZL Propagation Delay Time Input Capacitance Output Capacitance Power Dissipation Capacitance 54HC 74HC Min. Typ. Max.
Value 74HC 54HC Min. Max. Min. Max. Unit
tTHL
Output Transition Time Propagation Delay Time
tPLZ
COUT
defined value IC's internal equivalent capacitance which calculated from operating current consumption without load. (Refer Test Circuit). Average operting current obtained following equation. ICC(opr) ICC/6 (per Gate)
M54/M74HC07
Plastic DIP14 MECHANICAL DATA
MIN. 1.27 2.54 0.050 2.54 15.24 0.130 0.100 0.51 1.39 0.25 0.335 0.100 0.600 0.280 0.201 1.65 TYP. MAX. MIN. 0.020 0.055 0.020 0.010 0.787 0.065 inch TYP. MAX.
DIM.
P001A
M54/M74HC07
Ceramic DIP14/1 MECHANICAL DATA
MIN. 2.29 1.17 0.22 1.52 0.38 15.24 2.79 0.55 1.52 0.31 2.54 10.3 8.05 5.08 0.307 0.090 0.016 0.046 0.009 0.060 0.015 0.600 0.110 0.022 0.060 0.012 0.100 0.406 0.317 0.200 TYP. MAX. 0.130 MIN. inch TYP. MAX. 0.787 0.276
DIM.
P053C
M54/M74HC07
SO14 MECHANICAL DATA
DIM. MIN. 8.55 1.27 7.62 1.27 0.68 (max.) 0.149 0.181 0.019 8.75 0.35 0.19 (typ.) 0.336 0.228 0.050 0.300 0.157 0.208 0.050 0.026 0.344 0.244 TYP. MAX. 1.75 1.65 0.46 0.25 0.013 0.007 0.019 0.003 MIN. inch TYP. MAX. 0.068 0.007 0.064 0.018 0.010
P013G
M54/M74HC07
PLCC20 MECHANICAL DATA
MIN. 1.27 1.14 7.37 1.27 5.08 0.38 0.101 0.050 0.045 9.78 8.89 2.54 0.56 8.38 0.290 0.050 0.200 0.015 0.004 TYP. MAX. 10.03 9.04 4.57 MIN. 0.385 0.350 0.165 0.100 0.022 0.330 inch TYP. MAX. 0.395 0.356 0.180
DIM.
P027A
M54/M74HC07
Information furnished believed accurate reliable. However, SGS-THOMSON Microelectronics assumes responsability consequences such information infringement patents other rights third parties which results from use. license granted implication otherwise under patent patent rights SGS-THOMSON Microelectronics. Specifications mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. SGS-THOMSON Microelectronics products authorized ascritical components life support devices systems without express written approval SGS-THOMSON Microelectonics. 1994 SGS-THOMSON Microelectronics Rights Reserved SGS-THOMSON Microelectronics GROUP COMPANIES Australia Brazil France Germany Hong Kong Italy Japan Korea Malaysia Malta Morocco Netherlands Singapore Spain Sweden Switzerland Taiwan Thailand United Kingdom U.S.A

BUFFER (OPEN DRAIN) HIGH SPEED (TYP.) POWER DISSIPATION (MAX.) HI

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