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512K VOLTAGE CMOS SRAM Document Title 512K VOLTAGE CMOS SRAM Revi
Top Searches for this datasheetLP62S4096E-T Series 512K VOLTAGE CMOS SRAM Document Title 512K VOLTAGE CMOS SRAM Revision History History Change VCCmax from 3.3V 3.6V product family 55ns specification Issue Date January 2002 Remark (January, 2002, Version 2.0) AMIC Technology, Inc. LP62S4096E-T Series 512K VOLTAGE CMOS SRAM Features Power supply range: 2.7V 3.6V Access times: 55ns 70ns (max.) Current: Very power version: Operating: 30mA (max.) Standby: 10µA (max.) Full static operation, clock refreshing required inputs outputs directly TTL-compatible Common using three-state output Data retention voltage: (min.) Available 32-pin TSOP/TSSOP 36-ball package General Description LP62S4096E-T operating current 4,194,304-bit static random access memory organized 524,288 words bits operates power supply range: 2.7V 3.3V. built using AMIC's high performance CMOS process. Inputs three-state outputs compatible allow direct interfacing with common system structures. chip enable inputs provided POWER-DOWN device enable output enable input included easy interfacing. Data retention guaranteed power supply voltage package only Power Dissipation Data Retention Standby Operating (ICCDR, Typ.) (ISB1, Typ.) (ICC2, Typ.) 0.08µA 0.3µA Product Family Product Family Operating Temperature -25°C +85°C Range 2.7V~3.6V Speed Package Type TSOP TSSOP LP62S4096E-T 55ns 70ns Typical values measured 3.0V, 25°C 100% tested. Data retention current 2.0V. Configurations TSOP/(TSSOP) (Chip Size Package) 36-pin View I/O5 I/O6 I/O7 I/O8 I/O1 I/O2 I/O3 I/O4 LP62S4096EV-T (LP62S4096EX-T) Name Name I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 I/O8 (January, 2002, Version 2.0) AMIC Technology, Inc. LP62S4096E-T Series Block Diagram DECODER 1024 4096 MEMORY ARRAY I/O1 INPUT DATA CIRCUIT COLUMN I/O8 CONTROL CIRCUIT Recommended Operating Conditions Description Symbol Description -25°C 85°C) Symbol I/O1 I/O8 CE1, Address Inputs Data Input/Outputs Ground Chip Enable Output Enable Write Enable Power Supply Input High Voltage Input Voltage Output Load Output Load -0.3 +0.6 Ground Parameter Supply Voltage Min. Typ. Max. Unit (January, 2002, Version 2.0) AMIC Technology, Inc. LP62S4096E-T Series Absolute Maximum Ratings* -0.5V 4.0V IN/OUT Volt GND- -0.5V 0.5V Operating Temperature, Topr -25°C 85°C Storage Temperature, Tstg -55°C 125°C Temperature Under Bias, Tbias -10°C 85°C Power Dissipation, 0.7W *Comments Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage this device. These stress ratings only. Functional operation this device these other conditions above those indicated operational sections this specification implied intended. Exposure absolute maximum rating conditions extended periods affect device reliability. Electrical Characteristics Symbol Parameter -25°C 85°C, 2.7V 3.6V, LP62S4096E-55LLT 70LLT Min. Typ. Max. CE1= CE2= =VIL VI/O CE1= VIL, CE2= II/O Min. Cycle, Duty 100%, CE1= CE2= VIH, II/O CE1= VIL, CE2= VIH, 1MHZ II/O 3.3V CE1= VIH, CE2= 3.3V 0.2V, 0.2V 0.2V 2.1mA -1.0mA Unit Conditions Input Leakage Current Output Leakage Current Active Power Supply Current ICC1 Dynamic Operating Current ICC2 Dynamic Operating Current Standby Power ISB1 Supply Current Output Voltage Output High Voltage (January, 2002, Version 2.0) AMIC Technology, Inc. LP62S4096E-T Series Truth Table Mode Standby Standby Output Disable Read Write Note: Operation High High High DOUT Supply Current ISB, ISB1 ISB, ISB1 ICC, ICC1, ICC2 ICC, ICC1, ICC2 ICC, ICC1, ICC2 Capacitance 25°C, 1.0MHz) Symbol CIN* CI/O* Parameter Input Capacitance Input/Output Capacitance Min. Max. Unit Conditions VI/O These parameters sampled 100% tested. Characteristics -25°C 85°C, 2.7V 3.6V) Symbol Parameter LP62S4096E-55LLT Min. Read Cycle tACE1, tACE2 tCLZ1, tCLZ2 tOLZ tCHZ1, tCHZ2 tOHZ Read Cycle Time Address Access Time Chip Enable Access Time Output Enable Output Valid Chip Enable Output Output Enable Output Chip Disable Output High Output Disable Output High Output Hold from Address Change Max. LP62S4096E-70LLT Min. Max. Unit (January, 2002, Version 2.0) AMIC Technology, Inc. LP62S4096E-T Series Characteristics (continued) Symbol Parameter LP62S4096E-55LLT Min. Write Cycle tCW1 tWHZ Write Cycle Time Chip Enable Write Address Setup Time Address Valid Write Write Pulse Width Write Recovery Time Write Output High Data Write Time Overlap Data Hold from Write Time Output Active from Write Max. LP62S4096E-70LLT Min. Max. Unit Notes: tCHZ, tOHZ tWHZ defined time which outputs achieve open circuit condition referred output voltage levels. Timing Waveforms Read Cycle 1(1) Address tOLZ5 tACE1 tACE2 tCLZ1 tCLZ2 DOUT tOHZ tCHZ1 tCHZ2 (January, 2002, Version 2.0) AMIC Technology, Inc. LP62S4096E-T Series Timing Waveforms (continued) Read Cycle Address DOUT Read Cycle tACS1 tACS2 tCLZ1 tCLZ2 tCHZ1 tCHZ2 DOUT Notes: high Read Cycle. Device continuously enabled, CE2= VIH. Address valid prior coincident with transition transition high. VIL. Transition measured ±500mV from steady state. This parameter sampled 100% tested. (January, 2002, Version 2.0) AMIC Technology, Inc. LP62S4096E-T Series Timing Waveforms (continued) Write Cycle (Write Enable Controlled) Address tcw1 ,tcw2 tWR3 tAS1 tWP2 tWHZ7 tOW7 DOUT (January, 2002, Version 2.0) AMIC Technology, Inc. LP62S4096E-T Series Write Cycle (Chip Enable Controlled) Address tAS1 tCW1 tCW2 tWR3 tWHZ7 DOUT Notes: measured from address valid beginning Write. Write occurs during overlap (tWP) high measured from earliest going high going going high Write cycle. high transition occurs simultaneously with transition after transition, outputs remain high impedance state. measured from later going going high Write. level high low. Transition measured ±500mV from steady state. This parameter sampled 100% tested. (January, 2002, Version 2.0) AMIC Technology, Inc. LP62S4096E-T Series Test Conditions Input Pulse Levels Input Rise Fall Time Input Output Timing Reference Levels Output Load 0.4V 2.4V 1.5V Figures 30pF Including scope jig. Including scope jig. Figure Output Load Figure Output Load tCLZ, tOHZ, tOL, tCHZ, tWHZ, Data Retention Characteristics -25°C 85°C) Symbol Parameter Data Retention Min. Typ. Max. Unit Conditions 0.2V, 0.2V 2.0V, ICCDR Data Retention Current LL-Version 0.08 0.2V, 0.2V tCDR Chip Disable Data Retention Time Operation Recovery Time Rising Time from Data Retention Voltage Operating Voltage ICCDR: max. Retention Waveform LP62S4096E-55LLT 70LLT 40°C (January, 2002, Version 2.0) AMIC Technology, Inc. LP62S4096E-T Series Data Retention Waveform Controlled) DATA RETENTION MODE 2.7V tCDR 2.7V 0.2V Data Retention Waveform (CE2 Controlled) DATA RETENTION MODE 2.7V tCDR 2.7V 0.2V Ordering Information Part LP62S4096EV-55LLT LP62S4096EX-55LLT LP62S4096EU-55LLT LP62S4096EV-70LLT LP62S4096EX-70LLT LP62S4096EU-70LLT Access Time(ns) Operating Current Max.(mA) Standby Current Max.(uA) Package TSOP TSSOP TSOP TSSOP (January, 2002, Version 2.0) AMIC Technology, Inc. LP62S4096E-T Series Package Information TSOP TYPE 20mm) Outline Dimensions unit: inches/mm 12.0° GAUGE PLANE 0.25 Detail Detail 0.10(0.004) Symbol Dimensions inches 0.047 Max. 0.004±0.002 0.039±0.002 0.008±0.001 0.006±0.001 0.724±0.004 0.315±0.004 0.020 TYP. 0.787±0.007 0.020±0.004 0.031 TYP. 0.0167 TYP. 0.004 Max. Dimensions 1.20 Max. 0.10±0.05 1.00±0.05 0.20±0.03 0.15±0.02 18.40±0.10 8.00±0.10 0.50 TYP. 20.00±0.20 0.50±0.10 0.80 TYP. 0.425 TYP. 0.10 Max. Notes: maximum value dimension includes flash. Dimension does include resin fins. Dimension Board surface mount pitch design reference only. Dimension includes flash. (January, 2002, Version 2.0) AMIC Technology, Inc. LP62S4096E-T Series Package Information TSSOP TYPE 13.4mm) Outline Dimensions unit: inches/mm 12.0° GAUGE PLANE 0.25 Detail Detail 0.10MM SEATING PLANE Symbol Dimensions inches 0.049 Max. 0.002 Min. 0.039±0.002 0.008±0.001 0.006±0.0003 0.315±0.004 0.020 TYP. 0.528±0.008 0.465±0.004 0.02±0.008 0.0266 Min. 0.0109 TYP. 0.004 Max. Dimensions 1.25 Max. 0.05 Min. 1.00±0.05 0.20±0.03 0.15±0.008 8.00±0.10 0.50 TYP. 13.40±0.20 11.80±0.10 0.50±0.20 0.675 Min. 0.278 TYP. 0.10 Max. Notes: maximum value dimension includes flash. Dimension does include resin fins. Dimension Board surface mount pitch design reference only. Dimension includes flash. (January, 2002, Version 2.0) AMIC Technology, Inc. LP62S4096E-T Series Package Information 36LD Outline Dimensions VIEW BOTTOM VIEW Ball#A1 CORNER 0.10 0.25 Ball*A1 CORNER (36X) unit: 0.10 0.20(4X) SIDE VIEW 0.25 (0.36) SEATING PLANE Symbol Dimensions MIN. 1.00 0.16 0.48 5.80 7.80 -0.25 NOM. 1.10 0.21 0.53 6.00 8.00 3.75 5.25 0.75 0.30 MAX. 1.20 0.26 0.58 6.20 8.20 -0.35 Note: BALL DIAMETER, BALL PITCH, STAND-OFF PACKAGE THICKNESS DIFFERENT FROM JEDEC SPEC MO192 (LOW PROFILE FAMILY). PRIMARY DATUM SEATING PLANE DEFINED SPHERICAL CROWNS SOLDER BALLS. DIMENSION MEASURED MAXIMUM. THEERE SHALL MINIMUM CLEARANCE 0.25mm BETWEEN EDGE SOLDER BALL BODY EDGE. BALL OPENING SUBSTRATE 0.25mm (SMD) SUGGEST DESIGN LAND SIZE 0.25mm (NSMD) (January, 2002, Version 2.0) AMIC Technology, Inc. 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