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Parallel EEPROM Die Products Die Products

Rev. 0554C­06 / 98

Features
Parallel EEPROM Die Products Die Products
Description
Testing
Rev. 0554C-06 / 98
Parallel EEPROM Die Product Test Flow
FAB UNTESTED WAFERS
· Backside Condition: Silicon (grind). · Connection: Connect substrate to GND. · Die Map Logo: Not to scale and is shown only as a reference for proper orientation of the wafer.
Die Product Offering - Battery Volt, 5 Volt, Low Volt
Ordering Code(1) AT28BV16-W VCC 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 3.0V - 3.6V 3.0V - 3.6V 4.5V - 5.5V 4.5V - 5.5V 4.5V - 5.5V 4.5V - 5.5V 4.5V - 5.5V 4.5V - 5.5V 4.5V - 5.5V 4.5V - 5.5V 4.5V - 5.5V 4.5V - 5.5V 4.5V - 5.5V 4.5V - 5.5V 4.5V - 5.5V 4.5V - 5.5V Device TAA 250 ns 250 ns 250 ns 250 ns 250 ns 250 ns 250 ns 250 ns 250 ns 250 ns 200 ns 200 ns 200 ns 200 ns 200 ns 200 ns 120 ns 120 ns 200 ns 200 ns 120 ns 120 ns 200 ns 200 ns Package Configuration Die Wafer Die Wafer Die Wafer Die Wafer Die Wafer Die Wafer Die Wafer Die Wafer Die Wafer Die Wafer Die Wafer Die Wafer
RETENTION BAKE 250°C
AT28BV16-DWF AT28BV64-W AT28BV64-DWF
AT28BV64B-W AT28BV64B-DWF AT28BV256-W AT28BV256-DWF
SAW AND CLEAN DIE
AT28LV010-W AT28LV010-DWF
AT28C16-W AT28C16-DWF AT28C64-W
PACKAGING WAFFLE PACK PER MA-5008 WAFER CARRIER PER MA-5008
AT28C64-DWF AT28C64B-W AT28C64B-DWF AT28HC64B-W
QA ELECTRICAL
AT28HC64B-DWF AT28C256-W
QA VISUAL
AT28C256-DWF AT28HC256-W
INVENTORY
AT28HC256-DWF AT28C010-W
SHIPMENT
AT28C010-DWF Note:
Die Information
· Handling: Instructions for Parallel EEPROM Die Product is available from Atmel.
1. Represents standard die product commercial temperature range guarantee.
Die Products
AT28C16 Die Map
Die Size: 137 X 117 mils Connect Substrate to Ground
AT28C17 Die Map
Die Size: 137 X 117 mils Connect Substrate to Ground
Die Pad Coordinates
Signal Name A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 I / O0 X (µ) -1130 -1420 -1420 -1370 -1370 -1140 -900 -660 680 920 1630 -870 Y (µ) -1270 -1270 -920 950 1230 1230 1230 1230 1230 1230 -1000 -1190 Signal Name I / O1 I / O2 I / O3 I / O4 I / O5 I / O6 I / O7 GND VCC WE OE CE X (µ) -610 -360 230 480 740 990 1250 -60 210 1630 1630 1630 Y (µ) -1190 -1190 -1190 -1190 -1190 -1190 -1190 -1190 1230 1230 1000 -1220
Die Pad Coordinates
Signal Name A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 I / O0 I / O1 X (µ) -1130 -1420 -1420 -1370 -1370 -1140 -900 -660 680 920 1630 -870 -610 Y (µ) -1270 -1270 -920 950 1230 1230 1230 1230 1230 1230 -1000 -1190 -1190 Signal Name I / O2 I / O3 I / O4 I / O5 I / O6 I / O7 RDY / BSY GND VCC WE OE CE X (µ) -360 230 480 740 990 1250 -100 -60 210 450 1630 1630 Y (µ) -1190 -1190 -1190 -1190 -1190 -1190 1230 -1190 1230 1230 1000 -1220
Coordinates are calculated from die center point
Note:
Die size is subject to change. Contact the Atmel Sales Representative to confirm die size.
AT28C64 Die Map
Die Size: 88 X 139 mils Connect Substrate to Ground
AT28C64B Die Map
Die Size: 178 X 120 mils Connect Substrate to Ground
Die Pad Coordinates
Signal Name A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 I / O0 X (µ) -861 -1015 -1016 -987 -992 -838 -685 -532 343 496 908 872 -378 -655 Y (µ) -1604 -1613 -1459 1308 1461 1461 1461 1461 1461 1461 -1406 1506 1461 -1557 Signal Name I / O1 I / O2 I / O3 I / O4 I / O5 I / O6 I / O7 RDY / BSY GND VCC WE OE CE X (µ) -494 -337 58 223 389 546 703 -122 -141 32 189 870 903 Y (µ) -1557 -1557 -1557 -1557 -1557 -1557 -1557 1496 -1634 1471 1461 1294 -1557
Die Pad Coordinates
Signal Name A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 I / O0 X (µ) -1721 -1966 -2142 -2142 -2125 -1884 -1440 -1237 1657 1832 2035 2035 -1063 -1425 Y (µ) -1401 -1401 -1131 939 1171 1171 1171 1171 1171 1171 -1128 1171 1171 -1362 Signal Name I / O1 I / O2 I / O3 I / O4 I / O5 I / O6 I / O7 GND GND VCC VCC WE OE CE X (µ) -1126 -796 406 735 1035 1365 1664 57 -446 -443 -98 1272 2039 1954 Y (µ) -1362 -1362 -1362 -1362 -1362 -1362 -1362 -1353 -1353 1240 1240 1171 939 -1401
Coordinates are calculated from die center point Note:
Coordinates are calculated from die center point
Die size is subject to change. Contact the Atmel Sales Representative to confirm die size.
Die Products
AT28HC64B Die Map
Die Size: 178 X 120 mils Connect Substrate to Ground
AT28BV64 Die Map
Die Size: 100 X 168 mils Connect Substrate to Ground
AT28BV64
Die Pad Coordinates
Signal Name A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 I / O0 X (µ) -1721 -1966 -2142 -2142 -2125 -1884 -1440 -1237 1657 1832 2035 2035 -1063 -1425 Y (µ) -1401 -1401 -1131 939 1171 1171 1171 1171 1171 1171 -1128 1171 1171 -1362 Signal Name I / O1 I / O2 I / O3 I / O4 I / O5 I / O6 I / O7 GND GND VCC VCC WE OE CE X (µ) -1126 -796 406 735 1035 1365 1664 57 -446 -443 -98 1272 2039 1954 Y (µ) -1362 -1362 -1362 -1362 -1362 -1362 -1362 -1353 -1353 1240 1240 1171 939 -1401
Die Pad Coordinates
Signal Name A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 I / O0 X (µ) -921 -1078 -1113 -1080 -1075 -882 -721 -528 446 607 1097 1070 -367 -693 Y (µ) -1867 -1867 -1710 1702 1870 1870 1870 1870 1870 1870 -1720 1924 1870 -1826 Signal Name I / O1 I / O2 I / O3 I / O4 I / O5 I / O6 I / O7 RDY / BSY GND VCC WE OE CE X (µ) -507 -326 124 315 506 688 869 -77 -100 89 253 1060 1090 Y (µ) -1826 -1826 -1826 -1826 -1826 -1826 -1826 1924 -1910 1895 1870 1679 -1872
Coordinates are calculated from die center point Note:
Coordinates are calculated from die center point
Die size is subject to change. Contact the Atmel Sales Representative to confirm die size.
AT28BV64B Die Map
Die Size: 178 X 120 mils Connect Substrate to Ground
AT28C256 Die Map
Die Size: 178 X 242 mils Connect Substrate to Ground
AT28BV64B
Die Pad Coordinates
Signal Name A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 I / O0 X (µ) -1721 -1966 -2142 -2142 -2125 -1884 -1440 -1237 1657 1832 2035 2035 -1063 -1425 Y (µ) -1401 -1401 -1131 939 1171 1171 1171 1171 1171 1171 -1128 1171 1171 -1362 Signal Name I / O1 I / O2 I / O3 I / O4 I / O5 I / O6 I / O7 GND GND VCC VCC WE OE CE X (µ) -1126 -796 406 735 1035 1365 1664 57 -446 -443 -98 1272 2039 1954 Y (µ) -1362 -1362 -1362 -1362 -1362 -1362 -1362 -1353 -1353 1240 1240 1171 939 -1401
Die Pad Coordinates
Signal Name A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 X (µ) -1792 -2037 -2126 -2126 -2108 -1868 -1432 -1228 1658 1832 2035 2035 -1054 1454 -851 Y (µ) -2951 -2951 -2711 2490 2722 2722 2722 2722 2722 2722 -2677 2722 2722 2722 2722 Signal Name I / O0 I / O1 I / O2 I / O3 I / O4 I / O5 I / O6 I / O7 GND GND VCC VCC WE OE CE X (µ) -1416 -1117 -787 415 745 1044 1374 1673 -438 66 -435 -89 1280 2039 2035 Y (µ) -2911 -2911 -2911 -2911 -2911 -2911 -2911 -2911 -2902 -2902 2790 2790 2722 2490 -2951
Coordinates are calculated from die center point
Note:
Coordinates are calculated from die center point
Die size is subject to change. Contact the Atmel Sales Representative to confirm die size.
Die Products
AT28HC256 Die Map
Die Size: 178 X 242 mils Connect Substrate to Ground
AT28BV256 Die Map
Die Size: 178 X 242 mils Connect Substrate to Ground
AT28BV256
Die Pad Coordinates
Signal Name A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 X (µ) -1792 -2037 -2126 -2126 -2108 -1868 -1432 -1228 1658 1832 2035 2035 -1054 1454 -851 Y (µ) -2951 -2951 -2711 2490 2722 2722 2722 2722 2722 2722 -2677 2722 2722 2722 2722 Signal Name I / O0 I / O1 I / O2 I / O3 I / O4 I / O5 I / O6 I / O7 GND GND VCC VCC WE OE CE X (µ) -1416 -1117 -787 415 745 1044 1374 1673 -438 66 -435 -89 1280 2039 2035 Y (µ) -2911 -2911 -2911 -2911 -2911 -2911 -2911 -2911 -2902 -2902 2790 2790 2722 2490 -2951
Die Pad Coordinates
Signal Name A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 X (µ) -1792 -2037 -2126 -2126 -2108 -1868 -1432 -1228 1658 1832 2035 2035 -1054 1454 -851 Y (µ) -2951 -2951 -2711 2490 2722 2722 2722 2722 2722 2722 -2677 2722 2722 2722 2722 Signal Name I / O0 I / O1 I / O2 I / O3 I / O4 I / O5 I / O6 I / O7 GND GND VCC VCC WE OE CE X (µ) -1416 -1117 -787 415 745 1044 1374 1673 -438 66 -435 -89 1280 2039 2035 Y (µ) -2911 -2911 -2911 -2911 -2911 -2911 -2911 -2911 -2902 -2902 2790 2790 2722 2490 -2951
Coordinates are calculated from die center point
Note:
Coordinates are calculated from die center point
Die size is subject to change. Contact the Atmel Sales Representative to confirm die size.
AT28C010 Die Map
Die Size: 245 X 361 mils Connect Substrate to Ground
Indicates Double Bonding
Die Pad Coordinates
Signal Name A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 X (µ) -2647 -2875 -2960 -2960 -2973 -2973 -2673 -2433 2611 2857 2783 2857 -454 2384 2156 -226 2 Y (µ) -4318 -4318 -4053 -3825 3847 4112 4280 4280 4274 4067 -4200 3839 4274 4274 4274 4274 4274 Signal Name I / O0 I / O1 I / O2 I / O3 I / O4 I / O5 I / O6 I / O7 GND GND GND VCC VCC WE OE CE X (µ) -609 -274 62 950 1288 1623 1961 2296 311 530 688 286 575 1928 2783 2716 Y (µ) -4399 -4399 -4399 -4399 -4399 -4399 -4399 -4399 -4399 -4405 -4405 4310 4286 4274 -3973 -4444
Coordinates are calculated from die center point
Note: Die size is subject to change. Contact the Atmel Sales Representative to confirm die size.
Die Products
Atmel Headquarters
Corporate Headquarters
2325 Orchard Parkway San Jose, CA 95131 TEL (408) 441-0311 FAX (408) 487-2600
Atmel Operations
Atmel Colorado Springs
1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TEL (719) 576-3300 FAX (719) 540-1759
Europe
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Japan
Atmel Japan K.K. Tonetsu Shinkawa Bldg., 9F 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan TEL (81) 3-3523-3551 FAX (81) 3-3523-7581
Fax-on-Demand
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e-mail
literature@atmel.com
Web Site
http://www.atmel.com
are registered trademarks and trademarks of Atmel Corporation. Printed on recycled paper.
0554C-06 / 98 / xM
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