HTL194 EPITAXIAL PLANAR TRANSISTOR Description HTL194 d
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Spec. HE6549-B Issued Date 1993.04.12 Revised Date 2000.10.01 Page
HTL194
EPITAXIAL PLANAR TRANSISTOR
Description
HTL194 designed high voltage power switching applications especially telephone telecommunication circuits.
Absolute Maximum Ratings
Maximum Temperatures Storage Temperature +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage -400 VCEO Collector Emitter Voltage -400 Collector Current -300
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO ICBO ICEO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat) *hFE1 *hFE2 *hFE3 Min. -400 -400 Typ. Max. -0.2 -200 -1.2 -900 Unit Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 VCB=-400V, IE=0 VCE=-200V, IE=0 VEB=-6V, IC=0 IC=-20mA, IB=-2mA IC=-80mA, IB=-4mA IC=-20mA, IB=-2mA VCE=-10V, IC=-1mA VCE=-10V, IC=-20mA VCE=-10V, IC=-80mA VCE=-20V, IE=-10mA, f=1MHz VCB=-20V, f=1MHz, IE=0
*Pulse Test Pulse Width 380us, Duty Cycle2%
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
1000
Spec. HE6549-B Issued Date 1993.04.12 Revised Date 2000.10.01 Page
Saturation Voltage Collector Current
10000
Saturation Voltage (mV)
Current Gain-hFE
1000
VBE(sat) IC=10IB
VCE=10V
VCE(sat) IC=20IB VCE(sat) IC=10IB
1000
1000
Collector Current-IC (mA)
Collector Current-IC (mA)
Voltage Collector Current
10000
Capacitance Reverse-Biased Voltage
Voltage (mV)
Capacitance (pF)
1000
VBE(on) VCE=10V
1000
Collector Current-IC (mA)
Reverse-Biased Voltage
Safe Operating Area
1000
Collector Current-IC (mA)
PT=1ms PT=100ms PT=1s
1000
Forward Voltage-VCE
HSMC Product Specification
TO-92 Dimension
Spec. HE6549-B Issued Date 1993.04.12 Revised Date 2000.10.01 Page
Marking
HSMC Logo Part Number Date Code Rank Product Series
Laser Mark
HSMC Logo Product Series
Part Number
Mark Style 1.Emitter 2.Collector 3.Base
3-Lead TO-92 Plastic Package HSMC Package Code
*:Typical
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27
Notes 1.Dimension tolerance based Spec. dated Apr. 25,1996.
2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material
Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory
Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220
HSMC Product Specification
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