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HTL145 EPITAXIAL PLANAR TRANSISTOR Description HTL145 d
Top Searches for this datasheetSpec. HE6454-B Issued Date 1993.02.24 Revised Date 2000.10.01 Page HTL145 EPITAXIAL PLANAR TRANSISTOR Description HTL145 designed high voltage power switching applications especially telephone telecommunication circuits. Absolute Maximum Ratings Maximum Temperatures Storage Temperature +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (Ta=25°C) Maximum Voltages Currents (Ta=25°C) VCBO Collector Base Voltage VCEO Collector Emitter Voltage Collector Current Characteristics (Ta=25°C) Symbol BVCBO BVCEO ICBO ICER IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat) *hFE1 *hFE2 *hFE3 Min. Typ. Max. Unit Test Conditions IC=100uA IC=1mA VCB=500V VCE=200V VEB=6V IC=20mA, IB=2mA IC=100mA, IB=4mA IC=20mA, IB=2mA VCE=10V, IC=1mA VCE=10V, IC=20mA VCE=10V, IC=80mA VCE=20V, IE=10mA VCB=20V, f=1MHZ *Pulse Test Pulse Width 380us, Duty Cycle2% HSMC Product Specification Characteristics Curve Current Gain Collector Current 1000 10000 Spec. HE6454-B Issued Date 1993.02.24 Revised Date 2000.10.01 Page Saturation Voltage Collector Current VCE=10V Saturation Voltage (mV) 1000 VCE(sat) IC=10IB VCE(sat) IC=4IB 1000 1000 Collector Current (uA) Collector Current (mA) Sturation Voltage Collector Current 10000 Capacitance Reverse-Biased Voltage Saturation Voltage (mV) Capacitance (Pf) 1000 VBE(sat) IC=10IB 1000 Collector Current (mA) Reverse Biased Voltage Safe Operating Area 1000 PT=100ms PT=1s PT=1ms Collector Current (mA) 1000 Forward Voltage HSMC Product Specification TO-92 Dimension Spec. HE6454-B Issued Date 1993.02.24 Revised Date 2000.10.01 Page Marking HSMC Logo Part Number Date Code Rank Product Series Laser Mark HSMC Logo Product Series Part Number Mark Style 1.Emitter 2.Base 3.Collector 3-Lead TO-92 Plastic Package HSMC Package Code *:Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 Notes 1.Dimension tolerance based Spec. dated Apr. 25,1996. 2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office. Material Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance. Head Office Factory Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220 HSMC Product Specification Other recent searchesMC100E136 - MC100E136 MC100E136 Datasheet LM631 - LM631 LM631 Datasheet KSR2210 - KSR2210 KSR2210 Datasheet KSR1210 - KSR1210 KSR1210 Datasheet HIP2030 - HIP2030 HIP2030 Datasheet CDC111 - CDC111 CDC111 Datasheet CDCVF111 - CDCVF111 CDCVF111 Datasheet TLK3104SA - TLK3104SA TLK3104SA Datasheet
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