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HSMA5817 thru HSMA5819 AMP. SURFACE MOUNT SCHOTTKY BARRIER RECTIF


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Spec. Preliminary Data Issued Date 2000.01.15 Revised Date 2001.05.01 Page
HSMA5817 thru HSMA5819
AMP. SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS
Features
Forward Voltage Drop High Current Capability High Reliability High Surge Current Capability
Mechanical Data
Cases: Molded Plastic Epoxy: 94V-0 rate flame retardant Lead: Axial leads, solderable MIL-STD-202, Method guaranteed Polarity: Color band denotes cathode High temperature soldering guaranteed: 250°C/10 seconds/.375"(9.5mm) lead lengths lbs., (2.3kg) tension, Weight:0.33gram
Maximum Ratings Electrical Characteristics
Rating 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive inductive load. capacitive load, derate current 20%. Type Number Maximum Recurrent Peak Reverse Voltage Maximum Voltage Maximum Blocking voltage Maximum Average Forward Rectified Current Fig.1 Peak Forward Surge Current, 8.3ms Single Half Sine-wave Superimposed Rated Load(JEDEC method) Maximum Instantaneous Forward Voltage @1.0A Maximum D.C. Reverse Current (Note Rated Blocking Voltage Typical Thermal Resistance (Note Operating Junction Temperature Range Storage Temperature Range TSTG HSMA5817 HSMA5818 HSMA5819 Units 0.45 0.55 0.60 °C/W
0.5(@TA=25°C) 10(@TA=100°C) 5.0(@TA=100°C) +125 +150 +150
Notes: 1.Pulse Test with PW=300 usec, Duty Cycle Measured P.C. Board with 0.2x0.2"(5.0x5.0mm) Copper Areas.
HSMA5817, HSMA5818, HSMA5819
HSMC Product Specification
Characteristics Curve
Spec. Preliminary Data Issued Date 2000.01.15 Revised Date 2001.05.01 Page
HSMA5817, HSMA5818, HSMA5819
HSMC Product Specification
SMA/DO-214AC Dimension
Spec. Preliminary Data Issued Date 2000.01.15 Revised Date 2001.05.01 Page
*:Typical
Inches Min. Max. 0.5000 0.0642 0.0901 0.1150 0.1575 0.1811 0.0783 0.1028
Millimeters Min. Max. 1.27 1.63 2.29 2.92 4.00 4.60 1.99 2.61
Inches Min. Max. 0.0299 0.0598 0.0039 0.0079 0.1890 0.2201 0.0059 0.0122
Millimeters Min. Max. 0.76 1.52 0.10 0.20 4.80 5.59 0.15 0.31
Notes 1.Dimension tolerance based Spec. dated Mar. 6,2000.
2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory
Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931
HSMA5817, HSMA5818, HSMA5819
HSMC Product Specification

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