HMC260 GaAs MMIC FUNDAMENTAL MIXER, Typical Applications

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HMC260 GaAs MMIC FUNDAMENTAL MIXER, Typical Applications

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v01.0301
HMC260
GaAs MMIC FUNDAMENTAL MIXER,
Typical Applications
HMC260 ideal for: Point Point Radios Point Multi Point Radios
Features
Passive: Bias Required Input IP3: LO/RF Isolation: Small Size: 0.55mm2
Functional Diagram
General Description
HMC260 passive double balanced mixer that used upconverter downconverter between GHz. miniature monolithic mixer (MMIC) requires external components matching circuitry. HMC260 provides excellent suppression optimized balun structures. mixer operates with drive levels above dBm. Measurements were made with chip mounted bonded into test fixture. Data includes parasitic effects wire bond assembly. Connections were made with ribbon bond with minimal length (<12 mil).
MIXERS CHIP
Electrical Specifications, +25°
dBm, Parameter Min. Frequency Range, Frequency Range, Conversion Loss Noise Figure (SSB) Isolation Isolation Isolation (Input) (Input) Gain Compression (Input) Typ. 10.5 10.5 Max. Units
*Unless otherwise noted, measurements performed downconverter, GHz.
price, delivery, place orders, please contact Hittite Microwave Corporation: Elizabeth Drive, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online www.hittite.com
v01.0301
HMC260
GaAs MMIC FUNDAMENTAL MIXER,
Conversion Gain Temperature
Isolation
RF/IF LO/RF LO/IF
CONVERSION GAIN (dB)
ISOLATION (dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
MIXERS CHIP
Conversion Gain Drive
Return Loss
CONVERSION GAIN (dB)
RETURNLOSS (dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
Bandwidth
Upconverter Performance Conversion Gain
CONVERSION GAIN (dB)
RESPONSE (dB)
Return Loss Conversion Gain
FREQUENCY (GHz)
FREQUENCY (GHz)
price, delivery, place orders, please contact Hittite Microwave Corporation: Elizabeth Drive, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online www.hittite.com
v01.0301
HMC260
GaAs MMIC FUNDAMENTAL MIXER,
Input Drive
Input Temperature
THIRD ORDER INTERCEPT (dBm)
THIRD ORDER INTERCEPT (dBm)
MIXERS CHIP
SECOND ORDER INTERCEPT (dBm)
FREQUENCY (GHz)
FREQUENCY (GHz)
Input Drive
FREQUENCY (GHz)
Input Temperature
SECOND ORDER INTERCEPT (dBm)
FREQUENCY (GHz)
Input P1dB Temperature
Spurious Outputs
>110 >110
P1dB (dBm)
FREQUENCY (GHz)
values below output power level.
Two-tone input power each tone, spacing. price, delivery, place orders, please contact Hittite Microwave Corporation: Elizabeth Drive, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online www.hittite.com
v01.0301
HMC260
GaAs MMIC FUNDAMENTAL MIXER,
Absolute Maximum Ratings
Input Drive Storage Temperature Operating Temperature Current +150
MIXERS CHIP
Outline Drawing
(See Handling Mounting Bonding Note)
NOTES: DIMENSIONS INCHES [MM]. THICKNESS .004". TYPICAL BOND .004" SQUARE. BOND SPACING CENTER CENTER .006". BACKSIDE METALLIZATION: GOLD. BOND METALLIZATION: GOLD. BACKSIDE METAL GROUND. CONNECTION REQUIRED UNLABELED BOND PADS.
price, delivery, place orders, please contact Hittite Microwave Corporation: Elizabeth Drive, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online www.hittite.com
v01.0301
HMC260
GaAs MMIC FUNDAMENTAL MIXER,
Assembly Techniques
Ribbon Bond Ribbon Bond
MIXERS CHIP
Mounting Bonding Techniques Millimeterwave GaAs MMICs
should attached directly ground plane eutectically with conductive epoxy (see general Handling, Mounting, Bonding Note). Microstrip transmission lines 0.127mm mil) thick alumina thin film substrates recommended bringing from chip (Figure 0.254mm mil) thick alumina thin film substrates must used, should raised 0.150mm mils) that surface coplanar with surface substrate. accomplish this attach 0.102mm mil) thick 0.150mm mil) thick molybdenum heat spreader (moly-tab) which then attached ground plane (Figure Microstrip substrates should brought close possible order minimize ribbon bond length. Typical die-to-substrate spacing 0.076mm mils). Gold ribbon 0.075 mil) width minimal length <0.31 (<12 mils) recommended minimize inductance ports.
price, delivery, place orders, please contact Hittite Microwave Corporation: Elizabeth Drive, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online www.hittite.com
v01.0301
HMC260
GaAs MMIC FUNDAMENTAL MIXER,
GaAs MMIC SUB-HARMONICALLY PUMPED MIXER Handling Precautions
Follow these precautions avoid permanent damage. Cleanliness: Handle chips clean environment. attempt clean chip using liquid cleaning systems. Static Sensitivity: Follow precautions protect against 250V strikes. Transients: Suppress instrument bias supply transients while bias applied. shielded signal bias cables minimize inductive pick-up. General Handling: Handle chip along edges with vacuum collet with sharp pair bent tweezers. surface chip fragile bridges should touched with vacuum collet, tweezers, fingers.
Mounting
chip back-metallized mounted with AuSn eutectic preforms with electrically conductive epoxy. mounting surface should clean flat. Eutectic Attach: 80/20 gold preform recommended with work surface temperature tool temperature When 90/10 nitrogen/hydrogen applied, tool temperature should expose chip temperature greater than more than seconds. more than seconds scrubbing should required attachment. Epoxy Attach: Apply minimum amount epoxy mounting surface that thin epoxy fillet observed around perimeter chip once placed into position. Cure epoxy manufacturer's schedule.
MIXERS CHIP
Wire Bonding
bonds made with 0.003" 0.0005" ribbon recommended. These bonds should thermosonically bonded with force 4060 grams. bonds 0.001" (0.025 diameter, thermosonically bonded, recommended. Ball bonds should made with force 40-50 grams wedge bonds 18-22 grams. bonds should made with nominal stage temperature minimum amount ultrasonic energy should applied achieve reliable bonds. bonds should short possible, less than mils (0.31 mm).
price, delivery, place orders, please contact Hittite Microwave Corporation: Elizabeth Drive, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online www.hittite.com

HMC260 GaAs MMIC FUNDAMENTAL MIXER, Typical Applications

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