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91-20221 Gate Drive Unit Replaces March 1998 version, DS4569
Top Searches for this datasheet20221 91-20221 Gate Drive Unit Replaces March 1998 version, DS4569-3.1 DS4569-4.0 January 2000 This datasheet should used conjunction with application note AN4571, GDU9X-XXXXX Series, Gate Drive Unit. APPLICATIONS Used with Gate Turn-Off Thyristors high current switching applications PARAMETERS IFGM IG(ON) dIGQ/dt 30A/µs CONDITIONS (UNLESS STATED OTHERWISE) Test circuit connection Test circuit emitter gate drive emitter Test circuit emitter current Test circuit receiver gate drive receiver +15V DG408BP 500mm cable type RC5327230 Hewlett Packard versatile link HFBR1524 30mA Hewlett Packard versatile link HFBR2524 -15V ELECTRICAL CHARACTERISTICS Symbol V1(Min) V2(Min) V3(Min) IFGM IG(ON) dIFG/dt dIGQ/dt Parameter current +15V current -15V current minimum +15V minimum -15V minimum Peak forward gate current On-state gate current Rate rise positive gate current Rate rise negative gate current Conditions 500Hz, duty cycle 500Hz 500Hz, 1000A 125°C Min. Typ. Max. 0.55 Units A/µs A/µs 14.0 14.0 Measured IFGM 1000A, IG(ON) IGQM 20221 TIMING CHARACTERISTICS Symbol Parameter response pulse width input signal Delay time emitter current receiver Turn-on delay emitter current IFGM IFGM pulse width Minimum time IFGM IG(ON) Receiver storage time Turn-off delay. Emitter current IG(ON) Minimum time IG(ON) IFGM Delay time Gate volts emitter current Turn-off delay Gate volts test receiver Storage time Gate volts emitter current Turn-on delay Gate volts test receiver Conditions Adjustable Min. Typ. Max. Units Adjustable 0.11 0.31 Adjustable Measured IGQM Measured IGQM t1,t3,t5,t8 factory settings. Adjustment alters Varies with IGQM gate lead impedance. Test circuit emitter current Control card receiver output IFGM Gate Drive Unit Waveforms 10µs dIFG/dt Min. time dIGQ/dt Min. IG(ON) QGQT IGQM Gate current Gate voltage Control card emitter current Test circuit receiver output 20221 OUTLINE Clearance underneath P.C.B. mounting nuts etc. -15V +15V Fibre optics centres Gate Cathode holes centres Weight: 1.16Kg dimensions unless stated otherwise. SCALE. 20221 POWER ASSEMBLY CAPABILITY Power Assembly group provide support service those customers requiring more than basic semiconductor, developed flexible range heatsink clamping systems line with advances device types voltage current capability semiconductors. offer extensive range liquid cooled assemblies covering full range circuit designs general today. Assembly group continues offer high quality engineering support dedicated designing units satisfy growing needs customers. Using date methods team design applications engineers provide Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require correct clamping force ensure their safe operation. PACs range offers varied selection preloaded clamps suit manufactured devices. This include cube clamps single side cooling 22mm Clamps available single double side cooling, with high insulation versions high voltage assemblies. Please refer application note device clamping, AN4839 HEATSINKS Power Assembly it's proprietary range extruded aluminium heatsinks. They have been designed optimise performance semiconductors. Data with respect natural, forced liquid cooling (with flow rates) available request. further information device clamps, heatsinks assemblies, please contact your nearest Sales Representative factory. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR Doddington Road, Lincoln. Lincolnshire. 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit Antares Drive, Nepean, Ontario, Canada 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy Spain Tel: (0)1 Fax: (0)1 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 Germany, Scandinavia Rest World Tel: (0)1522 500500. Fax: (0)1522 500020 SALES OFFICES France, Benelux, Italy Spain Tel: (0)1 Fax: (0)1 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) Tel: (831) 440-1988. Fax: (831) 440-1989 Tel: (949) 733-3005. Fax: (949) 733-2986. Germany, Scandinavia Rest World Tel: (0)1522 500500. Fax: (0)1522 500020 These offices supported Representatives Distributors many countries world-wide. Dynex Semiconductor 2000 Publication DS4569-4 Issue January 2000 TECHNICAL DOCUMENTATION RESALE. PRINTED UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets right hard corner front page, indicate product status. annotations follows:Target Information: This most tentative form information represents very preliminary specification. actual design work product been started. Preliminary Information: product design development. datasheet represents product understood details change. Advance Information: product design complete final characterisation volume production well hand. Annotation: product parameters fixed product available datasheet specification. This publication issued provide information only which (unless agreed Company writing) used, applied reproduced purpose form part order contract regarded representation relating products services concerned. warranty guarantee express implied made regarding capability, performance suitability product service. Company reserves right alter without prior notice specification, design price product service. Information concerning possible methods provided guide only does constitute guarantee that such methods will satisfactory specific piece equipment. user's responsibility fully determine performance suitability equipment using such information ensure that publication data used date been superseded. These products suitable medical products whose failure perform result significant injury death user. products materials sold services provided subject Company's conditions sale, which available request. brand names product names used this publication trademarks, registered trademarks trade names their respective owners. 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