ZENER DIODES FEATURES VOLTAGE RANGE HERMETICALLY SEALED PLASTIC C

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ZENER DIODES FEATURES VOLTAGE RANGE HERMETICALLY SEALED PLASTIC C

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BZV47C5V1
ZENER DIODES
FEATURES VOLTAGE RANGE HERMETICALLY SEALED PLASTIC CASE F126 PACKAGE HIGH SURGE CAPABILITY
DESCRIPTION silicon Zener diodes. F126
ABSOLUTE RATINGS (Tamb 25°C)
Symbol Tstg Parameter Value Tamb 55°C Unit
Power dissipation infinite heatsink Storage temperature range Maximum junction temperature
Maximum lead temperature soldering during from case
THERMAL RESISTANCES
Symbol (j-l) (j-a) Parameter Value Unit °C/W °C/W
Junction lead Junction ambient printed circuit recommended layout
January 1998
BZV47C5V1 BZV47C200
ELECTRICAL CHARACTERISTIC (Tamb 25°C)
TYPES min. max. BZV47C5V1 BZV47C5V6 BZV47C6V2 BZV47C7V5 BZV47C10 BZV47C12 BZV47C15 BZV47C18 BZV47C20 BZV47C22 BZV47C24 BZV47C27 BZV47C30 BZV47C36 BZV47C39 BZV47C47 BZV47C68 BZV47C100 BZV47C150 BZV47C200 11.4 13.8 16.8 18.8 20.8 22.8 25.1 10.6 12.7 15.6 19.1 21.2 23.3 25.6 28.9 rZK/ max. 10-4/°C 11.4 13.7 15.2 16.7 18.2 20.5 22.8 27.4 29.6 35.7 51.7 typ. max. Tamb=55°C 12.8 IZSM 0.85 0.59 0.27 0.20
Note Pulse test 50ms Note infinite heatsink 10mm Note rectangular waveform 10ms) Forward voltage drop (Tamb 25°C, 500mA)
Fig. Power dissipation versus ambient temperature.
Fig. :Thermal resistance versus lead length.
BZV47C5V1 BZV47C200
Fig. Relative variation thermal impedance junction ambient versus pulse duration board FR4, Lleads 10mm). Fig. Junction capacitance versus reverse voltage applied (typical values).
Fig. Peak forward current versus peak forward voltage drop (typical values).
Fig. Leakage current versus regulation voltage (typical values).
IR(µA) 1E+2
150°C 0.75*VZT
1E+1 1E+0 1E-1 1E-2
1E-3
Fig. Differential resistance versus regulation voltage (typical values).
Fig. Peak pulse power versus pulse duration (rectangular waveform, maximum values).
BZV47C5V1 BZV47C200
MARKING Logo, Date Code, Type Code, Cathode Band (for unidirectional types only). ORDER CODE BZV47C
Type
Nominal Voltage
PACKAGE MECHANICAL DATA F126 (Plastic) DIMENSIONS REF. Millimeters Min.
6.05 2.95 0.76 3.00 0.81
Inches Typ. Max.
0.244 0.250 1.220 0.118 0.032 0.120 0.034 0.050
Typ. Max. Min.
6.20 6.35 3.05 0.86 1.27 0.238 1.024 0.116 0.030
Note1 Thelead notcontrolled within zoneL1.
Packaging standard packaging tape reel. Weight 0.40
Information furnished believed accurate reliable. However, SGS-THOMSON Microelectronics assumes responsibility consequences such information infringement patents other rights third parties which result from use. license granted implication otherwise under patent patent rights SGS-THOMSON Microelectronics. Specifications mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. SGS-THOMSON Microelectronics products authorized critical components life support devices systems without express written approval SGS-THOMSON Microelectronics.
1998 SGS-THOMSON Microelectronics Printed Italy rights reserved. SGS-THOMSON Microelectronics GROUP COMPANIES Australia Brazil Canada China France Germany Italy Japan Korea Malaysia Malta Morocco Netherlands Singapore Spain Sweden Switzerland Taiwan Thailand United Kingdom U.S.A.

ZENER DIODES FEATURES VOLTAGE RANGE HERMETICALLY SEALED PLASTIC C

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