Altera Devices January 1999, ver. Introduction Surface-

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

Altera Devices January 1999, ver. Introduction Surface-

Datasheet Thumbnail

Top Searches for this datasheet

Selecting Sockets
Altera Devices
January 1999, ver.
Introduction
Surface-mount assembly places unique demands development manufacturing process requiring different symbols printed circuit board (PCB) layout, different soldering processes production (reflow wave solder), different test reliability issues. Socketing surface-mount devices allows ease some demands surface-mount assembly. Conventional mounting techniques used socketed devices, either through-hole soldering them mounting them onto socketed carrier board wire-wrap applications. This application note discusses following topics:
Mechanical considerations J-lead sockets Socket evaluation J-lead packages Socket evaluation quad flat pack (QFP) packages Socket evaluation ball-grid array (BGA) packages (including FineLine BGApackages) Socket evaluation pin-grid array (PGA) packages Packaging operations wire-wrap applications Socket insertion/extraction tool manufacturers
Mechanical Considerations J-Lead Sockets
J-lead devices make contact with electrical sockets from either bottom side leads. Depending devices held place, sockets bend leads make electrical contact unreliable. Accordingly, must consider type package, number device insertions removals, amount lead deformation before choosing socket. Once design enters production phase, cost becomes major concern. result, low-cost production sockets, designed hold device permanently securely, available. However, these sockets must exert reasonable force device leads prevent device from popping socket. After several insertions, this force deform leads, causing them short fail make contact rendering device unusable. Therefore, Altera strongly recommends using burn-in socket during design development phases project, low-cost production socket during production phase. Burn-in sockets zero-insertion-force (ZIF) sockets that deform device's leads.
Altera Corporation
A-AN-080-03
Selecting Sockets Altera Devices
Production sockets must chosen carefully. device must removed more than times, Altera recommends using non-deforming, lowinsertion-force (burn-in) sockets. high-stress environments (e.g., strong G-forces, thermal shock, high humidity), sockets with high-insertion forces optional retention clips needed. reduce possibility damaging device pins, most high-quality sockets include standoff mechanism that prevents device from being forced into socket.
Socket Evaluation J-Lead Packages
Altera tested available production sockets with 44-, 68-, 84-pin windowed ceramic J-lead chip carrier (JLCC) packages. Although tests were performed using JLCC packages, following information also applies plastic J-lead chip carrier (PLCC) packages. Each socket subjected three tests:
change between corner pins each device measured before after each insertions. Each socket wired series tested open circuits lasting longer than This open circuit test performed while socket attached vibration block. amplitude vibration peak-to-peak frequency that oscillated between 1-minute cycles hours. vibration test performed three axes temperature actual point contact between socket device lead photographed determine direction forces amount surface contact between them.
Altera Corporation
Selecting Sockets Altera Devices
Altera tested sockets from eight manufacturers. Tables through show results 44-, 68-, 84-pin production sockets that passed open-and-short circuit test. Sockets ranked their ability maintain device's integrity after multiple device insertions.
Table Summary 44-Pin Production Socket Analysis
Vendor Part Number
Thomas Betts Corporation PCS-044A-1 AMP, Inc. 821575-1
Comments
Least deformation. Contact force downward component. retainer clip option. Moderate deformation. Contact force downward component. retainer clip option.
Table Summary 68-Pin Production Socket Analysis
Vendor Part Number
Thomas Betts Corporation PCS-068A-1 ITT/Cannon Corporation LCS-68-12 AMP, Inc. 821574-1
Comments
Least deformation. Contact force downward component. retainer clip option. deformation. Contact force downward component. retainer clip option. Moderate deformation. Contact force downward component. retainer clip option.
Table Summary 84-Pin Production Socket Analysis
Vendor Part Number
Thomas Betts Corporation PCS-084A-1 ITT/Cannon Corporation LCS-84-12 AMP, Inc. 822281-1 (for surface mount) AMP, Inc. 821573-1 QILE-84P-410T
Comments
Least deformation. Contact force downward component. retainer clip option. Moderate deformation. Contact force downward component. retainer clip option. Moderate deformation. Contact force downward component. retainer clip option. Designed plastic packages. Large deformation. Very tight fit. retainer clip option. deformation, Altera recommends maximum three insertions. Designed ceramic packages. Large deformation. Very tight fit. retainer clip option. deformation, Altera recommends maximum three insertions.
Altera Corporation
Selecting Sockets Altera Devices
Vendors provide additional information about their products, such material selection, prevention solder ingress during wave soldering, lead shape. Altera recommends qualifying sockets before committing particular vendor. Table shows contact distances Altera® packages. These measurements should used select socket, preferably with internal stand-offs, with Altera devices.
Contact Distance
Table Device Contact Distances
Package
PLCC PLCC, JLCC PLCC, JLCC PLCC, JLCC PLCC, JLCC
Pins
Contact Distance (Minimum mils)
1,185
Contact Distance (Maximum mils)
1,195
Socket Evaluation Packages
Because packages more susceptible lead deformation, production sockets must rigorously qualified. Altera recommends using burn-in socket packages because socket's reliability. While sockets should always qualified, Table suggests sockets based number pins type package.
Table Socket Vendor Information Packages
Package Type
Thin quad flat pack (TQFP) Plastic quad flat pack (PQFP) TQFP PQFP Ceramic quad flat pack (CQFP) TQFP PQFP TQFP PQFP PQFP Power quad flat pack (RQFP) (square heat sink) RQFP (round heat sink) CQFP RQFP (square heat sink) RQFP (round heat sink) RQFP
Number Pins
Socket Vendor
Yamaichi Yamaichi Yamaichi Yamaichi Yamaichi Yamaichi Yamaichi Yamaichi Yamaichi Yamaichi Yamaichi Yamaichi Yamaichi Yamaichi Yamaichi Yamaichi
Part Number
IC51-0324-1498 IC51-467-KS11258 IC51-0444-1568 IC51-1004-814-2 IC51-1004-814-2 IC51-1004-809 IC51-1324-828 IC51-1444-1354-7 IC51-1604-845-4 IC51-2084-1052-11 IC51-2084-1052-11 IC51-1052KS-13087 IC51-1509-KS14057 IC51-1655KS-13666 IC51-2404-1655-2 IC51-3044-1471-2 Altera Corporation
Selecting Sockets Altera Devices
Socket Evaluation Packages
Table lists socket vendor information Altera FineLine packages.
Table Socket Vendor Information Packages
Package Type
Ball Pitch (mm) Number Pins Socket Vendor
1.50 1.27 Enplas Yamaichi Yamaichi Loranger Loranger Loranger Loranger
Part Number
BGA-225-1.5-01A NP276-37206-AC03327 8227-256-1-00 8235-356-1-00 8235-356-0-00 NP276-100522-AC09796 110SQ-100B6617 170SQ-256B6618C 230SQ-484B6617 270SQ-672B6617
FineLine
1.00
Note:
These socket recommendations change package enhancements. Please contact Altera Applications more information.
Socket Evaluation Packages
Table lists socket vendor information packages.
Table Socket Vendor Information Packages
Number Pins
Socket Vendor
Yamaichi Berg Electronics Mill-Max
Part Number
NP178-64401-KS14828 1-382320-7
382876-6 NP236-102002-AC01601 2-0503-01357-050-019-002
(1), Yamaichi 3M/Textool Berg Electronics Mill-Max
NP236-102002-AC05625
Yamaichi Berg Electronics Mill-Max
Altera Corporation
Selecting Sockets Altera Devices Notes:
sockets available 403- 503-pin packages. This low-profile socket standard part number. Contact vendor more information. Although socket created 560-pin packages, compatible with 503-pin packages.
Table lists socket tools inserting extracting packages non-ZIF sockets.
Table Socket Tools Package Insertion Extraction Non-ZIF Sockets
Action
Insertion Extraction
Tool Vendor
Com-Kyl Com-Kyl
Part Number
181-MIC 281-MIC
Packaging Operations Wire-Wrap Applications
Wire-wrap applications require through-hole mount that compatible with J-lead package. sockets specified typically conform mechanically most wire-wrap panels. Wire-wrap cards have machined receptacles rows with 100-mil spacing between receptacles 300-mil spacing between rows. Carrier boards provide effective bridge gap. Mounting socket carrier board provides convenience wire wrap, while occupying relatively small area device. Some carrier boards have signal routing with shorter paths bends minimize signal reflection. Table shows telephone numbers various socket manufacturers. Contact appropriate manufacturer additional information.
Socket Insertion/ Extraction Tool Manufacturers
Table Socket Insertion/Extraction Tool Manufacturers
Product
Production sockets
(Part
Telephone Number
(800) 328-0411 (800) 522-6752 (508) 699-9800 (408) 946-9666 (714) 557-4700 (510) 651-2700 (516) 922-6000 (612) 452-8100
Company
3M/Textool Corporation AMP, Inc. Thomas Betts Corporation Framatome Connectors International (FCI) ITT/Cannon Corporation Berg Electronics Mill-Max IronWood Electronics
Altera Corporation
Selecting Sockets Altera Devices
Table Socket Insertion/Extraction Tool Manufacturers
Product
Test burn-in sockets
(Part
Telephone Number
(800) 328-0411 (800) 522-6752 (401) 823-5200 (81) 0482-53-3131 (408) 982-0660 (408) 456-0797 (408) 749-8124 (612) 452-8100 (401) 823-5200 (408) 982-0660
Company
3M/Textool Corporation AMP, Inc. Advanced Interconnections Corporation Dai-Ichi Seiko Company, Ltd. (Japan) Emulation Technology, Inc. Yamaichi Enplas IronWood Electronics Advanced Interconnections Corporation Emulation Technology, Inc.
Carrier boards wire-wrap adapters socket insertion/ extraction tools
Com-Kyl
(408) 734-9660
Conclusion
Information this application note based tests performed Altera information provided Altera various vendors. Altera assumes liability third-party products mentioned this document.
Altera Corporation
Selecting Sockets Altera Devices
Innovation Drive Jose, 95134 (408) 544-7000 http://www.altera.com Applications Hotline: (800) 800-EPLD Customer Marketing: (408) 544-7104 Literature Services: (888) 3-ALTERA lit_req@altera.com
Altera FineLine trademarks and/or service marks Altera Corporation United States other countries. Altera acknowledges trademarks other organizations their respective products services mentioned this document. Altera products protected under numerous U.S. foreign patents pending applications, maskwork rights, copyrights. Altera warrants performance semiconductor products current specifications accordance with Altera's standard warranty, reserves right make changes products services time without notice. Altera assumes responsibility liability arising application information, product, service described herein except expressly agreed writing Altera Corporation. Altera customers advised obtain latest version device specifications before relying published information before placing orders products services. Copyright 1999 Altera Corporation. rights reserved.
Printed Recycled Paper.
Altera Corporation

Altera Devices January 1999, ver. Introduction Surface-

Top Searches for this datasheet

Other recent searches