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CMOS 8-bit Single Chip Microcomputer Description CXP750000 CMOS 8


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CXP750000
CMOS 8-bit Single Chip Microcomputer
Description CXP750000 CMOS 8-bit single chip microcomputer piggyback/evaluator combined type, which developed evaluating function CXP750096/750010. Note that CXP750000 corresponds custom font.
Piggy/evaluation chip
PQFP (Ceramic)
PSDIP (Ceramic)
Features wide instruction (211 instructions) which covers various types data 16-bit operation/multiplication division/ Boolean Structure operation instructions Silicon gate CMOS Minimum instruction cycle 167ns 24MHz operation 250ns 16MHz operation 122µs 32kHz operation Applicable EPROM CXP27C702K (Maximum 120K bytes available.) Incorporated 2496 bytes (Excludes VRAM on-screen display EPROM custom font bytes Peripheral functions converter bits, channels, successive approximation method (Conversion time 3.25µs 16MHz) Serial interface 8-bit clock sync type, channel Timer 8-bit timer 8-bit timer/counter 19-bit time-base timer 32kHz timer/counter On-screen display (OSD) dots, character types, character colors, characters lines frame background colors/half blanking background full screen colors/half blanking edging/shadowing/rounding every line background with shadow every character, double scanning sprite OSD; dots, screen, colors every interface output bits, channels bits, channel Remote control unit receive circuit 8-bit pulse measurement counter, 6-stage FIFO HSYNC counter channels Watchdog timer Interruption factors, vectors, multi-interruption possible Standby mode Sleep Package CXP750000 64-pin ceramic PQFP/PSDIP (Supports custom font) Note) Mask option depends type CXP750000. Refer Product List details.
Perchase Sony's components conveys licence under Philips Patent Rights these components system, provided that system conforms Standard Specifications defined Philips. Sony reserves right change products specifications without prior notice. This information does convey license implication otherwise under patents other right. Application circuits shown, any, typical examples illustrating operation devices. Sony cannot assume responsibility problems arising these circuits.
E98613-PS
CXP750000
CXP750000 Assignment Piggyback Mode (Top View)
PC6/PWM6
PC7/PWM7
PD6/RMC
PD7/EC
PD5/HS1 PD4/HS0 PD3/SI PD2/SO PD1/SCK PD0/INT2 PA7/HSYNC PA6/VSYNC XTAL EXTAL PA5/AN5 PA4/AN4 PA3/AN3 PA2/AN2 PA1/AN1 PA0/AN0
PF0/PWM0
PF3/PWM3 PF4/SCL0 PF5/SCL1/PWM4 PF6/SDA0 PF7/SDA1/PWM5 PE0/TO/ADJ PE1/PWM PE2/TEX/INT0 PE3/TX EXLC PE4/YM PE5/YS PE6/I
PF1/PWM1
PF2/PWM2
Note) (Pin left open. (Pins both connected GND.
PG/7INT1
CXP750000
CXP750000 Assignment Evaluator Mode (Top View)
PC6/PWM6
PC7/PWM7
PD6/RMC
PD7/EC
PD5/HS1 PD4/HS0 PD3/SI PD2/SO PD1/SCK PD0/INT2 PA7/HSYNC PA6/VSYNC XTAL EXTAL PA5/AN5 PA4/AN4 PA3/AN3 PA2/AN2 PA1/AN1 PA0/AN0
PF0/PWM0
PF3/PWM3 PF4/SCL0 PF5/SCL1/PWM4 PF6/SDA0 PF7/SDA1/PWM5 PE0/TO/ADJ PE1/PWM PE2/TEX/INT0 PE3/TX EXLC PE4/YM PE5/YS PE6/I
A7/D7
PF1/PWM1
PF2/PWM2
HALT
A6/D6 A5/D5 A4/D4 A3/D3 A2/D2 A1/D1 A0/D0
SYNC
Note) (Pin left open. (Pins both connected GND.
PG7/INT1
CXP750000
CXP750000 Assignment Piggyback Mode (Top View)
PD7/EC PD6/RMC PD5/HS1 PD4/HS0 PD3/SI PD2/SO PD1/SCK PD0/INT2 PA7/HSYNC PA6/VSYNC XTAL EXTAL PA5/AN5 PA4/AN4 PA3/AN3 PA2/AN2 PA1/AN1 PA0/AN0 PG7/INT1
PC6/PWM6 PC7/PWM7 PF0/PWM0 PF1/PWM1 PF2/PWM2 PF3/PWM3 PF4/SCL0 PF5/SCL1/PWM4 PF6/SDA0 PF7/SDA1/PWM5 PE0/TO/ADJ PE1/PWM PE2/TEX/INT0 PE3/TX EXLC PE4/YM PE5/YS PE6/I
programming
Note) (Pin left open. (Pins both connected GND.
CXP750000
CXP750000 Assignment Evaluator Mode (Top View)
PD7/EC PD6/RMC PD5/HS1 PD4/HS0 PD3/SI PD2/SO PD1/SCK PD0/INT2 PA7/HSYNC PA6/VSYNC XTAL EXTAL PA5/AN5 PA4/AN4 PA3/AN3 PA2/AN2 PA1/AN1 PA0/AN0 PG7/INT1
PC6/PWM6 PC7/PWM7 PF0/PWM0 PF1/PWM1 PF2/PWM2 PF3/PWM3 PF4/SCL0 PF5/SCL1/PWM4 PF6/SDA0 PF7/SDA1/PWM5 PE0/TO/ADJ PE1/PWM PE2/TEX/INT0 PE3/TX EXLC PE4/YM PE5/YS PE6/I
A7/D7
A6/D6 A5/D5 A4/D4 A3/D3 A2/D2 A1/D1 A0/D0
HALT
programming
SYNC
Note) (Pin left open. (Pins both connected GND.
CXP750000
EPROM Read Timing +75°C, 5.5V, Item Address data input delay time Address data hold time Symbol Pins Min. Max. Unit
tACC
0.8VDD Address data 0.2VDD tACC 0.8VDD Input data 0.2VDD
Product List Products Optional item Mask CXP750096 Package capacity Reset pull-up resisto Font data CXP750010 Piggy/evaluation chip CXP750000-U01Q CXP750000-U01S 64-pin ceramic PQFP 64-pin ceramic PSDIP
64-pin plastic SDIP/QFP bytes 120K bytes
EPROM 120K bytes Existent EPROM bytes
Existent/Non-existent User data
CXP750000
CXP750000 Piggyback mode evaluator mode switched shown below.
Piggyback mode
Evaluator mode
type EPROM
CXP750000
probe marking
index EPROM marking
Note)
index Note) Evaluation should connected probe.
CXP750000
Piggy/Evaluation Chip Corresponds Custom Font CXP750000 piggy/evaluation chip which corresponds custom font. This incorporates EPROM font data block. This shipped blank status, write EPROM using exclusive write adaptor. exclusive font editor (SFE700II) generating font data. Write mode Write voltage Write pulse width Write type Starting address write Ending address write Write adaptor1 SUNHAYATO Corp. made 12.75V 100µs 27C020 20000h 38BFFh SDIP: SEK7500P10-64S (Upper board) QFP: SEK750000-64Q (Upper board) Lower board: SEK-32DP-DWN2 Intel method
Font Data Block Memory
20000h character (lower) 24000h character (medium) 28000h character (upper) 2C000h Unused
30000h 30C00h 34000h 34C00h 38000h 38C00h
Graphic character (lower)
Unused
Graphic character (medium)
Unused
Graphic character (upper)
Unused 3FFFFh Fill writer memory with FFh.
CXP750000
Package Outline
Unit:
64PIN PQFP (CERAMIC)
INDEX INDEX 18.7 16.3 No.1 INDEX
0.05
22.3 0.25
24.7
1.27 0.13
0.08
18.12
12.02
14.22
1.05
0.75
9.48 11.66 15.58
PACKAGE STRUCTURE
PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE PQFP-64C-L02 AQFP064-C-0000-B LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT CERAMIC GOLD PLATING ALLOY 5.2g
3.57 0.36
0.05 0.15 0.02
CXP750000
Package Outline
Unit:
64PIN PSDIP(CERAMIC)
58.90 0.55 18.12 20.0
18.75 0.25
INDEX 1.27 0.13
1.27 0.25
0.46 0.08
1.778
PACKAGE STRUCTURE
PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE PSDIP-64C-03 ADIP064-C-0750 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS CERAMIC GOLD PLATING ALLOY 19.2g
3.43 0.38
11.24
0.05 0.25 0.02
19.05 0.25
15.85
17.5 0.17

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