Silicon Protection Circuits Avalanche Diode Array Bipolar Chip Sc

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Silicon Protection Circuits Avalanche Diode Array Bipolar Chip Sc

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Silicon Protection Circuits
Avalanche Diode Array Bipolar Chip Scale Package
SP0504BBC, SP0508BBC, SP0516BBC
This family avalanche diode arrays designed protection offered ultra small chip scale package. multi-channel devices used help protect sensitive digital analog input circuits data, signal, control lines with Bipolar voltage levels 5VDC. array ideal protection when signals present. state-of-the-art structure designed suppress other transient over-voltage events meet International Electrotechnical Compatability (EMC transient immunity stantards 61000-4-2 Electrostatic Discharge Requirements). monolithic silicon devices comprised specially designed structures transient voltage suppression (TVS). size shape these structures been tailored transient protection. capacitance clamp voltage ideal high speed signal line protection.
Ordering Information
NOTE: Bump pitch 0.65mm Diode Channels Package Size (mm) 1.804 1.154 3.104 1.154 3.104 2.454 Quantity Reel 3500 3500 3500
Part Number SP0504BBCT SP0508BBCT SP0516BBCT
Bumps
Features
Array Avalanche Diodes ultra small Chip Scale Package (0.65mm bump pitch) Capability Standards 61000-4-2, Direct Discharge .18kV (Level
Schematic
61000-4-2, Discharge .30kV (Level 883D (Method 3015.7) .30kV Bipolar signal line protection applications
SP0504BBC
SP0516BBC
Fast response time input capacitance.39pF Typical clamp voltage .12V Typical input leakage .10uA Operating temperature range 40°C 85°C
Applications
Cell phone handsets Personal Digital Assistants (PDA)
SP0508BBC
Portable handheld equipment (Laptop, Palmtop computers) Computer port, keyboard (USB1.1) Set-Top (Audio Video ports)
PCMCIA cards
Silicon Protection Circuits
Avalanche Diode Array Bipolar Chip Scale Package
SP0504BBC, SP0508BBC, SP0516BBC
Electrical Specifications 25°C Unless Otherwise Specified
PARAMETER Reverse Standoff Voltage Reverse Standoff Leakage Current Signal Clamp Voltage Positive Negative Clamp Voltage during MIL-STD-883D Method 3015 Positive Negative Test Level IEC-61000-4-2, Contact discharge MIL-STD-883D Method 3015 (HBM) Capacitance Turn on/off Time Temperature Range Operating Storage 2.5VDC 1Mhz 10mA 10mA TEST CONDITIONS 10µA TYPICAL UNITS
SILICON PROTECTION CIRCUITS
Typical Solder Reflow Thermal Profile Clean Flux)
PRINTED CIRCUIT BOARD RECOMMENDATIONS Size Shape Definition 0.300mm Round Non-Solder Mask Defined Pads (NSMD) 0.350mm 0.152mm 0.360mm (sq) 50/50 Clean (Entek Plus 106A)
Temperature (oC)
Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperature Opening Solder Flux Ratio Solder Paste Board Trace Finish
Time
Silicon Protection Circuits
Avalanche Diode Array Bipolar Chip Scale Package
SP0504BBC, SP0508BBC, SP0516BBC
Outline Drawings
SP0504BBC
3.104mm (.071") 0.65mm (.026") 0.252mm (.010") 0.65mm (.026")
0.35mm Diameter (.014") 1.154mm (.045")
0.252mm (.010") 0.381mm (.015") 0.643mm (.025")
SP0508BBC
3.104mm (.122") 0.65mm (.026")
0.252mm (.010")
0.65mm (.026")
0.35mm Diameter Bumps (.014") 1.154mm (.045")
0.252mm (.010") 0.381mm (.015") 0.643mm (.025")
SP0516BBC
3.104mm (.122")
0.252mm (.010")
0.65mm (.026")
0.65mm (.026")
0.35mm Diameter Bumps (.014")
2.454mm (.096")
0.252mm (.010") 0.381mm (.015") 0.643mm (.025")

Silicon Protection Circuits Avalanche Diode Array Bipolar Chip Sc

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