Silicon Protection Circuits Avalanche Diode Array Unipolar Chip S

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Silicon Protection Circuits Avalanche Diode Array Unipolar Chip S

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Silicon Protection Circuits
Avalanche Diode Array Unipolar Chip Scale Package
SP0504BAC, SP0508BAC, SP0516BAC
This family avalanche diode arrays designed protection offered ultra small chip scale package. multi-channel devices used help protect sensitive digital analog input circuits data, signal, control lines with unipolar voltage levels 5VDC. state-of-the-art structure designed suppress other transient over-voltage events meet International Electrotechnical Compatability (EMC transient immunity stantards 61000-4-2 Electrostatic Discharge Requirements). monolithic silicon devices comprised specially designed structures transient voltage suppression (TVS). size shape these structures been tailored transient protection. capacitance clamp voltage ideal high speed signal line protection.
Ordering Information
PART NUMBER SP0504BACT SP0508BACT SP0516BACT DIODE CHANNELS BUMPS PACKAGE SIZE (MM) 1.804 1.154 3.104 1.154 3.104 2.454 QUANTITY REEL 3500 3500 3500
Features
Array Avalanche Diodes ultra small Chip Scale Package (.65mm bump pitch) Capability Standards 61000-4-2, Direct Discharge.25kV (Level
SILICON PROTECTION CIRCUITS
NOTE: Bump pitch 0.65mm
Schematic
SP0504BAC
SP0516BAC
61000-4-2, Discharge.30kV (Level 833D (Method 3015.7) .30kV Signal line protection applications 5VDC Fast response time.< input capacitance .39pF Typical clamp voltage .12V Typical
input leakage.10uA
Operating temperature range 40°C 85°C
SP0508BAC
Applications
Cell phone handsets Personal Digital Assistants (PDA) Portable handheld equipment (Laptop, Palmtop computers) Computer port, keyboard (USB1.1)
Set-Top (Audio Video Ports) PCMCIA cards
Silicon Protection Circuits
Avalanche Diode Array Unipolar Chip Scale Package
SP0504BAC, SP0508BAC, SP0516BAC
ELECTRICAL SPECIFICATIONS 25°C Unless Otherwise Specified PARAMETER Reverse Standoff Voltage Reverse Standoff Leakage Current Signal Clamp Voltage Positive Negative Clamp Voltage during MIL-STD-883D Method 3015 Positive Negative Test Level IEC-61000-4-2, Contact discharge MIL-STD-883D Method 3015 (HBM) Capacitance Turn on/off Time Temperature Range Operating Storage 2.5VDC 1Mhz 10mA 10mA TEST CONDITIONS 10µA 5.5V TYPICAL UNITS
Typical Solder Reflow Thermal Profile Clean Flux)
PRINTED CIRCUIT BOARD RECOMMENDATIONS Size Shape Definition 0.300mm Round Non-Solder Mask Defined Pads (NSMD) 0.350mm 0.152mm 0.360mm (sq) 50/50 Clean (Entek Plus 106A)
Temperature (oC)
Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperature Opening Solder Flux Ratio Solder Paste Board Trace Finish
Time
Silicon Protection Circuits
Avalanche Diode Array Unipolar Chip Scale Package
SP0504BAC, SP0508BAC, SP0516BAC
Outline Drawings
SP0504BAC
3.104mm (.071") 0.65mm (.026") 0.252mm (.010") 0.65mm (.026")
0.35mm Diameter (.014") 1.154mm (.045")
0.252mm (.010") 0.381mm (.015") 0.643mm (.025")
SP0508BAC
3.104mm (.122") 0.65mm (.026")
SILICON PROTECTION CIRCUITS
1.154mm (.045") 0.381mm (.015") 0.643mm (.025") 2.454mm (.096") 0.381mm (.015") 0.643mm (.025")
0.252mm (.010")
0.65mm (.026")
0.35mm Diameter Bumps (.014")
0.252mm (.010")
SP0516BAC
3.104mm (.122")
0.252mm (.010")
0.65mm (.026")
0.65mm (.026")
0.35mm Diameter Bumps (.014")
0.252mm (.010")

Silicon Protection Circuits Avalanche Diode Array Unipolar Chip S

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