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SEMICELL Diode Chips3) SKCD 121C A4); Preliminary data Chara


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Symbol VRRM IFSM Tsolder Tvj, Tstg Tvj,Tstg Conditions bondwires sin; sin; max. (transfer) Values 2100 Units
SEMICELL Diode Chips3) SKCD 121C
A4); Preliminary data
Characteristics
Symbol VT(TO) IRRM Tsolder Tsolder Conditions °C/125 VRRM Fig. min. typ. 10,7 max. 1,65 Units Features voltage drop temperature dependence Very soft reverse recovery under conditions Controlled Axial Lifetime Technology side bonding aluminum wire Bottom layer metallisation soldering Typical Applications Inverse diode IGBT inverter drives) Freewheeling diode brake choppers step-up choppers with IGBT MOSFET Uninteruptible Power Supplies Hybrid circuits static power converters Battery powered vehicles
Mechanical Data
Atot Aact. total area active area weight
Supplied chip carriers units) supplied frame, request Please contact factory
Tcase unless otherwise specified diF/dt 1000 A/µs; Controlled Axial Lifetime Technology Soldered ceramic (Al2O3) thick copper base plate Rthjc 0,25 Tcase
SEMIKRON
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