MII51007-1.0 This data sheet provides package information Altera'
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Chapter Package Information
MII51007-1.0
This data sheet provides package information Altera's MAX® devices. includes these sections: Section Page
Device Package Cross Reference Thermal Resistance Package Outlines this data sheet, packages listed order ascending count. Figures through 7-4.
Board Decoupling Guidelines
Decoupling requirements based amount logic used device output switching requirements. number pins capactive load pins increase, more decoupling capacitance required. many possible 0.2-µF power-supply decoupling capacitors should connected pins planes. These capacitors should located close possible device. Each VCCINT/GNDINT VCCIO/GNDIO pair should decoupled with 0.2-µF capacitor. When using highdensity packages, such ball-grid array (BGA) packages, possible decoupling capacitor VCC/GND pair. this case, should many decoupling capacitors possible. less dense designs, reduction number capacitors acceptable. Decoupling capacitors should have good frequency response, such monolithic-ceramic capacitors. Table shows which Altera® devices available thin quad flat pack (TQFP) FineLine BGA® package.
Device Package Cross Reference
Table 7-1. Devices TQFP FineLine Packages (Part Device
EPM240 EPM570 TQFP TQFP TQFP Non-Thermally Enhanced FineLine package
Package
Altera Corporation March 2004
Core Version a.b.c variable
Preliminary
Thermal Resistance
Table 7-1. Devices TQFP FineLine Packages (Part Device
EPM1270 TQFP Non-Thermally Enhanced FineLine package EPM2210 Non-Thermally Enhanced FineLine package Non-Thermally Enhanced FineLine package
Package
Thermal Resistance
Table provides (junction-to-ambient thermal resistance) (junction-to-case thermal resistance) values Altera devices.
Table 7-2. Thermal Resistance Devices Device
EPM240 EPM570
Count
Package
TQFP TQFP TQFP FineLine TQFP FineLine FineLine FineLine
C/W)
12.0 11.2 10.5 13.0 10.5 10.4
C/W) C/W) C/W) C/W) Still ft./min. ft./min. ft./min.
39.5 38.7 32.1 37.4 31.4 33.5 30.2 29.8 37.5 36.6 30.3 33.1 29.7 29.3 26.1 25.7 35.5 34.6 28.7 30.5 28.2 26.8 23.6 23.3 31.6 30.8 26.1 28.4 25.8 24.7 21.7 21.3
EPM1270
EPM2210
Package Outlines
package outlines following pages listed order ascending count. Altera package outlines meet requirements JEDEC Publication
Device Handbook, Volume
Core Version a.b.c variable
Altera Corporation March 2004
Package Information
100-Pin Plastic Thin Quad Flat Pack (TQFP)
dimensions tolerances conform ANSI Y14.5M 1994 Controlling dimension millimeters number leads
Package Information Description
Ordering Code Reference Package Acronym Lead Material Lead Finish JEDEC Outline JEDEC Option Maximum Lead Coplanarity Weight Moisture Sensitivity Level TQFP Copper Solder plate (85/15 typical) MS-026 0.003 inches (0.08 Printed moisture barrier
Package Outline Figure Reference Specification Symbol Min.
0.08 0.08 0.20 0.05 0.17 15.80 13.50 15.80 13.50 0.09 0.45
Millimeters Nom.
0.22 3.5° 0.60 1.00 0.50 0.20
Max.
1.27 0.15 0.27 16.20 14.50 16.20 14.50 0.20 0.75
Altera Corporation March 2004
Core Version a.b.c variable
Device Handbook, Volume
Package Outlines
Figure 7-1. 100-Pin TQFP Package Outline
Detail
Gage Plane 0.25
Device Handbook, Volume
Core Version a.b.c variable
Altera Corporation March 2004
Package Information
144-Pin Plastic Thin Quad Flat Pack (TQFP)
dimensions tolerances conform ANSI Y14.5M 1994 Controlling dimension millimeters number leads
Package Information Description
Ordering Code Reference Package Acronym Lead Material Lead Finish JEDEC Outline JEDEC Option Maximum Lead Coplanarity Weight Moisture Sensitivity Level TQFP Copper Solder plate (85/15 typical) MS-026 0.003 inches (0.08 Printed moisture barrier
Package Outline Figure Reference Specification Symbol Min.
0.08 0.08 0.20 0.45 0.05 0.17
Millimeters Nom.
0.22 22.00 20.00 0.50 22.00 20.00 3.5° 0.60 1.00 0.20 0.75
Max.
1.60 0.15 0.27
Altera Corporation March 2004
Core Version a.b.c variable
Device Handbook, Volume
Package Outlines
Figure 7-2. 144-Pin TQFP Package Outline
Detail
0.25
Gage Plane
(n-4)
Device Handbook, Volume
Core Version a.b.c variable
Altera Corporation March 2004
Package Information
256-Pin Non-Thermally Enhanced FineLine Ball-Grid Array
dimensions tolerances conform ANSI Y14.5M 1994 Controlling dimension millimeters maximum solder ball matrix size
Package Information Description
Ordering Code Reference Package Acronym Lead Material Lead Finish JEDEC Outline JEDEC Option Maximum Lead Coplanarity Weight Moisture Sensitivity Level FBGA Tin-lead alloy (63/37) MS-034 AAF-1 0.008 inches (0.20 Printed moisture barrier
Package Outline Figure Reference Specification Symbol Min.
Millimeters Nom.
17.00 0.50 0.60 1.00 0.70
Max.
3.50 1.10 2.50
0.30 0.25
Altera's thickness specification maximum. item table reflects JEDEC specification.
Altera Corporation March 2004
Core Version a.b.c variable
Device Handbook, Volume
Package Outlines
Figure 7-3. 256-Pin Non-Thermally Enhanced FineLine Package Outline
Indicates location
Seating Plane
Device Handbook, Volume
Core Version a.b.c variable
Altera Corporation March 2004
Package Information
324-Pin Non-Thermally Enhanced FineLine Ball-Grid Array
dimensions tolerances conform ANSI Y14.5M 1994 Controlling dimension millimeters maximum solder ball matrix size
Package Information Description
Ordering Code Reference Package Acronym Lead Material Lead Finish JEDEC Outline JEDEC Option Maximum Lead Coplanarity Weight Moisture Sensitivity Level FBGA Tin-lead alloy (63/37) MS-034 AAG-1 0.008 inches (0.20 Printed moisture barrier
Package Outline Figure Reference Specification Symbol Min.
Millimeters Nom.
19.00 0.50 0.60 1.00 0.70
Max.
3.50 3.00
1.20 0.30 0.25
Altera's thickness specification maximum. item table reflects JEDEC specification.
Altera Corporation March 2004
Core Version a.b.c variable
Device Handbook, Volume
Package Outlines
Figure 7-4. 324-Pin Non-Thermally Enhanced FineLine Package Outline
Ball Corner
Indicates Location Ball
Seating Plane
7-10 Device Handbook, Volume
Core Version a.b.c variable
Altera Corporation March 2004
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