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Chapter 7. Package Information

MII51007-1.0

Chapter 7. Package Information
MII51007-1.0
Introduction
Board Decoupling Guidelines
Decoupling requirements are based on the amount of logic used in the device and the output switching requirements. As the number of I / O pins and the capactive load on the pins increase, more decoupling capacitance is required. As many as possible 0.2-µF power-supply decoupling capacitors should be connected to the VCC and GND pins or the VCC and GND planes. These capacitors should be located as close as possible to the MAX II device. Each VCCINT / GNDINT and VCCIO / GNDIO pair should be decoupled with a 0.2-µF capacitor. When using highdensity packages, such as ball-grid array (BGA) packages, it may not be possible to use one decoupling capacitor per VCC / GND pair. In this case, you should use as many decoupling capacitors as possible. For less dense designs, a reduction in the number of capacitors may be acceptable. Decoupling capacitors should have a good frequency response, such as monolithic-ceramic capacitors. Table 7-1 shows which Altera® MAX II devices are available in thin quad flat pack (TQFP) and FineLine BGA® package.
Device & Package Cross Reference
Table 7-1. MAX II Devices in TQFP & FineLine BGA Packages (Part 1 of 2) Device
EPM240 EPM570 TQFP TQFP TQFP Non-Thermally Enhanced FineLine BGA package
Package
Altera Corporation March 2004
Core Version a.b.c variable
7-1 Preliminary
Thermal Resistance
Table 7-1. MAX II Devices in TQFP & FineLine BGA Packages (Part 2 of 2) Device
EPM1270 TQFP Non-Thermally Enhanced FineLine BGA package EPM2210 Non-Thermally Enhanced FineLine BGA package Non-Thermally Enhanced FineLine BGA package
Package
Thermal Resistance
Table 7-2 provides JA (junction-to-ambient thermal resistance) and JC (junction-to-case thermal resistance) values for Altera MAX II devices.
Table 7-2. Thermal Resistance of MAX II Devices Device
EPM240 EPM570
Pin Count
Package
TQFP TQFP TQFP FineLine BGA TQFP FineLine BGA FineLine BGA FineLine BGA
JA (° C / W) JA (° C / W) JA (° C / W) JA (° C / W) Still Air 100 ft. / min. 200 ft. / min. 400 ft. / min.
EPM1270
EPM2210
Package Outlines
The package outlines on the following pages are listed in order of ascending pin count. Altera package outlines meet the requirements of JEDEC Publication No. 95.
7-2 MAX II Device Handbook, Volume 1
Core Version a.b.c variable
Altera Corporation March 2004
Package Information
100-Pin Plastic Thin Quad Flat Pack (TQFP)
All dimensions and tolerances conform to ANSI Y14.5M - 1994 Controlling dimension is in millimeters N is the number of leads
Package Information Description
Ordering Code Reference Package Acronym Lead Material Lead Finish JEDEC Outline JEDEC Option Maximum Lead Coplanarity Weight Moisture Sensitivity Level T TQFP Copper Solder plate (85 / 15 typical) MS-026 BDE 0.003 inches (0.08 mm) 0.5 g Printed on moisture barrier bag
Package Outline Figure Reference Specification Symbol Min.
A A1 b D D1 E E1 q 1 2 3 C L L1 R1 R2 S e N 0.08 0.08 0.20 - 0.05 0.17 15.80 13.50 15.80 13.50 0° 0° 11° 11° 0.09 0.45
Millimeters Nom.
- - 0.22 - - - - 3.5° - 12° 12° - 0.60 1.00 REF - - - 0.50 BSC 100 - 0.20 -
Altera Corporation March 2004
Core Version a.b.c variable
7-3 MAX II Device Handbook, Volume 1
Package Outlines
Figure 7-1. 100-Pin TQFP Package Outline
Detail A
Gage Plane 0.25
7-4 MAX II Device Handbook, Volume 1
Core Version a.b.c variable
Altera Corporation March 2004
Package Information
144-Pin Plastic Thin Quad Flat Pack (TQFP)
All dimensions and tolerances conform to ANSI Y14.5M - 1994 Controlling dimension is in millimeters N is the number of leads
Package Information Description
Ordering Code Reference Package Acronym Lead Material Lead Finish JEDEC Outline JEDEC Option Maximum Lead Coplanarity Weight Moisture Sensitivity Level T TQFP Copper Solder plate (85 / 15 typical) MS-026 BFB 0.003 inches (0.08 mm) 1.3 g Printed on moisture barrier bag
Package Outline Figure Reference Specification Symbol Min.
A A1 b D D1 e E E1 q 1 2 3 L L1 R1 R2 S N 0.08 0.08 0.20 0° 0° 11° 11° 0.45 - 0.05 0.17
Millimeters Nom.
- - 0.22 22.00 BSC 20.00 BSC 0.50 BSC 22.00 BSC 20.00 BSC 3.5° - 12° 12° 0.60 1.00 REF - - - 144 - 0.20 - 7° - 13° 13° 0.75
Altera Corporation March 2004
Core Version a.b.c variable
7-5 MAX II Device Handbook, Volume 1
Package Outlines
Figure 7-2. 144-Pin TQFP Package Outline
Detail A
Gage Plane
7-6 MAX II Device Handbook, Volume 1
Core Version a.b.c variable
Altera Corporation March 2004
Package Information
256-Pin Non-Thermally Enhanced FineLine Ball-Grid Array
All dimensions and tolerances conform to ANSI Y14.5M - 1994 Controlling dimension is in millimeters M is the maximum solder ball matrix size
Package Information Description
Ordering Code Reference Package Acronym Lead Material Lead Finish JEDEC Outline JEDEC Option Maximum Lead Coplanarity Weight Moisture Sensitivity Level F FBGA Tin-lead alloy (63 / 37) N / A MS-034 AAF-1 0.008 inches (0.20 mm) 1.2 g Printed on moisture barrier bag
Package Outline Figure Reference Specification Symbol Min.
Millimeters Nom.
- - - - 17.00 BSC 0.50 0.60 1.00 BSC 16 0.70
Altera Corporation March 2004
Core Version a.b.c variable
7-7 MAX II Device Handbook, Volume 1
Package Outlines
Figure 7-3. 256-Pin Non-Thermally Enhanced FineLine BGA Package Outline
Pin A1
Indicates location of Pin A1
Seating Plane
7-8 MAX II Device Handbook, Volume 1
Core Version a.b.c variable
Altera Corporation March 2004
Package Information
324-Pin Non-Thermally Enhanced FineLine Ball-Grid Array
All dimensions and tolerances conform to ANSI Y14.5M - 1994 Controlling dimension is in millimeters M is the maximum solder ball matrix size
Package Information Description
Ordering Code Reference Package Acronym Lead Material Lead Finish JEDEC Outline JEDEC Option Maximum Lead Coplanarity Weight Moisture Sensitivity Level F FBGA Tin-lead alloy (63 / 37) N / A MS-034 AAG-1 0.008 inches (0.20 mm) 1.5 g Printed on moisture barrier bag
Package Outline Figure Reference Specification Symbol Min.
Millimeters Nom.
- - - 19.00 BSC 0.50 0.60 1.00 BSC 18 0.70
Altera Corporation March 2004
Core Version a.b.c variable
7-9 MAX II Device Handbook, Volume 1
Package Outlines
Figure 7-4. 324-Pin Non-Thermally Enhanced FineLine BGA Package Outline
A1 Ball Pad Corner
Indicates Location of Ball A1
Seating Plane
7-10 MAX II Device Handbook, Volume 1
Core Version a.b.c variable
Altera Corporation March 2004