February 1998 PRODUCT CHANGE NOTICE A82301 DS12885, SOIC DS1
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February 1998
PRODUCT CHANGE NOTICE A82301
DS12885, SOIC DS1585, SOIC assembly material change Hyundai-Korea
Description Change: SOIC used package DS12885 SOIC used package DS1585 device will assembled with Sumitomo 6600 mold compound Ablestik Ablebond 8361J attach adhesive. change material intended enhance moisture sensitivity characteristics package. Device Affected: DS12885 DS1585 Traceability: Customers will able distinguish this change date code package topside marking. Starting with work week 1998, DS12885 SOIC devices will assembled with these materials. date code will have format "9814A2" ("A2" denotes revision). Starting with work week 1998, DS1585 SOIC devices will assembled with these materials. Dallas Semiconductor maintains full traceability devices. Qualification Status: These material changes have been qualified Dallas Semiconductor Reliability Department. Data attached. further information, please contact people listed below.
Robert Radke Cash Wendel Sincerely,
Assembly Engineer Engineering Manager Reliability Manager
(972) 371-4318 (972) 371-4305 (972) 371-6016 (972) 371-3726 (972) 371-6016
John Director Quality Reliability Assurance
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