Description Change: Fairchild Semiconductor initial offerings this pac

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Description Change: Fairchild Semiconductor initial offerings this pac

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Effectivity Expected Device Shipment Date: 4/25/2004 Earliest Year/Work Week Changed Product: 0418 (Note: Package marking differ from this format) Product (Description):
Description Change: Fairchild Semiconductor initial offerings this package were manufactured Amkor Technologies (Phillipines) which Fairchild qualified sub-contractor. This change allow manufacturing TSSOP28L Fairchild Semiconductor Penang assembly facility. intent ultimately offer Fairchild TSSOP28L products manufactured both Fairchild Semiconductor Penang site Amkor Technologies (Phillipines) ship units from locations interchangeably better serve customers. FSPMbill material (BOM) will follows: Leadframe base: Copper C194 Internal lead plating: SPot silver Die-Attach paste: Hitachi Poly conductive, silver filled Gold wire: 99.99% Mold compound: Shinetsu KMC289-7 Lead finish: Post plated, Pb(15%)/Sn(85%)
Effect Change: There change physical dimensions package. Both assembly locations assembling exactly same marketing outline. There will change quality reliability this package. Qualification: qualification vehicle shall lots FAN5019MTC processed with different batches materials. Relaibility stress testing will performed qualify Fairchild Penang plant outlined qualification plan attached. Final will issued upon completion full reliability testing. Qual/REL Plan Numbers Qual Plan: Q20030165 From: cpmtep Date: 8/26/2003 Qual Plan: Q20030165 Requestor Qualification: Device: FAN5019MTC Product Line: 02FR01 Stress Test TMCL THBT SOPL HTSL ACLV TOTAL Affected FSIDs FAN5018MTC FAN5019MTCX FAN5092MTC FAN5094MTCX FAN5236MTC FAN5240MTC FAN5244MTC FAN53180MTCX High Temp Temp Product Family Code: Dura 1000 1000 1000 1000
FAN5018MTCX FAN5026MTC FAN5092MTCX FAN5095MTC FAN5236MTCX FAN5240MTCX FAN53166MTCX FAN53181MTCX
FAN5019MTC FAN5026MTCX FAN5094MTC FAN5231MTC FAN5239MTC FAN5243MTC FAN53168MTCX

Description Change: Fairchild Semiconductor initial offerings this pac

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