PowerPC 603eRISC MICROPROCESSOR Family PID7v-603e Specification P
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TSPC603P
PowerPC 603eRISC MICROPROCESSOR Family PID7v-603e Specification
PID7v-603e implementation PowerPC603e (after named 603p) low-power implementation reduced instruction computer (RISC) microprocessors PowerPCfamily. 603p implements 32-bit effective addresses, integer data types bits, floating-point data types bits. 603p low-power 2.5/3.3-volt design provides four software controllable power-saving modes. 603p superscalar processor capable issuing retiring many three instructions clock. Instructions execute order increased performance however, 603p makes completion appear sequential. 603p integrates five execution units able execute five instructions parallel. 603p provides independent on-chip, 16-Kbyte, four-way set-associative, physically addressed caches instructions data on-chip instruction data memory management units (MMUs). MMUs contain 64-entry, two-way setassociative, data instruction translation lookaside buffers that provide support demand-paged virtual memory address translation variable-sized block translation. 603p selectable 64-bit data 32-bit address bus. 603p interface protocol allows multiple masters complete system resources through central external arbiter. 603p supports single-beat burst data transfers memory accesses, supports memorymapped I/O. 603p uses advanced, 2.5/3.3-V CMOS process technology maintains full interface compatibility with devices. 603p integrates system testability debugging features through JTAG boundary-scan capability.
CERQUAD
suffix CERQUAD Ceramic Leaded Chip Carrier
suffix CBGA Ceramic Ball Grid Array
MAIN FEATURES SPECint95, SPECfp95 (estimated) Superscalar instructions clock peak). Dual 16KB caches. Selectable clock. 32-bit compatibility PowerPC implementation. chip debug support. typical Watts (166 MHz), full operating conditions. Nap, doze sleep modes power savings. Branch folding. 64-bit data (32-bit data option). 4-Gbyte direct addressing range. Pipelined single/double precision float unit.
IEEE compatible FPU. IEEE 1149-1 test mode (JTAG/C0P). fint MHz. fbus 66.67 MHz. Compatible CMOS input Output.
SCREENING QUALITY PACKAGING
This product manufactured full compliance with
MIL-STD-883 class According standards
(planned)
Upscreenings based upon standards Full military temperature range -55°C, +125°C)
Industrial temperature range
Internal Power Supply Cerquad CBGA packages
-40°C, +110°C)
December 1998
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TSPC603P SUMMARY
GENERAL DESCRIPTION
INTRODUCTION ASSIGNMENTS 2.1. CQFP package 2.2. CBGA package 2.3. Pinout listing SIGNAL DESCRIPTION
4.4. JTAG timing specifications FUNCTIONAL DESCRIPTION 5.1. PowerPC registers programming model
5.1.1. 5.1.2. 5.1.3. 5.1.4. 5.1.5. 5.1.6. 5.1.7. 5.2.1. 5.2.2. General-Purpose Registers (GPRs) Floating-Point Registers (FPRs) Condition Register (CR) Floating-Point Status Control Register (FPSC) Machine State Register (MSR) Segment Registers (SRs) Special-Purpose Registers (SPRs) PowerPC instruction addressing modes PowerPC 603p microprocessor instruction PowerPC cache characteristics PowerPC 603p microprocessor cache implementation PowerPC exception model PowerPC 603p microprocessor exception model PowerPC memory management PowerPC 603p microprocessor memory management
DETAILED SPECIFICATIONS
SCOPE APPLICABLE DOCUMENTS REQUIREMENTS 3.1. General 3.2. Design construction
3.2.1. 3.2.2. 3.2.3. Terminal connections Lead material finish Package
5.2. Instruction addressing modes
5.3. Cache implementation
5.3.1. 5.3.2.
5.4. Exception model
5.4.1. 5.4.2.
3.3. Absolute maximum ratings 3.4. Recommended operating conditions 3.5. Thermal characteristics
3.5.1. 3.5.2. 3.6.1. 3.6.2. 3.6.3. 3.6.4. 3.6.5. CQFP240 package CBGA255 package Dynamic Power Management Programmable Power Modes Power Management Modes Power Management Software Considerations Power dissipation
5.5. Memory management
5.5.1. 5.5.2.
3.6. Power consideration
5.6. Instruction timing PREPARATION DELIVERY 6.1. Packaging 6.2. Certificate compliance HANDLING PACKAGE MECHANICAL DATA 8.1. pins CQFP 8.2. package description
8.2.1. 8.2.2. Package parameters Mechanical dimensions package
3.7. Marking ELECTRICAL CHARACTERISTICS 4.1. General requirements 4.2. Static characteristics 4.3. Dynamic characteristics
4.3.1. 4.3.2. 4.3.3. Clock specifications Input specifications Output specifications
CLOCK RELATIONSHIPS CHOICE ORDERING INFORMATION
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TSPC603P
GENERAL Fetch Unit Completion Unit Dispatch Unit Branch Unit
Integer Unit
Unit
Rename
Load/ Store Unit
Rename
File
Float Unit
Data Cache
Inst. Cache
Interface Unit address data
System
Figure Block diagram
1.INTRODUCTION
603p low-power implementation PowerPC microprocessor family reduced instruction commuter (RISC) microprocessors. 603p implements 32-bit portion PowerPC architecture, which provides 32-bit effective addresses, integer data types bits, floating-point data types bits. 64-bit PowerPC microprocessors, PowerPC architecture provides 64-bit integer data types, 64-bit addressing, other features required complete 64-bit architecture. 603p provides four software controllable power-saving modes. Three modes (the nap, doze, sleep modes) static nature, progressively reduce amount power dissipated processor. fourth dynamic power management mode that causes functional units 603p automatically enter low-power mode when functional units idle without affecting operational performance, software execution, external hardware. 603p superscalar processor capable issuing retiring many three instructions clock. Instructions execute order increased performance however, 603p makes completion appear sequential. integrates five execution units integer unit (IU), floating-point unit (FPU), branch processing unit (BPU), load/store unit (LSU) system register unit (SRU). ability execute five instructions parallel simple instructions with rapid execution times yield high efficiency throughput 603p-based systems. Most integer instructions execute clock cycle. pipelined single-precision multiply-add instruction issued every clock cycle. 603p provides independent on-chip, Kbyte, four-way set-associative, physically addressed caches instructions data on-chip instruction data memory management units (MMUs). MMUs contain 64-entry, two-way set-associative, data instruction translation lookaside buffers (DTLB ITLB) that provide support demand-paged virtual memory address translation variable-sized block translation. TLBs caches least recently used (LRU) replacement algorithm. 603p also supports block address translation through independent instruction data block address translation (IBAT DBAT) arrays four entries each. Effective addresses compared simultaneously with four entries array during block translation. accordance with PowerPC architecture, effective address hits both array, translation takes priority. 603p selectable 64-bit data 32-bit address bus. 603p interface protocol allows multiple masters compete system resources through central external arbiter. 603p provides three-state coherency protocol that supports exclusive, modified, invalid cache states. This protocol compatible subset MESI four-state protocol operates coherently systems that contain four-state caches. 603p supports single-beat burst data transfers memory accesses, supports memory-mapped I/O. 603p uses advanced, 0.35 metal layer CMOS process technology maintains full interface compatibility with devices.
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TSPC603P 2.PIN ASSIGNMENTS
2.1. CQFP package
Figure CQFP view
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2.2. CBGA255 package Figure (pin matrix) shows pinout viewed from CBGA package. direction surface view shown side profile CBGA package.
matrix view
scale
Substrate Assembly VIEW Encapsulant
Figure CBGA view
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TSPC603P 2.3. Pinout listing
Table Power ground pins
CQFP240 package (AVDD) Internal logic 122, 137, 147, 157, 167, 177, 19,29, 116, 132, 142, 152, 162, 172, 182, 206, CBGA255 package F06, F08, F09, F11, G07, G10, H06, H08, H09, H11, J06, J08, J09, J11, K07, K10, L06, L08, L09, C07, E05, E07, E10, E12, G03, G05, G12, G14, K03, K05, K12, K14, M05, M07, M10, M12, P07, C05, C12, E03, E06, E08, E09, E11, E14, F05, F07, F10, F12, G06, G08, G09, G11, H05, H07, H10, H12, J05, J07, J12, K06, K08, K09, J10, K11, L05, L07, L10, L12, M03, M06, M08, M09, M11, M14, P05,
Output drivers
104, 112, 121, 128, 138, 148, 163, 173, 183, 194, 222, 229,
103, 111, 120, 127, 136, 146, 161, 171, 181, 193, 220, 228,
Table Signal pinout listing
Signal name A[0-31] CQFP number 179, 178, 176, 175, 174, 170, 169, 168, 166, 165, 164, 160, 159, 158, 151, 144, 231,230,227,226 225,150 115, 114, 113, 110, 109, 108, 143, 141, 140, 139, 135, 134, 133, 131, 130, 129, 126, 125, 124, 123, 119, 118, 117, 107, 106, 105, 102, 101, 100, CBGA number Active
C16, E04, D13, F02, D14, G01, D15, High E02, D16, D04, E13, G02, E15, H01, E16, H02, F13, J01, F14, J02, F15, H03, F16, F04, G13, K01, G15, K02, H16, M01, J15, C01, B04, B03, B01, P14, T16, R15, T15, R13, R12, P11, N11, R11, T12, T11, R10, P09, N09, T10, R09, T09, P08, N08, R08, T08, N07, R07, T07, P06, N06, R06, T06, R05, N05, T05, K13, K15, K16, L16, L15, L13, L14, M16, M15, M13, N16, N15, N13, N14, P16, P15, R16, R14, T14, N10, P13, N12, T13, P03, N03, N04, R03, T01, T02, P04, T03, High High High
AACK AP[0-3] ARTRY CKSTP_IN CKSTP_OUT CLK_OUT CSE[0-1] DBDIS DBWO DH[0-31]
Input Output Input Output Output Input Output Output Output Input Input Input
DL[0-31]
High
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Signal name DP[0-7] DRTRY HRESET L1_TSTCLK1 L2_TSTCLK1 LSSD_MODE1 PLL_CFG[0-3] QACK QREQ RSRV SRESET SYSCLK TBEN TBST TC[0-1] TLBISYNC TRST TSIZ[0-2] TT[0-4] VOLTDETGND3
Notes
CQFP number 213, 211, 210, 224, 197, 196, 191, 190, 185, 184,
CBGA number M02, L03, N02, L04, R01, P02, M04, A08, B09, A09, A02, A13, D10, B13, A15, B16, C14, B07, B08, C03, C06, C08, D05, D06, F03, H04,
Active High High High High High High High High High
Output Input Input Input Input Input Input Input Input Input Output Output Input Input Input Input Input Output Input Input Output Input Input Input Input Output Input Output
These test signals factory only must pulled normal machine operation. OVDD inputs supply power drivers inputs supply power processor core. (no-connect) 603e package; internally tied 603p package indicate power supply that low-voltage processor present.
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TSPC603P 3.SIGNAL Figure Table Table describe signals TSPC603p indicate signal functions. test signals, TRST, TMS, TCK, TDO, comply with subset P-1149.1 IEEE testability standard. signals LSSD_MODE, LI_TSTCLK L2_TSTCLK test signals factory only must pulled normal machine operations.
ADDRESS ARBITRATION A[0-31] ADDRESS AP[0-3] TT[0-4] TBST TSIZ[0-2] TRANSFER ATTRIBUTE CSE[0-1] TC[0-1]
DBWO DATA ATTRIBUTION
ADDRESS START
603p
DH[0-31], DL[0-31] DP[0-7] DBDIS DRTRY INT, CKSTP_IN, CKSTP_OUT HRESET, SRESET RSRV QREQ, QACK TBEN TLBISYNC INTERRUPTS CHECKSTOPS RESET DATA TERMINATION DATA TRANSFER
PROCESSOR STATUS
AACK ADDRESS TERMINATION ARTRY SYSCLK CLOCKS CLK_OUT PLL_CFG[0-3] POWER SUPPLY INDICATOR Ground inputs separated CBGA package (number) number CBGA package VOLTDETGND
(20) (19) (40)
TRST, TCK, TMS, TDI, LSSD_MODE, L1_TSTCLK, L2_TSTCLK OVDD GND* OGND* AVDD
JTAG/COP INTERFACE LSSD TEST CONTROL
POWER SUPPLY
Figure Functional groups
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Table Address data signal index
Signal name Address Data Data Mnemonic A[0-31] DH[0-31] DL[0-31] Signal function output, physical address data transferred. input, represents physical address snoop operation. Represents state data, during data write operation output, during data read operation input. Represents state data, during data write operation output, during data read operation input. Signal type
Table Signal index
Signal name Address Acknowledge Address Busy Address Parity Mnemonic AACK AP[0-3] Signal function address phase transaction complete output, 603p address master input, address output, represents parity each bytes physical address transaction input, represents parity each bytes physical address snooping operations Incorrect address parity detected snoop Signal type Input
Address Parity Error Address retry
ARTRY
Output
output, detects condition which snooped address tenure must retried input, must retry preceding address tenure May, with proper qualification, assume mastership address Request mastership address single-beat transfer will cached Provides clock output testing monitoring Must terminate operation internally gating clocks, release outputs detected checkstop condition ceased operation Cache replacement element current transaction reloading into writing cache output, 603p data master input, another device master (For write transaction) must release data data parity high impedance during following cycle May, with proper qualification, assume mastership data data tenure output, parity each bytes data write transactions input, parity each byte read data Incorrect data parity Must invalidate data from previous read operation output, transaction global input, transaction must snooped 603p Initiates complete hard reset operation Input Output Output Output Input Output Output Input Input Input Output Input Input
grant request Cache Inhibit Test Clock Checkstop Input Checkstop Output Cache Entry Data Busy Data Disable Data Grant Data Write Only Data Parity Data Parity Error Data Retry Global Hard Reset
CLK_OUT CKSTP_IN CKSTP_OUT CSE[0-1] DBDIS DBW0 DP[0-7] DRTRY HRESET
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Signal name Mnemonic Signal function Signal type Input Input Input Input Input Input Input Output Output Input Input Input Input Input Output Input Input Output Input Input Input Input
Interrupt
LSSD_MODE L1_TSTCLK L2_TSTCLK
Initiates interrupt register LSSD test control signal factory only LSSD test control signal factory only LSSD test control signal factory only Initiates machine check interrupt operation register EMCP HID0 register Configures operation internal processor clock frequency activity terminated 603p enter quiescent power) state requesting activity normally enter quiescent (low power) state Represents state reservation coherency reservation address register Initiates system management interrupt operation register Initiates processing reset exception Represents primary clock input 603p, clock frequency 603p operation single-beat data transfer completed successfully data beat burst transfer completed successfully timebase should continue clocking output, burst transfer progress input, when snooping single-beat reads Special encoding transfer progress Clock signal IEEE P1149.1 test access port (TAP) Serial data input Serial data output error occurred Instruction execution should stop after execution tlbsync instruction Selects principal operations test-support circuitry Provides asynchronous reset controller memory accesses, these signals along with TBST indicate data transfer size current operation output, begun memory transaction address transfer attribute signals valid input, another master begun transaction address transfer attribute signals valid snooping (see GBL) Type transfer progress single-beat transaction write-through Available only package Indicates power supply that low-voltage processor present.
Machine Check Interrupt Configuration Quiescent Acknowledge Quiescent Request Reservation System Management Interrupt Soft Reset System Clock Transfer Acknowledge Timebase Enable Transfer Burst Transfer Code Test clock Test data input Test data output Transfer Error Acknowledge TLBI Sync Test mode select Test reset Transfer Size Transfer start
PLL_CFG[0-3] QACK QREQ RSRV SRESET SYSCLK TBEN TBST TC[0-1] TLBISYNC TRST TSIZ[0-2]
Transfer Type Write-Through
TT[0-4]
Output Output
Power supply indicator VOLTDETGND
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DETAILED SPECIFICATIONS
1.SCOPE
This drawing describes specific requirements microprocessor TSPC603p, compliance with MIL-STD-883 class standard screening.
2.APPLICABLE DOCUMENTS
MIL-STD-883 Test methods procedures electronics. MIL-PRF-38535 General specifications microcircuits.
3.REQUIREMENTS 3.1. General
microcircuits accordance with applicable documents specified herein.
3.2. Design construction
3.2.1. Terminal connections Depending package, terminal connections shall shown Figure Figure GENERAL DESCRIPTION). 3.2.2. Lead material finish Lead material finish shall specified MIL-STD-1835 (see enclosed 3.2.3. Hermetic Package macrocircuits packaged ceramic quad flat packages (see 8.1) precise case outlines described specification 8.1) into MIL-STD-1835.
3.3. Absolute maximum ratings
Absolute maximum ratings stress ratings only, functional operation maximum guaranteed. Stresses beyond those listed affect device reliability cause permanent damage device.
Table Absolute maximum rating 603p
Parameter Core supply voltage supply voltage supply voltage Input voltage Storage temperature range
Notes:
Symbol AVdd OVdd Tstg
-0.3 -0.3 -0.3 -0.3
2.75 2.75 +150
Unit
Functional operating conditions given electrical specifications. Stresses beyond absolute maximums listed affect device reliability cause permanent damage device. Caution Input voltage must greater than OVdd supply voltage more than times including during power-on reset. Caution OVdd voltage must greater than Vdd/AVdd supply voltage more than times including during power-on reset. Caution Vdd/AVdd voltage must greater than OVdd supply voltage more than times including during power-on reset.
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TSPC603P 3.4. Recommended operating conditions
These recommended tested operating conditions. Proper device operation outside these conditions guaranteed.
Parameter Core supply voltage supply voltage supply voltage Input voltage Operating temperature 3.5. Thermal characterisrics
Symbol AVdd OVdd
2.375 2.375 3.135
2.625 2.625 3.465 +125
Unit
3.5.1.CQFP240 package This section provides thermal management data 603p this information based typical desktop configuration using lead, wire-bond CQFP package. heat sink used this data pinfin configuration from Thermalloy, part number 2338.
3.5.1.1. Thermal characteristics thermal characteristics wire-bond CQFP package follows Thermal resistance (junction-to-case) Rqjc 2.2°C/Watt. Wire-bond CQFP junction-to-lead thermal resistance (typical) 18°C/W 3.5.1.2. Thermal management example following example based typical desktop configuration using wire-bond CQFP package. heat sink used this data pinfin heat sink #2338 attached wire-bond CQFP package with thermal grease. Figure provides thermal management example CQFP package.
Junction-to-Ambient thermal Resistance (degreeC/Watt) Forced convection (m/sec) With Heat Sink Motorola Wire-Bond CQFP
Figure CQFP thermal management exemple
junction temperature calculated from junction ambient thermal resistance, follows Junction temperature Where ambient temperature vicinity device Rqja junction-to-ambient thermal resistance Rqjc junction-to-case thermal resistance device case-to-heat sink thermal resistance interface material heat sink-to-ambient thermal resistance Rqja (Rqjc Rsa)
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power dissipated device this environment, assumed that heat dissipated ambient through heat sink, junction-to-ambient thermal resistance resistances from junction case, from case heat sink, from heat sink ambient. Note that verification external thermal resistance case temperature should performed each application. Thermal resistance vary considerably many factors including degree turbulence. power dissipation Watts ambient temperature 40°C m/sec with heat sink measured above, junction temperature device would follows Rqja 40°C (10°C/Watt watts) 65°C which well within reliability limits device.
Notes Junction-to-ambient thermal resistance based measurements single-sided printed circuit boards SEMI (Semiconductor Equipment Materials International) G38-87 natural convection. Junction-to-case thermal resistance based measurements using cold plate SEMI G30-88 with exception that cold plate temperature used case temperature.
3.5.2.CBGA255 package data found this section concerns 603p's packaged 255-lead multi-layer ceramic (MLC), ceramic package. Data shown cases, expoded-die case heat sink) using Thermalloy 2338-pin heat sink.
3.5.2.1. Thermal characteristics internal thermal resistance this package negligible exposed design. heat sink attached directly silicon surface only when external thermal enhancement necessary. Additionally, CBGA package offers excellent thermal connection card power planes. Heat generated chip dissipated through package, heat sink (when used) card. parallel heat flow paths result lowest overall thermal resistance well offer significaltly better power dissipation capability when heat sink used. thermal characteristics flip-chip CBGA package follows Thermal resistance (junction-to-case) Rqjc 0.08°C/Watt. Thermal resistance (junction-to-ball) Rqjb 2.8°C/Watt 3.5.2.2. Thermal management example calculations performed exactly shown theprevious section CPFP240. Figure shows typical thermal performance data CBGA package mounted test card.
(°C/W) Assumptions card with planes card flow both sides card Vercical orientation 2-stage epoxy heat sink attach
CBGA with exposed
Approach velocity (m/sec)
Figure CBGA thermal management example
Temperature calculations also performed identically those previous section. power dissipation Watts ambient 40°C m/sec, associated overall thermal resistance junction temperature, found Table will result.
CBGA with thermalloy 2338B-pin heat sink
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Table Thermal resistance junction temperature
Configuration Exposed heat sink) With 2338 heat sink (°C/W) 18.4 (°C)
Vendors such Aavid Engineering Inc., Thermalloy, Wakefield Engineering supply heat sinks with wide range thermal performance.
3.6. Power consideration
PowerPC603p microprocessor specifically designed low-power operation. 603e microprocessor version, 603p provides both automatic program-controllable power reduction modes progressive reduction power consumption. This chapter describes hardware support provided 603p power management. 3.6.1. Dynamic Power Management Dynamic power management automatically powers down individual execution units 603p, based upon contents instruction stream. example, floating-point instructions being executed, floating-point unit automatically powered down. Power actually removed from execution unit instead, each execution unit independent clock input, which automatically controlled clock-by- clock basis. Since CMOS circuits consume negligible power when they switching, stopping clock execution unit effectively eliminates power consumption. operation completely transparent software external hardware. Dynamic power management enabled setting HID0 power-up, following HRESET. 3.6.2. Programmable Power Modes 603p provides four programmable power states full power, doze, sleep. Software selects these modes setting (and only one) three power saving mode bits. Hardware enable power management state through external asynchronous interrupts hardware interrupt causes transfer program flow interrupt handler code. appropriate mode then software. 603p provides separate interrupt interrupt vector power management system management interrupt (SMI). 603p also contains decrement timer which allows enter doze mode predetermined amount time then return full power operation through decrementer interrupt (DI). Note that 603p cannot switch from power management mode another without first returning full mode. sleep modes disable snooping therefore, hardware handshake provided ensure coherency before 603p enters these power management modes. Table summarizes four power states.
Table Power 603p Microprocessor Programmable Power Modes
Mode
Full power Full power (with DPM) Doze
Functioning Units
units active Requested logic demand snooping Data cache needed Decrementer timer
Activation Method
Full-Power Wake Method
instruction dispatch Controlled
External asynchronous exceptions* Decrementer interrupt Reset
Decrementer timer
Controlled hardware External asynchronous exceptions software Decrementer interrupt Reset
Sleep
None
Controlled hardware External asynchronous exceptions software Reset
Exceptions referred interrupts architecture specification 3.6.3. Power Management Modes following sections describe characteristics 603p"s power management modes, requirements entering exiting various modes, system capabilities provided 603p while power management modes active.
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3.6.3.1. Full-Power Mode with Disabled
Full-power mode with disabled power mode selected when enable (bit HID0 cleared. Default state following power-up HRESET. functional units operating full processor speed times.
3.6.3.2. Full-Power Mode with Enabled
Full-power mode with enabled (HID0[11] provides on-chip power management without affecting functionality performance 603p. Required functional units operating full processor speed. Functional units clocked only when needed. software hardware intervention required after mode set. Software/hardware performance transparent.
3.6.3.3. Doze Mode
Doze disables most functional units maintains cache coherency enabling interface unit snooping. snoop will cause 603p enable data cache, copy data back memory, disable cache, fully return doze state. Most functional units disabled. snooping time base/decrementer still enabled. Dose mode sequence doze (HID0[8) 603p enters doze mode after several processor clocks. Several methods returning full-power mode Assert INT, SMI, decrementer interrupts. Assert hard reset soft reset. Transition full-power state takes more than processor cycles. running locked SYSCLK.
3.6.3.4. Mode
mode disables 603p still maintains phase locked loop (PLL) time base/decrementer. time base used restore 603p full-on state after programmed amount time. Because snooping disabled sleep mode, hardware handshake using quiesce request (QREQ) quiesce acknowledge (QACK) signals requires maintain data coherency. 603p will assert QREQ signal indicate that ready disable snooping. When system ensured that snooping longer necessary, will assert QACK 603p will enter sleep mode. Time base/decrementer still enabled. Most functional units disabled (including snooping). nonessential input receivers disables. mode sequence (HID0[9] 603p asserts quiesce request (QREQ) signal. System asserts quiesce acknowledge (QACK) signal. 603p enters sleep mode after several processor clocks. Several methods returning full-power mode Assert INT, SPI, decrementer interrupts. Assert hard reset soft reset. Transition full-power takes more than processor cycles. running locked SYSCLK.
3.6.3.5. Sleep Mode
Sleep mode consumes least amount power four modes since functional units disabled. conserve maximum amount power, disabled SYSCLK removed. fully static design 603p, internal processor state preserved when internal clock present. Because time base decrementer disabled while 603p sleep mode, 603p's time base contents will have updated from external time base following sleep mode accurate time-of-day maintenance required. Before 603p enters sleep mode, 603p will assert QREQ signal indicate that ready disable snooping. When system ensured that snooping longer necessary, will assert QACK 603p will enter sleep mode. functional units disabled (including snooping time base). nonessential input receivers disabled Internal clock regenerators disabled. still running (see below).
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Sleep mode sequence sleep (HID0[10] 603p asserts quiesce request (QREQ). System asserts quiesce acknowledge (QACK). 603p enters sleep mode after several processor clocks. Several methods returning full-power mode Assert INT, SMI, interrupts. Assert hard reset soft reset. disabled SYSCLK removed while sleep mode. Return full-power mode after SYSCLK disabled sleep mode Enable SYSCLK. Reconfigure into desired processor clock mode. System logic waits startup relock time (100 msec). System logic asserts sleep recovery signals (for example, SMI). 3.6.4. Power Management Software Considerations Since 603p dual issue processor with -of-order execution capability, care must taken power management mode entered. Furthermore, sleep modes require outstanding operations completed before power management mode entered. Normally during system configuration time, power management modes would selected setting appropriate HID0 mode bit. Later power management mode invoked setting MSR[POW] bit. provide clean transition into power management mode, stmsr[POW] should preceded sync instruction followed isync instruction. 3.6.5. Power dissipation
Table Power dissipation
Vdd/AVdd OVdd 125°C clock Frequency Full-On Mode (DPM Enabled) Typical Doze Mode(1) Typical Mode(1) Typical Sleep Mode(1) Typical Units
Sleep Mode-PLL Disabled(1) Typical
Sleep Mode-PLL SYSCLK Disabled(1) Typical
values provided this mode include driver power (OVDD) analog supply power (AVDD). Worst-case AVDD Notes: calculate power consumption temperature (-55 oC), 1.25 factor Maximum power measurements performed with worst case instruction VDD=2.625 These values apply valid settings include OVDD/AVDD consumption WORST case AVDD OVDD system dependent typically
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TSPC603P 3.7. Marking
document where defined marking identified related reference documents. Each microcircuit legible permanently marked with following information minimum Thomson logo, Manufacturer's part number, Class identification applicable, Date-code inspection lot, identifier available, Country manufacturing.
4.ELECTRICAL CHARACTERISTICS 4.1. General requirements
static dynamic electrical characteristics specified inspection purposes relevant measurement conditions given below Table Static electrical characteristics electrical variants. Table Dynamic electrical characteristics 603p. These specifications processor core frequencies. processor core frequency determined (SYSCLK) frequency settings PLL_CFG0 PLL_CFG3 signals. timings specified respective rise edge SYSCLK.
4.2. Static characteristics
Table Electrical characteristics
AVdd OVdd -55°C 125°C Characteristics Input high voltage (all inputs except SYSCLK) Input voltage (all inputs except SYSCLK) SYSCLK input high voltage SYSCLK input voltage Input leakage current 3.465 V(1, V(1, Hi-Z (off-state) leakage current 3.465 V(1, V(1, Output high voltage Output voltage Symbol CVIH CVIL ITSI ITSI 10.0 15.0 Unit
Capacitance, MHz(2) (excludes ABB, DBB, ARTRY) Capacitance, MHz(2) (for ABB, DBB, ARTRY)
Notes:
Excludes test signals (LSSD_MODE, L1_TSTCLK, L2_TSTCLK, JTAG signals). Capacitance periodically sampled rather than tested. Leackage currents measured nominal OVdd/Vdd both OVdd/Vdd. Same variation (for example, both OVdd vary either
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TSPC603P 4.3. Dynamic characteristics
4.3.1. Clock specifications Table provides clock timing specifications defined Figure
Table Clock timing specifications AVdd OVdd -55°C 125°C
Characteristics Processor frequency frequency SYSCLK (bus) frequency SYSCLK cycle time SYSCLK rise fall time SYSCLK duty cycle (1.4V measured) SYSCLK jitter 603p internal relock time
Notes: Rise fall times SYSCLK input measured from Cycle-to-cycle jitter guaranteed design. Timing guaranteed design characterization, tested. relock time maximum amount time required lock after stable SYSCLK reached during power-on reset sequence. This specification also applies when been disabled subsequently re-enabled during sleep mode. Also note that HRESET must held asserted minimum clocks after relock time (100 during power-on reset sequence. Caution SYSCLK frequency PLL_CFG0-PLL_CFG3 settings must chosen such that resulting SYSCLK (bus) frequency, (core) frequency, (VCO) frequency exceed their respective maximum minimum operating frequencies. Refer PLL_CFG0_PLL_CFG3 signal description valid settings.
66.67 ±150
Unit
Note
66.67 ±150
Figure SYSCLK input timing diagram
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4.3.2. Input specifications Table provides input timing specifications 603p defined Figure Figure
Table Input timing specifications
AVdd OVdd -55°C 125°C Characteristics Address/data/transfer attribute inputs valid SYSCLK (input setup) other inputs valid SYSCLK (input setup) Mode select inputs valid HRESET (input setup) (for DRTRY, QACK TLBISYNC) SYSCLK address/data/transfer attribute inputs invalid (input hold) SYSCLK other inputs invalid (input hold) HRESET mode select inputs invalid (input hold) (for DRTRY, QACK, TLBISYNC) tsys tsys 4,5,6,7 4,6,7 Unit Note
Notes input specifications measured from level (0.8 signal question rising edge input SYSCLK. Both input output timings measured pin. Figure Address/data/transfer attribute input signals composed following: A0-A31, AP0-AP3, TT0-TT4, TC0-TC1, TBST, TSIZ0-TSIZ2, GBL, DH0-DH31, DL0-DL31, DP9-DP7. other input signals compsed following: ABB, DBB, ARTRY, AACK, DBG, DBWO, DRTRY, TEA, DBDIS, HRESET, SRESET, INT, SMI, MCP, TBEN, QACK, TLBISYNC. setup hold time with respect rising edge HRESET. Figure tSYS period external clock (SYSCLK) nanoseconds. These values guaranteed design, tested. This specification configuration mode only. Also note that HRESET must held asserted minimum clocks after relock time (100 during power-on reset sequence.
Figure Input timing diagram
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Figure Mode select input timing diagram
4.3.3. Output specifications Table provides output timing specifications 603p (shown Figure 10).
Table Output timing specifications AVdd OVdd -55°C 125°C
Characteristic SYSCLK output driven (output enable time) SYSCLK output valid (5.5 ABB, ARTRY, DBB) SYSCLK output valid (TS, ABB, ARTRY, DBB) SYSCLK output valid (5.5 except ABB, ARTRY, DBB) SYSCLK output valid (all except ABB, ARTRY, DBB) SYSCLK output invalid (output hold) SYSCLK output high impedance (all except ARTRY, ABB, DBB) SYSCLK ABB, DBB, high impedance after precharge SYSCLK ARTRY high impedance before precharge SYSCLK ARTRY precharge enable tsys 11.0 tsys 11.0 tsys Unit Note
Maximum dalay ARTRY precharge SYSCLK ARTRY high impedance after precharge
tsys tsys
Notes: output specifications measured from rising edge SYSCLK level (0.8 signal question. Both input output timings measured pin. Figure maximum timing specifications assume This minimum parameter assumes SYSCLK output valid (5.5 includes extra delay associated with discharging external voltage from instead from CMOS levels instead CMOS levels). tsys period external clock (SYSCLK) nanoseconds (ns). numbers given table must multiplied period SYSCLK compute actual time duration nanoseconds) parameter question. Output signal transitions from Nominal precharge width tsysclk. Nominal precharge width ARTRY tsysclk.
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Figure Output timing diagram
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Table JTAG timing specifications (independent SYSCLK)
AVdd OVdd -55°C 125°C
Figure Clock input timing diagram
Figure TRST timing diagram
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Figure Boundary-scan timing diagram
Figure Test access port timing diagram
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TSPC603P 5.FUNCTIONAL DESCRIPTION 5.1. PowerPC registers programming model
PowerPC architecture defines register-to-register operations most computational instructions. Source operands these instructions accessed from registers provided immediate values embedded instruction opcode. three-register instruction format allows specification target register distinct from source operands. Load store instructions transfer data between registers memory. PowerPC processors have levels privilege supervisor mode operation (typically used operating system) user mode operation (used application software). programming models incorporate GPRs, FPRs, special-purpose registers (SPRs) several miscellaneous registers. Each PowerPC microprocessor also unique hardware implementation (HID) registers. Having access privilege instructions, registers, other resources allows operating system control application environment (providing virtual memory protecting operating-system critical machine resources). Instructions that control state processor, address translation mechanism, supervisor registers executed only when processor operating supervisor mode. following sections summarize PowerPC registers that implemented 603p. 5.1.1. General-Purpose Registers (GPRs) PowerPC architecture defines user-level, general-purpose registers (GPRs). These registers either bits wide 32-bit PowerPC microprocessors bits wide 64-bit PowerPC microprocessors. GPRs serve data source destination integer instructions. 5.1.2. Floating-Point Registers (FPRs) PowerPC architecture also defines user-level, 64-bit floating-point registers (FPRs). FPRs serve data source destination floating-point instructions. These registers contain data objects either single double precision floating-point formats. 5.1.3. Condition Register (CR) 32-bit user-level register that consists eight four-bit fields that reflect results certain operations, such move, integer floating-point compare, arithmetic, logical instructions, provide mechanism testing branching. 5.1.4. Floating-Point Status Control Register (FPSCR) floating-point status control register (FPSCR) user-level register that contains exception signal bits, exception summary bits, exception enable bits, rounding control bits needed compliance with IEEE standard. 5.1.5. Machine State Register (MSR) machine state register (MSR) supervisor-level register that defines state processor. contents this register saved when exception taken restored when exception handling completes. 603p implements 32-bit register, 64-bit PowerPC processors implement 64-bit MSR. 5.1.6. Segment Registers (SRs) memory management, 32-bit PowerPC microprocessors implement sixteen 32-bit segment registers (SRs). speed access, 603p implements segment registers arrays main array (for data memory accesses) shadow array (for instruction memory accesses). Loading segment entry with Move Segment Register (stsr) instruction loads both arrays. 5.1.7. Special-Purpose Registers (SPRs) powerPC operating environment architecture defines numerous special-purpose registers that serve variety functions, such providing controls, indicating status, configuring processor, performing special operations. During normal execution, program access registers, shown Figure depending program's access privilege (supervisor user, determined privilege-level (PR) MSR). Note that register such GPRs FPRs accessed through operands that part instructions. Access registers explicit (that through specific instructions that purpose such Move Special-Purpose Register (mtspr) Move from Special-Purpose Register (mfspr) instructions) implicit, part execution instruction. Some registers accessed both explicitly implicitly. 603p, SPRs bits wide.
5.1.7.1. User-Level SPRs following 603p SPRs accessible user-level software Link register (LR) link register used provide branch target address hold return address after branch link instructions. bits wide 32-bit implementations. Count register (CTR) decremented tested automatically result branch-and-count instructions. bits wide 32-bit implementations. Integer exception register (XER) 32-bit contains summary overflow bit, integer carry bit, overflow bit, field specifying number bytes transferred Load String Word Indexed (lswx) Store String Word Indexed (stswx) instruction.
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5.1.7.2. Supervisor-Level SPRs 603p also contains SPRs that accessed only supervisor-level software. These registers consist following 32-bit DSISR defines cause data access alignment exceptions. data address register (DAR) 32-bit register that holds address access after alignment exception. Decrementer register (DEC) 32-bit decrementing counter that provides mechanism causing decrementer exception after programmable delay. 32-bit SDR1 specifies page table format used virtual-to-physical address translation pages. (Note that physical address referred real address architecture specification). machine status save/restore register (SRR0) 32-bit register that used 603p saving address instruction that caused exception, address return when Return from Interrupt (rfi) instruction executed. machine status save/restore register (SRR1) 32-bit register used save machine status exceptions restore machine status when instruction executed. 32-bit SPRG0-SPRG3 registers provided operating system use. external access register (EAR) 32-bit register that controls access external control facility through External Control Word Indexed (eciwx) External Control Word Indexed (ecowx) instructions. time base register (TB) 64-bit register that maintains time operates interval timers. consists 32-bit fields time base upper (TBU) time base lower (TBL). processor version register (PVR) 32-bit, read-only register that identifies version (model) revision level PowerPC processor. Block address translation (BAT) arrays PowerPC architecture defines registers, divided into four pairs data BATs (DBATs) four pairs instruction BATs (IBATs). Figure list numbers arrays.
following supervisor-level SPRs implementation-specific 603p DMISS IMISS registers read-only registers that loaded automatically upon instruction data miss. HASH1 HASH2 registers contain physical addresses primary secondary page table entry groups (PTEGs). ICMP DCMP registers contain duplicate first word page table entry (PTE) which table search looking. required physical address (RPA) register loaded processor with second word correct during page table search. hardware implementation (HID0 HID1) registers provide means enabling 603p"s checkstops features, allows software read configuration configuration signals. instruction address breakpoint register (IABR) loaded with instruction address that compared instruction addresses dispatch queue. When address match occurs, instruction address breakpoint exception generated. Figure shows 603p registers available user supervisor level. number right SPRs indicate number that used syntax instruction operands access register.
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These registers 603p-specific registers. supported other PowerPC processors.
Figure PowerPC microprocessor programming model Register
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TSPC603P 5.2. Instruction addressing modes
following subsections describe PowerPC instruction addressing modes general. 5.2.1. PowerPC instruction addressing modes PowerPC instructions encoded single-word (32-bit) opcodes. Instruction formats consistent among instruction types, permitting efficient decoding occur parallel with operand accesses. This fixed instruction length consistent format greatly simplifies instruction pipelining.
5.2.1.1. PowerPC instruction PowerPC instructions divided into following categories Integer instructions These include computational logical instructions. Integer arithmetic instructions. Integer compare instructions. Integer logical instructions. Integer rotate shift instructions. Floating-point instructions -These include floating-point computational instructions, well instructions that affect FPSCR. Floating-point arithmetic instructions. Floating-point multiply/add instructions. Floating-point rounding conversion instructions. Floating-point compare instructions. Floating-point status control instructions. Load/store instructions These include integer floating-point load store instructions. Integer load store instruction. Integer load store multiple instructions. Floating-point load store. Primitives used construct atomic memory operations (lwarx stwcx. instructions). Flow control instructions These include branching instructions, condition register logical instructions, trap instructions, other instructions that affect instruction flow. Branch trap instructions. Condition register logical instructions. Processor control instructions These instructions used synchronizing memory accesses management caches, TLBs, segment registers. Move to/from instructions. Move to/from MSR. Synchronize. Instruction synchronize. Memory control instruction These instructions provide control caches, TLBs, segment registers. Supervisor-level cache management instructions. User-level cache instructions. Segment register manipulation instructions. Translation lookaside buffer management instructions. Note that this grouping instructions does indicate which execution unit executes particular instruction group instructions. Integer instructions operate byte, half-word, word operands. Floating-point instructions operate single-precision (one word) double-precision (one double word) floating-point operands. PowerPC architecture uses instructions that four bytes long word-aligned. provides byte, half-word, word operand loads stores between memory GPRs. also provides word double-word operand loads stores between memory floating-point registers (FPRs). Computational instructions modify memory. memory operand computation then modify same another memory location, memory contents must loaded into register, modified, then written back target location with distinct instructions. PowerPC processors follow program flow when they normal execution state. However, flow instructions interrupted directly execution instruction asynchronous event. Either kind exception cause several components system software invoked.
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5.2.1.2. Calculating effective addresses effective address (EA) 32-bit address computed processor when executing memory access branch instruction when fetching next sequential instruction. PowerPC architecture supports simple memory addressing modes (RA|0) offset (including offset (register indirect with immediate index). (RA|0) (register indirect with index). These simple addressing modes allow efficient address generation memory accesses. Calculation effective address aligned transfers occurs single clock cycle. memory access instruction, effective address operand length exceeds maximum effective address, memory operand considered wrap around from maximum effective address effective address Effective address computations both data instruction accesses 32-bit unsigned binary arithmetic. carry from ignored 32-bit implementations.
5.2.2. PowerPC 603p microprocessor instruction 603p instruction defined follows 603p provides hardware support 32-bit PowerPC instructions. 603p provides implementation-specific instructions used software table search operations following misses Load Data Entry (tlbld). Load Instruction Entry (tlbli). 603p implements following instructions which defined optional PowerPC architecture External Control Word Indexed (eciwx). External Control Word Indexed (ecowx). Floating Select (fsed). Floating Reciprocal Estimate Single-Precision (fres). Floating Reciprocal Square Root Estimate (frsqrte). Store Floating-Point Integer Word (stfiwx).
5.3. Cache implementation
following subsections describe PowerPC architecture's treatment cache general, 603p specific implementation, respectively. 5.3.1. PowerPC cache characteristics PowerPC architecture does define hardware aspects cache implementations. example, some PowerPC processors, including 603p, have separate instruction data caches (harvare architecture), while others, such PowerPC 601microprocessor, implement unified cache. PowerPC microprocessor control following memory access modes page block basis Write-back/write-through mode. Cache-inhibited mode. Memory coherency. Note that 603p, cache line defined eight words. defines cache management instructions that provide means which application programmer affect cache contents. 5.3.2. PowerPC 603p microprocessor cache implementation 603p 16-Kbyte, four-way set-associative (instruction data) caches. caches physically addressed, data cache operate either write-back write-through mode specified PowerPC architecture. data cache configured sets lines each. Each line consists bytes, state bits, address tag. state bits implement three-state (modified/exclusive/invalid) protocol. Each line contains eight 32-bit words. Note that PowerPC architecture defines term block cacheable unit. 603p, block size equivalent cache line. block diagram data cache organization shown Figure instruction cache also consists sets lines, each line consists bytes, address tag, valid bit. instruction cache written except through line fill operation. instruction cache snooped, cache coherency must maintained software. fast hardware invalidation capability provided support cache maintenance. organization instruction cache very similar data cache shown Figure Each cache line contains eight contiguous words from memory that loaded from 8-word boundary (that bits A27-A32 effective addresses zero) thus, cache line never crosses page boundary. Misaligned accesses across page boundary incur performance penalty. 603's cache lines loaded four beats bits each. burst load performed "critical double word first". cache that being loaded blocked internal accesses until load completes. critical double word simultaneously written cache forwarded requesting unit, thus minimizing stalls load delays.
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ensure coherency among caches multiprocessor multiple caching-device) implementation, 603p implemements protocol. These three states, modified, exclusive, invalid, indicate state cache block follows Modified cache line modified with respect system memory that data this address valid only cache system memory. Exclusive This cache line holds valid data that identical data this address system memory. other cache this data. Invalid This cache line does hold valid data. Cache coherency enforced on-chip snooping logic. Since 603p's data cache tags single ported, simultaneous load store snoop access represent resource contention. snoop access given first access tags. load store then occurs clock following snoop.
Figure Data cache organization
5.4. Exception model
following subsections describe PowerPC exception model 603p implementation, respectively. 5.4.1. PowerPC exception model PowerPC exception mechanism allows processor change supervisor state result external singles, errors, unusual conditions arising execution instructions, differ from arithmetic exceptions defined IEEE floatingpoint operations. When exceptions occur, information about state processor saved certain registers processor begins execution address (exception vector) predetermined each exception. Processing exceptions occurs supervisor mode. Although multiple exception conditions single exception vector, more specific condition determined examining register associated with exception example, DSISR FPSCR. Additionally, some exception conditions explicitly enable disabled software. PowerPC architecture requires that exceptions handled program order therefore, although particular implementation recognize exception conditions order, they presented strictly order. When instruction-caused exception recognized, unexecuted instructions that appear earlier instruction stream, including that have entered execute state, required complete before exception taken. exceptions caused those instructions handled first. Likewise, exceptions that asynchronous precise recognized when they occur, handled until instruction currently completion state successfully completes execution generates exception, completed store queue emptied. Unless catastrophic causes system reset machine check exception, only exception handled time. example, single instruction encounters multiple exception conditions, those conditions encountered sequentially. After exception handler handles exception, instruction execution continues until next exception condition encountered. However, many cases there attempt re-execute instruction. This method recognizing handling exception conditions sequentially guarantees that exceptions recoverable. Exception handlers should save information stored SRR0 SRR1 early prevent program state from being lost system reset machine check exception instruction-caused exception exception handler, before enabling external interrupts. PowerPC architecture support four types exceptions
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Synchronous, precise These causes instructions. instruction-caused exceptions handled precisely that machine state time exception occurs known completely restored. This means that (excluding trap system call exceptions) address faulting instruction provided exception handler that neither faulting instruction subsequent instructions code stream will complete execution before exception taken. Once exception processed, execution resumes address faulting instruction alternate address provided exception handler). When exception taken trap system call instruction, execution resumes address provided handler. Synchronous, imprecise PowerPC architecture defines imprecise floating-point exception modes, recoverable nonrecoverable. Even though 603p provides means enable imprecise modes, implements these modes identically precise mode (-hat enabled floating-point enabled exceptions always precise 603p). Asynchronous, maskable external, SMI, decrementer interrupts maskable asynchronous exceptions. When these exceptions occur, their handling postponed until next instruction, exceptions associated with that instruction, completes execution. there instructions execution units, exception taken immediately upon determination correct restart address (for loading SRR0). Asynchronous, maskable There maskable asynchronous exceptions system reset machine check exception. These exceptions recoverable, provide limited degree recoverability. exceptions report recoverability through SMR[RI] bit. 5.4.2. PowerPC 603p microprocessor exception model specified PowerPC architecture, 603p exceptions described either precise imprecise either synchronous asynchronous. Asynchronous exceptions (some which maskable) caused events external processor's execution synchronous exceptions, which handled precisely 603p, caused instructions. 603p exception classes shown Table Synchronous/Asynchronous Asynchronous, maskable Asynchronous, maskable precise/Imprecise Imprecise Precise Exception type Machine check System reset External interrupt Decrementer System management interrupt Instruction-caused exceptions
Synchronous
Precise
Table PowerPC 603p microprocessor exception classifications
Although exceptions have other characteristics well, such whether they maskable maskable, distinctions shown Table define categories exceptions that 603p handles uniquely. Note that Table includes synchronous imprecise instructions. While PowerPC architecture supports imprecise handling floating-point exceptions, 603p implements these exception modes precise exceptions. 603p's exceptions, conditions that cause them, listed Table Exceptions that specific 603p indicated.
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Table Exceptions conditions
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5.5. Memory management
following subsections describe memory management features PowerPC architecture, 603p implementation, respectively. 5.5.1. PowerPC memory management primary functions translate logical (effective) addresses physical addresses memory accesses, provide access protection blocks pages memory. There types accesses generated 603p that require address translation instruction accesses, data accesses memory generated load store instructions. PowerPC exception model support demand-paged virtual memory. Virtual memory management permits execution programs larger than size physical memory demand-paged implies that individual pages loaded into physical memory from system memory only when they first accessed executing program. hashed page table variable-sized data structure that defines mapping between virtual page numbers physical page numbers. page table size power starting address multiple size. page table contains number page table entry groups (PTEGs). PTEG contains eight page table entries (PTEs) eight bytes each therefore, each PTEG bytes long. PTEG addresses entry points table search operations. Address translations enabled setting bits MSR-MSR[IR] enables instruction address translations MSR[DR] enables data address translations. 5.5.2. PowerPC 603p microprocessor memory management instruction data memory management units 603p provide Gbyte logical address space accessible supervisor user programs with 4-Kbyte page size 256-Mbyte segment size. Block sizes range from Kbyte 256Mbyte software selectable. addition, 603p uses interim 52-bit virtual address hashed page tables generating 32-bit physical addresses. MMUs 603p rely exception processing mechanism implementation paged virtual memory environment enforcing protection designated memory areas. Instruction data TLBs provide address translation parallel with on-chip cache access, incurring additional time penalty event hit. cache most recently used page table entries. Software responsible maintaining consistency with memory. 603p's TLBs 64-entry, two-way set-associative caches that contain instruction data address translations. 603p provides hardware assist software table search operations through ashed page table misses. Supervisor software invalidate entries selectively. 603p also provides independent four-entry arrays instructions data that maintain address translations blocks memory. These entries define blocks that vary from Kbyte Mbyte. arrays maintained system software. specified PowerPC architecture, hashed page table variable-sized data structure that defines mapping between virtual page numbers physical page numbers. page table size power starting address multiple size. Also specified PowerPC architecture, page table contains number page table entry groups (PTEGs). PTEG contains eight page table entries (PTEs) eight bytes each therefore, each PTEG bytes long. PTEG addresses entry points table search operations.
5.6. Instruction timing
603p pipelined superscalar processor. pipelined processor which processing instruction reduced into discrete stages. Because processing instruction broken into series stages, instruction does require entire resources execution unit. example, after instruction completes decode stage, pass next stage, while subsequent instruction advance into decode stage. This improves throughput instruction flow. example, take three cycles floating-point instruction complete, there stalls floating-point pipeline, series floating-point instructions have throughput instruction cycle.
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instruction pipeline 603p four major pipeline stages, described follows fetch pipeline stage primarily involves retrieving instructions from memory system determining location next instruction fetch. Additionally, decodes branches during fetch stage folds branch instructions before dispatch stage possible. dispatch pipeline stage responsible decoding instructions supplied instruction fetch stage, determining which instructions eligible dispatched current cycle. addition, source operands instructions read from appropriate register file dispatched with instruction execute pipeline stage. dispatch pipeline stage, dispatched instructions their operands latched appropriate execution unit. During execute pipeline stage each execution unit that executable instruction executes selected instruction (perhaps over multiple cycles), writes instruction's result into appropriate rename register, notifies completion stage that instruction finished execution. case internal exception, execution unit reports exception completion/writeback pipeline stage discontinues instruction execution until exception handled. exception signaled until that instruction next completed. Execution most floating-point instructions pipelined within allowing three instructions executing concurrently. pipeline stages floating-point unit multiply, add, round-convert. Execution most load/store instructions also pipelined. load/store units pipeline stages. first stage effective address calculation translation second stage accessing data cache. complete/writeback pipeline stage maintains correct architectural machine state transfers contents rename registers GPRs FPRs instructions retired. completion logic detects instruction causing exception, following instructions cancelled, their execution results rename registers discarded, instructions fetched from correct instruction stream. superscalar processor that issues multiple independent instructions into multiple pipelines allowing instructions execute parallel. 603p five independent execution units, each integer instructions, floating-point instructions, branch instructions, load/store instructions, system register instructions. each have dedicated register files maintaining operands (GPRs FPRs, respectively), allowing integer calculations floating-point calculations occur simultaneously without interference. Because PowerPC architecture applied such wide variety implementations, instruction timing among various PowerPC processors varies accordingly.
6.PREPARATION DELIVERY 6.1. Packaging
Microcircuits prepared delivery accordance with MIL-PRF-38535.
6.2. Certificate compliance
offers certificate compliances with each shipment parts, affirming products compliance either with MIL-STD-883 guarantying parameters tested temperature extremes entire temperature range.
7.HANDLING
devices must handled with certain precautions avoid damage accumulation static charge. Input protection devices have been designed chip minimize effect this static buildup. However, following handling practices recommended Devices should handled benches with conductive grounded surfaces. Ground test equipment, tools operator. handle devices leads. Store devices conductive foam carriers. Avoid plastic, rubber, silk areas. Maintain relative humidity above percent practical.
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TSPC603P 8.PACKAGE MECHANICAL DATA 8.1. pins CQFP
Notes Dimensioning tolerancing ASME Y14.5M-1994 Controlling dimension millimeter. Datum plane located bottom lead coincident with lead where lead exits ceramic body bottom parting line. Datum determined datum plane Dimension determined seating plane Dimension define maximum ceramic body dimensions including glass protrusion bottom mismatch. MILLIMETERS 30.86 31.00 30.86 31.00 3.67 3.95 0.185 0.220 3.10 3.50 0.175 0.200 0.50 2.025 2.100 0.130 0.147 0.45 0.50 0.25 34.41 34.58 17.20 17.30 34.41 34.58 0.25 0.50 17.20 17.30 0.122 0.127 1.80 0.95
31.75 31.75 4.15 0.270 3.90 0.225 2.175 0.175 0.55 34.75 17.40 34.75 0.75 17.40 0.132
Figure Mechanical dimensions Wire-bond CQFP package
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TSPC603P 8.2. package description
following sections provide package parameters mechanical dimensions CBGA packages. 8.2.1.Package parameters package parameters provided following list. package type 255-lead ceramic ball grid array (CBGA). Package outline Interconnects Pitch 1.27 maximum module height 3.16 8.2.2.Mechanical dimensions package Figure provides mechanical dimensions bottom surface nomenclature CBGA package.
NOTES DIMENSIONING TOLERANCING ASME Y14.5M 1994 CONTROLLING DIMENSION MILLIMETER MILLIMETERS INCHES
21.000 21.000
0.827 0.827
2.300 3.160 0.081 0.820 0.830 0.032 1.270 0.790 0.990
0.124 0.036
0.050 0.031 0.039
0.635
0.025 0.630 0.630
5.000 16.000 0.197 5.000 16.000 0.197
Figure Mechanical dimensions bottom surface nomenclature CBGA package
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TSPC603P 9.CLOCK RELATIONSHIPS CHOICE
603p microprocessors offer customers numerous clocking options. internal phase-lock loop synchronizes processor (CPU) clock system clock (SYSCLK) various ratios. Inside each PowerPC microprocessor phase-lock loop circuit. voltage controlled oscillator (VCO) precisely controlled frequency phase frequency/phase detector which compares input frequency (SYSCLK frequency) submultiple VCO. ratio SYSCLK frequencies often referred mode (for example, mode). Table horizontal scale represents frequency (SYSCLK) vertical scale represents PLL-CFG[0-3] signals. given SYSCLK (bus) frequency, configuration signals internal frequency operation.
Table frequencies common frequencies multipliers
PLL_CFG[0-3] Bus-to- Core Multiplier 0100 0101 0110 1000 1110 1010 0111 1011 1001 1101 0011 1111
Notes Some configurations select bus, frequencies which supported PLL-bypass mode, SYSCLK input signal clocks internal processor directly, disabled, mode mode operation. This mode intended factory only. Note timing specifications given this document apply PLL-bypass mode. clock-off mode, clocking occurs inside 603e regardless SYSCLK input.
Frequency (VCO Frequency MHz) Core-to Multiplier (250) (275) (300) 33.33 (266) (300) (333) (366) (400) (280) (320) (360) (400) bypass Clock (250) (300) (350) (400) (300) (360) (420) 66.67 (266) (333) (400)
2.5x 3.5x 4.5x 5.5x
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TSPC603P ORDERING INFORMATION PC603P Revision level prefix Rev. 2.1.1 divider Type Temperature range -55, +125 -40, +110 Package CERQUAD CBGA Screening level Standard MIL-STD-883, class according MIL-STD-883 Upscreening Upscreening burn-in
Prototype
internal processor speed
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