Date: June 2002 From: 35.5K Configurator Product Engineering Subj.: Qu
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35.5K Configurator Qualification Package
Date: June 2002 From: 35.5K Configurator Product Engineering Subj.: Qualification 35.5K Devices
Dear Valued Customer, following Configurator devices fabricated using Atmel's 35.5K processes. Qualification purposes, above process covers following Atmel Configurator devices: AT17LV010 AT17LV010A AT17LV040 AT17LV002 AT17LV002A AT17LV512 AT17LV512A AT17LV256 AT17LV256A AT17LV128 AT17LV128A AT17LV65 AT17LV65A
these devices manufactured based same design rules, minimum geometry's, Atmel's standard 35.5K memory cell. addition, since these devices fabricated same process, they have same number layers, metal passivation, implant levels. devices vary memory density logic, therefore qualifying largest and/or most complex device also covers qualification smaller devices. have questions regarding this matter, please feel free contact Once again, thank your interest Atmel Configurators products.
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35.5K PROCESS QUALIFICATION DATA
ATMEL Device
Samples Delivered:
ABOVE
Units
Product Qualification Policy Fabrication Process Qualification Conditions
Reliability Test Data Data Retention Dynamic Operating Life Test Latch Data Data Package Assembly Process Qualification Conditions
Package Reliability Test Summary Data Lead PLCC
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ATMEL Justification Qualification Similarity
Qualification "similarity" standard practice major suppliers whose product lines extensive diverse Atmel Corporation's. general philosophy practice qualification similarity that product manufactured using exact same materials processing (defined Technology Package Family) will contain same level random defects regardless final product. Product product differences addressed selecting 'worst case' most complex package from Technology Package Family. qualifying 'worst case' die/package from each Family each fab/assembly location, Atmel perform more frequent periodic qualifications Reliability Monitors. This increased frequency best assurance continued high quality reliability Atmel's product.
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ATMEL AT35.5 Process Dynamic Operating Life Test Continuous Read PART TYPE NUMBER DATE SAMPLE TOTAL CODE SIZE 0033 0033 0028 0045 0046 0015 0024 0031 2016 2016 2049 2017 1000 2000 1000 AMBIENT TEMP FAILURES NOTE#
AT17X256 OG0024BA AT17X256 0E5341AB AT17X256 0E5324AA AT24C1024 0G4227 AT93C46 0G4228 AT29BV040 0E1172 AT29BV040 0E3992 AT29BV040 0E3998
Confidence Estimate .6eV .0354FITs/1kbits Confidence Estimate .6eV .0892 FITs/1kbits
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ATMEL AT35.5 Process Data Retention PART TYPE NUMBER DATE CODE SAMPLE TOTAL SIZE AMBIENT TEMP FAILURES NOTE#
AT17X256 AT17X256 AT17X256 AT24C1024 AT29C040A AT29C040A AT29C040A AT17X040
OG0024BA 0033 0E5341AB 0033 0E5324AA 0028 0G4227 0045 0E1172 0015 0E3992 0024 0E3998 0031 C1H0617E 0206 Confidence Estimate .7eV .000241 FITs/1kBits Confidence Estimate .7eV .000607 FITs/1kBits
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ATMEL AT35.5 Process Write Endurance PART TYPE NUMBER A1H3299Q 1J0041BA 1G3766A C1H0617 DATE CODE 0206 0204 0205 0206 SAMPLE SIZE CYCLES AMBIENT TEMP FAILURES Voltage
AT17X256 AT17X010 AT17X002 AT17X040
Configurator Characterization
Device: AT17X256/65/128/AT17X010/512/ AT17X002/AT17X040 Quantity Tested: Each Voltage Test Method: 883, Method 3015 Model: Human Body Test Temperature: Stress Equipment: ORYX Model 11000 Test System Pass/Fail Final Production Test Program: Sentry Functional Tester
Name Data Reset/OE CEO/A2 Ready Ser_En
Function Power Ground Serial Data Clock Tri-State Control Chip Enable Output Enable/ Device Select Reset Complete Enable Mode
Tested Input Input Input Input Input/ Output Output
Positive Negative Pulses Specified Combinations Passing Voltage Qty/Fail Qty/Fail Qty/Fail Qty/Fail Qty/Fail Voltage 500V 1000V 2000V 3500V
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Functional Test Only Failing Identified
Above
2000
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Configurator Latch-Up Characterization
Device: AT17X256/65/128/AT17X010 /512/AT17X002/AT17X040 Quantity Tested: Test Method: JEDEC Test Temperature: Over Current Test Voltage 5.0V Maximum Applied Trigger Current Maximum Applied Trigger Voltage
Name
Function
Tested
Trigger Current Passing Passing Compliance (mA) (mA) Setting -150 -150
Trigger Voltage Passing Passing Compliance Setting (mA) -250
Power Ground Data Serial Data Clock Reset/OE Tri-State Control Chip Enable CEO/A2 Output Enable/ Device Select Ready Reset Complete Ser_En Enable Mode
Input Input Input Input Input/ Output Output Input
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PRODUCT QUALIFICATION POLICY
Fabrication Process Each Microcircuit Group Qualified Quarterly. Microcircuit Groups Defined Mil-PRF-38535 JEDEC Most Complex Product Available Used Qualification. Only Qualified Product Shipped.
Package Assembly Process Each Package Family Qualified Every Weeks. Each Assembly Subcontractor Qualified Every Weeks. Package Families Defined MIL-PRF-38535 JEDEC Worst Case Package Used Qualification. Only Qualified Product Shipped.
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FABRICATION PROCESS QUALIFICATION
Test Flow Conditions
Baseline Electrical Parameters Device Specification Dynamic Lifetest MS883, M1005 Dev, Failure. 1000 Hours Hours @150 Data Retention Bake (NVM Only) 77/1. 1000 Hours Hours Write Endurance (NVM Only, Product) 100/1. 100,000 Cycles Latchup (All Product) JEDEC 2/0. Trigger Current Maximum Operating Temperature. Sensitivity (All Product) MS883, M3015. Human Body Model (15000, 100pf).
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TECHNOLOGY GENERAL 35.5K Processes
THICKNESS PASSIVATION
28mils unground 500-1500 Si02/Si3N4
TECHNOLOGY NAME CELL SIZE METAL PITCH N-CH LEFF P-CH LEFF METAL LAYERS POLY LAYERS TECHNOLOGY
EEPROM 35.5u 9.7u 5000A metal1, 5000A metal2, 8000A metal3 1.3u 1.1u metal1, 2.04u metal2 (Al/Cu 99.5/0.5%) CMOS
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PACKAGE ASSEMBLY PROCESS QUALIFICATION
Plastic Test Flow Conditions Environmental
Baseline Electrical Parameters Device Specification
Static Biased Lifetest JS22, MA101 Dev, Fail. 1000 Hours Relative Humidity Data Retention Bake (NVM Only) 50/0. 1000 Hours Autoclave JS22, MA102 50/0. Hours 100% Relative Humidity Atm. Resistance Soldering Heat JS22, MB106 22/0. Solder Dip. Temperature Cycle MS883, M1010 50/0. 1000 Cycles,
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PACKAGE ASSEMBLY PROCESS QUALIFICATION
Test Flow Conditions Mechanical
Physical Dimensions MS883, M2016. 15/0
Lead Integrity MS883, M2004. 45/0 Adhesion Lead Finish MS883, M2025. 15/0 Resistance Solvents JS22, MB107 MS883, M2015. Solderability MS883, M2003. 38/1 Hours Steam Age. Solder Dip.
CONFIGURATOR, ASSEMBLY MATERIALS
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1/18/99 ASSEMBLY HOUSES: LEAD FRAME AAPI (C151 3/4H)
PLATINGS
ATTACH: OUTER LEADS: SOLDER PLATE, Sn/Pb 85+-10% 15+-10% SILVER FILLED EPOXY
ATTACH MATERIAL
ATTACH VENDOR NUMBER ABLE BOND 1LMISR4 WIRE BONDING TECHNIQUE LEAD FRAME BOND WIRE MATERIAL DIAMETER WIRE BONDING EQUIPMENT THERMOSONIC
99.99%
1484 Turbo/Turbo Plus
MOLDING COMPOUND
SUMITOMO 63000H Qual underway 82000
MATERIAL (flammability) types MOISTURE SENSITIVITY PIDP/SOIC= OTHER TYPES =MSL GLASS TRANSITION TEMP. DEGR (7HR CURE, DEGR)
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Configurator Lead PLCC Package Qualification
DATE: August 1998 TEST SUMMARY 20PLCC Package PQC-6979 TEST DESCRIPTION PASS/FAIL QTY/ACC# QUANTITY FAILED 495/479/77/1 77/1 77/1 77/1
STANDARD PRODUCTION SCREEN BASELINE ELECT PARAMS DATA RETENTION BAKE -188 Elect Params -504 Elect Params -1022 Elect Params
PASS PASS Pass
PRECONDITION -Moisture Soak Reflow -Flux/Reflow -Endpt Elect Params 85/85 BIASED LIFETEST Elect Params Elect Params 1017 Elect Params
PASS
354/0 354/0 354/0 354/0 354/0 77/1 77/1 77/1 77/1
PASS PASS PASS
AUTOCLAVE Elect Params -TEMPERATURE CYCLE Visual Inspection Endpt Elect Params
PASS
100/1 100/1 77/1 77/1 77/1
PASS
THERMAL SHOCK -Visual Inspection -Endpt Elect Params PHYSICAL DIMENSIONS LEAD INTEGRITY ADHESION LEAD FINISH RESISTANCE SOLVENTS SOLDERABILITY
PASS PASS PASS PASS PASS PASS
77/1 77/1 77/1 15/0 (45/0) (15/0) (22/0)
NOTE# Quantities refer devices unless enclosed Which indicate Sub-Units such leads bonds
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