HU6668 EPITAXIAL PLANAR TRANSISTOR Description HU6668 d

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HU6668 EPITAXIAL PLANAR TRANSISTOR Description HU6668 d

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Spec. Preliminary Data Issued Date 1999.03.01 Revised Date 1999.08.01 Page
HU6668
EPITAXIAL PLANAR TRANSISTOR
Description
HU6668 designed general-purpose amplifier switching applications.
Absolute Maximum Ratings (Ta=25°C)
Maximum Temperatures Storage Temperature -55~+150°C Junction Temperature +150°C Maximum Maximum Power Dissipation Total Power Dissipation (Tc=25°C) Maximum Voltages Currents BVCBO Collector Base Voltage BVCEO Collector Emitter Voltage. BVEBO Emitter Base Voltage Collector Current
Electrical Characteristics (Ta=25°C)
Symbol BVCBO BVCEO IEBO ICEO ICEV VCE(sat)1 VCE(sat)2 VBE(on)1 VBE(on)2 hFE1 hFE2 Min. Typ. Max. Unit Test Conditions IC=10mA IC=200mA VEB=5V VCE=80V VCE=80V, VBE(off)=1.5V IC=5A, IB=10mA IC=10A, IB=100mA IC=5A, VCE=3V IC=10A, VCE=3V IC=5A, VCE=3V IC=10A, VCE=3V
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
10000 10000
Spec. Preliminary Data Issued Date 1999.03.01 Revised Date 1999.08.01 Page
Saturation Voltage Collector Current
Saturation Voltage (mV)
1000
VCE=3V
1000
VBE(sat) IC=100IB
VCE(sat) IC=100IB
1000 10000
1000 10000
Collector Current (mA)
Collector Current (mA)
Voltage Collector Current
10000
Switching Time Collector Current
VCC=30V, IC=250IB1=-250IB2
Switching Times (us)
Voltage (mV)
Tstg
1000
VBE(on) VCE=3V
1000 10000
Collector Current (mA)
Collector Current
Capacitance Reverse-Biased Voltage
1000
Capacitance (pF)
Reverse-Biased Voltage
HSMC Product Specification
TO-263 Dimension
Marking
Spec. Preliminary Data Issued Date 1999.03.01 Revised Date 1999.08.01 Page
HSMC Logo Part Number Date Code
Product Series Rank
Style 1.Base 2.Collector 3.Emitter
3-Lead TO-263 Plastic Surface Mounted Package HSMC Package Code *:Typical
Inches Min. Max. 0.3800 0.4050 0.3300 0.3700 0.0550 0.5750 0.6250 0.1600 0.1900 0.0450 0.0550 0.0900 0.1100 0.0180 0.0290
Millimeters Min. Max. 9.65 10.29 8.38 9.40 1.40 14.61 15.88 4.06 4.83 1.14 1.40 2.29 2.79 0.46 0.74
Inches Min. Max. 0.0500 0.0700 *0.1000 0.0450 0.0550 0.0200 0.0390
Millimeters Min. Max. 1.27 1.78 *2.54 1.14 1.40 0.51 0.99
Notes 1.Dimension tolerance based Spec. dated Jan. 09,1998.
2.Controlling dimension millimeters. 3.Maximum lead thickness includes lead finish thickness, minimum lead thickness minimum thickness base material. 4.If there question with packing specification packing method, please contact your local HSMC sales office.
Material
Lead Alloy solder plating Mold Compound Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory
Head Office (Hi-Sincerity Microelectronics Corp.) 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. 886-2-25212056 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5983621~5 886-3-5982931 Factory 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C 886-3-5977061 886-3-5979220 HSMC Product Specification

HU6668 EPITAXIAL PLANAR TRANSISTOR Description HU6668 d

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