MARKETING PART NUMBER CY7C419 CY7C420/CY7C421 CY7C424/CY7C425 DEVICE D

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MARKETING PART NUMBER CY7C419 CY7C420/CY7C421 CY7C424/CY7C425 DEVICE D

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CASCADEABLE FIFOS
MARKETING PART NUMBER CY7C419 CY7C420/CY7C421 CY7C424/CY7C425 DEVICE DESCRIPTION Cascadeable FIFO Cascadeable FIFO Cascadeable FIFO
PRODUCT DESCRIPTION (for qualification)
Information provided this document intended generic qualification technically describes Cypress part supplied: Cascadeable FIFO Marketing Part Device Description: Cypress Division: Size (stepping): CY7C425 1024 Cascadeable FIFO Cypress Semiconductor Corporation Rev. (7C425) 7C425D mils mils (7C425) What markings Die:
Overall Mask) Level (pre-requisite qualification):
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number Metal Layers: Metal Composition: Metal1: 6000A with 1500A Barrier Metal: Ti/TiW 500A/1200A Metal2: TiW/Al/Ti 1500A/10000A/150A None CMOS, Double Poly, Double Metal /0.65 SiO2 Cypress Semiconductor Bloomington, Minnesota Fab3
Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: Generic Process Technology/Design Rule (µ-drawn): Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process
7,000A TEOS 6,000 Oxynitride
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PLASTIC PACKAGE/ASSEMBLY DESCRIPTION (7C425)
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Paste Thermosonic Copper Solder Plate, 85%Sn, 15%Pb Silver Spot Attach Dim: Attach Material: Wire Material/Size: Cypress Bangkok, Thailand Alpha-X P283 mils mils Silver Epoxy Gold 28-pin,300-mil PDIP Sumitomo EME-6300H(R)
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION (7C425)
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Paste Thermosonic Copper Solder Plate, 85%Sn, 15%Pb Silver Spot Attach Dim: Attach Material: Wire Material/Size: Anam, Korea Korea-A/ J32R mils mils Silver Epoxy Gold 32-pin PLCC Sumitomo EME-6300H(R)
HERMETIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Alloy Solder Dipped, 63%Sn, 37%Pb None Silver Glass Ultrasonic Attach Dim: Attach Material: Wire Material/Size: Cypress Bangkok, Thailand Alpha-X /D283 mils mils Silver Glass Aluminum 1.25 28-pin, 300-mil CerDIP (7C425)
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OTHER INFORMATION
approval similarity, identify other devices using same basic with bonding metal mask options test selections explain: Cypress planning changes near future, identify change (Qtr/Yr) Design Rev./Shrink: Fab/Assembly site change: Other Devices qualified this technology: Other Packages qualified this device: Voltage Rating (per STD-008, Method 3018): Flammability Classification (UL-94V): Alternate Fab/Assembly Locations: None Assembly >2,200V Process Change: Cross Licensee/Licensor:
Please attach following Qualification Reliability data revision Package type, assembly sites identified above (mark included): HAST (5.5V, 140°C, 85%RH, 15psig) Temperature Cycles (-65°C 150°C) Temperature Cycles (-40°C 165°C) Data Retention Bake, Plastic (165°C) Data Retention Bake, Hermetic (250°C) Autoclave (PCT, 121°C, 100%RH) Operating Life (temp): Steady State Life (HTSSL, 5.5V, 150°C) Temperature Humidity Bias (5.5V, 85°C, 85%RH) Latchup Testing Tests (MIL-STD 883, method 3015) Other: Current Density 150°C
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PRODUCT INFORMATION QUALIFICATION SIMILARITY
Product Family: Division: Cascadeable FIFO Cypress Semiconductor Size/ Type Rev. Size Design Rule (stepping) Fabrication Passivation Mold Type Compound Assembly Line Location Volt Rating
Supplier's Part Number Rated Speed (ns)
Process Line CY7C419 -**AC -**JC -**PC -**VC -**DMB -**LMB -**PC -**DMB -**AC -**JC -**PC -**VC -**DMB -**LMB -**PC/PI -**DC/DMB -**AC -**JC -**PC -**VC -**DMB -**LMB TPQF PLCC 28.3 PDIP 28.3 28.3 CDIP 28.6 PDIP 28.6 CDIP TPQF PLCC 28.3 PDIP 28.3 28.3 CDIP 28.6 PDIP 28.6 CDIP TPQF PLCC 28.3 PDIP 28.3 28.3 CDIP 0.65 CMOS TEOS Oxynitride Sumitomo Anam-Bupyong, Korea Anam, Korea CBI, Thailand CBI, Thailand CBI, Thailand CBI, Thailand Sumitomo Omedata, Indonesia CBI, Thailand Sumitomo Anam-Bupyong, Korea Anam, Korea CBI, Thailand CBI, Thailand CBI, Thailand CBI, Thailand Sumitomo Omedata, Indonesia CBI, Thailand Sumitomo Anam-Bupyong, Korea Anam, Korea CBI, Thailand CBI, Thailand CBI, Thailand CBI, Thailand >2,200V >2,000V
CY7C420
0.65µ
CMOS CMOS
TEOS Oxynitride TEOS Oxynitride
>2,200V >2,000V >2,200V >2,000V
CY7C421
0.65µ
CY7C424
0.65µ
CMOS CMOS
TEOS Oxynitride TEOS Oxynitride
>2,200V >2,000V >2,200V >2,000V
CY7C425
0.65µ
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Marketing Part: Description:
CY7C425 28-pin, 300-mil PDIP 28-pin, 300-mil CDIP PLCC
DEVICE RELIABILITY SUMMARY
Wafer Fab:
Fab3 Bloomington,
High Temperature Dynamic Operating Life (HTOL, 5.5V, 150°C) Early Failure Rate Device CY7C425-JC CY7C425-DM Assy Lot# 349502582 219505497 3502997 3510700 Hours 0/504 0/504 Cumulative 0/1008
High Temperature Dynamic Operating Life (HTOL, 5.5V, 150°C) Latent Failure Rate Device CY7C425-JC CY7C425-DM Assy Lot# 349502582 219505497 Lot# 3502997 3510700 Hours 0/127 0/116 Hours 0/127 0/116 Cumulative 0/243
Long Life Verification (LLVA, 5.5V, 150°C) Device CY7C425-PC Assy Lot# 219507057 Lot# 3510700 1000 Hours 0/120 Cumulative 0/120
High Temperature Steady State Life (HTSSL, 5.5V, 150°C) Device CY7C425-JC CY7C425-DM Assy Lot# 349502582 219505497 Lot# 3502997 3510700 Hours 0/78 0/98 Hours 0/78 0/98 Cumulative 0/176
Temperature Cycle (Condition -65°C 150°C) Device CY7C425-DM Assy Lot# 219505497 Lot# 3510700 Cycles 0/45 1000 Cycles 0/45 1000 Cycles Cumulative 0/45
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CYPRESS SEMICONDUCTOR
Marketing Part: Description:
CY7C425 28-pin, 300-mil PDIP 28-pin, 300-mil CDIP PLCC
DEVICE RELIABILITY SUMMARY
Wafer Fab:
Fab3 Bloomington,
Temperature Cycle (Condition -65°C 150°C), precondition hours (121°C, 100%RH) Device CY7C425-JC Assy Lot# 349502581 Lot# 3502997 Cycles 0/46 1000 Cycles 0/46 1000 Cycles Cumulative 0/46
Group Subgroup Life test (150°C, 5.75V) Device Assy Lot# Lot# 3510700 Hours 0/45 Cumulative 0/45
CY7C425-DMB 219505496
Autoclave (PCT, bias, 121°C, 100%RH, 15psig), precondition Temperature Cycles Device CY7C425-JI Assy Lot# 349502851 Lot# 3502997 Hours 0/46 Cumulative 0/46
High Accelerated Saturation Test (HAST, 140°C, 5.5V, 85%RH), precondition Temperature Cycles Device CY7C425-PC Assy Lot# 349502698 Lot# 3502997 Hours 0/47 Cumulative 0/47
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CYPRESS SEMICONDUCTOR
Marketing Part: Description:
CY7C425 28-pin, 300-mil PDIP 28-pin, 300-mil CDIP PLCC
DEVICE RELIABILITY SUMMARY
Wafer Fab:
Fab3 Bloomington,
Electrostatic Discharge Human Body Model Circuit 883, Method 3015 >+2,000V >+2,000V >+2,000V >+2,000V >+2,000V >+2,000V Unit Unit Unit Charge Device Model Unit Unit Unit >-2,000V >-2,000V >-2,000V >-2,000V >-2,000V >-2,000V
Latchup Testing Cypress Internal Latch-up Procedure Tests: Current Injection 200mA Trigger Socket Temp 125°C
Other miscellaneous tests Current Density Pass
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CYPRESS PREVIOUS QUALIFICATION DATA
Device: Process
7C42X Cascadeable FIFOs CMOS Technology: CMOS 0.8µm Technology Process Location: Jose,
Cypress Test
Stress/Test
Reference Method Temp/Bias
Actual Conditions
Status SS/Fail 0/1763 0/3053
Qualification Data Reference
Test Result
Hrs/Cyc
Pass QTP# 89113
Fail
HTOL
29-00020
150C/5.75V
HTOL
29-00020
150C/5.75V
0/400 0/400
QTP# 89113
High Temp. Bake/DRET HAST 25-00063 140C/5.5V Cycs Cycs 1000 Cycs 0/55 0/55 0/110 1/108 0/165 0/55 10/161 QTP# 89113
Steam Test/Autoclave/PCT
25-00047
121C,100%RH psig -65C 150C
QTP# 89113
Temperature Cycle
Cond.
QTP# 89113
HTSSL
29-00020
150C, 5.75V
Mechanical Sequence X-Ray ESD-HBM ESD-CDM Latch-up Flammability Oxygen Index Moisture Resistance Internal Water Vapor Solvent Resistance Internal Visual Physical Dimensions Corner Pins Corner Pins Internal Pins Internal Pins QTP# 89113 QTP# 89113 QTP# 89113
Assembly bonding problem Assembly bonding defects, Functional
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CYPRESS SEMICONDUCTOR
Lead Integrity Bond Strength

MARKETING PART NUMBER CY7C419 CY7C420/CY7C421 CY7C424/CY7C425 DEVICE D

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