High speed differential line driver Rev. August 2002 Product data

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High speed differential line driver Rev. August 2002 Product data

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PTN3331
High speed differential line driver
Rev. August 2002 Product data
Description
PTN3331 differential line driver that implements electrical characteristics Low-Voltage Differential Signaling (LVDS) that meets exceeds requirements ANSI TIA/EIA-644 Standard. LVDS used achieve higher data rates commonly used media. LVDS overcomes limitations achievable slew rates restrictions previous differential signaling techniques. PTN3331 operates volt supply levels current mode output drivers. output drivers will deliver minimum into load when enabled. intended application this device point-to-point baseband transmission rates over controlled impedance media approximately maximum rate distance data transfer dependent upon attenuation characteristics media selected noise coupling environment. PTN3331 designed function over full industrial temperature range
Features
Meets exceeds requirements ANSI TIA/EIA-644 Standard Low-Voltage Differential Signaling with output voltage across load maximum channel channel output skew typical output voltage rise fall times Power dissipation typical Driver high impedance when disabled with volt tolerant inputs with Voltage (LVTTL) logic input levels Pin-compatible with AM26LS31 SN65LVDS31.
Applications
voltage, EMI, high speed differential signaling Point-to-point high speed data transmission High performance switches routers.
Philips Semiconductors
PTN3331
High speed differential line driver
Ordering information
Table Ordering information Package Name PTN3331DH PTN3331D TSSOP16 SO16 Description plastic thin shrink small outline package; leads; body width plastic small outline package; leads; body width Version SOT403-1 SOT109-1 Type number
Functional diagram
PTN3331
LVDS
LVDS
LVDS
LVDS
002aaa017
Functional diagram.
9397 08339
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Product data
Rev. August 2002
Philips Semiconductors
PTN3331
High speed differential line driver
Pinning information
Pinning
PTN3331DH
PTN3331D
002aaa025
002aaa018
TSSOP16 configuration.
SO16 configuration.
description
Table Symbol description Description LVTTL input LVDS non-inverting output LVDS inverting output Enable (active-HIGH) LVDS inverting output LVDS non-inverting output LVTTL input Ground LVTTL input LVDS non-inverting output LVDS inverting output Enable (active-LOW) LVDS inverting output LVDS non-inverting output LVTTL input Supply
9397 08339
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Product data
Rev. August 2002
Philips Semiconductors
PTN3331
High speed differential line driver
Functional description
Function table
Table Function table HIGH level; level; irrelevant; high impedance. Input Open Open Enables Outputs
Limiting values
Table Limiting values accordance with Absolute Maximum Rating System (IEC 60134). Symbol Tamb Tstg Parameter supply voltage input voltage short circuit duration operating ambient temperature range operating junction temperature storage temperature range
-0.5 -0.5
+150 +150
Unit
Continuous
Values beyond absolute maximum ratings cause device prematurely damaged. Absolute maximum ratings stress ratings only functional device operation implied.
Recommended operating conditions
Table Symbol Recommended operating conditions Parameter supply voltage HIGH-level input voltage LOW-level input voltage Unit
9397 08339
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Product data
Rev. August 2002
Philips Semiconductors
PTN3331
High speed differential line driver
Static characteristics
Table electrical characteristics Over recommended operating conditions, unless otherwise noted. Symbol VOC(SS) VOC(SS) Parameter differential output voltage change differential voltage magnitude between logic states Steady-state common-mode output voltage Change steady-state common-mode output voltage between logic states Peak-to-peak common-mode output voltage Supply current enabled, load enabled, VCC; disabled IO(OFF)
Conditions Figure
1.125
Typ[1]
1.375
Unit
VOC(PP)
0.25
HIGH-level input current LOW-level input current Output short circuit current High-impedance output current Power-off output current Input capacitance
VO(Y) VO(Z)
typical values Tamb
9397 08339
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Product data
Rev. August 2002
Philips Semiconductors
PTN3331
High speed differential line driver
Dynamic characteristics
Table electrical characteristics Over recommended operating conditions, unless otherwise noted. Symbol tPLH tPHL tsk(p) tsk(o) tsk(p-p) tPZH tPZL tPHZ tPLZ Parameter Propagation delay, LOW-to-HIGH level output Propagation delay, HIGH-to-LOW level output Differential output rise time 80%) Differential output fall time 20%) Pulse skew (tPHL tPLH) Channel-to-channel output skew Part-to-part skew Propagation delay, high-impedance HIGH-level output Propagation delay, high-impedance LOW-level output Propagation delay, HIGH-level high-impedance output Propagation delay, LOW-level high-impedance output Figure
[2], [3],
Conditions Figure
Typ[1]
Unit
typical values Tamb tsk(o) skew between specified outputs single device with driving inputs connected together outputs switching same direction while driving identical specified loads. tsk(p-p) magnitude difference propagation delay times between specified terminals devices when both devices operate with same supply voltages, same temperature, have identical packages test circuits. Guaranteed design characterization.
9397 08339
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Product data
Rev. August 2002
Philips Semiconductors
PTN3331
High speed differential line driver
Test figures
LVDS
VOC(PP) VOC(SS)
LVDS 49.9 PLACES)
002aaa019
Test circuit voltage definitions.
INPUT tPHL tPLH 100%
002aaa020
Propagation delay definitions.
9397 08339
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Product data
Rev. August 2002
Philips Semiconductors
PTN3331
High speed differential line driver
tPHZ tPZH 100%, tPZL tPLZ 100%,
002aaa021
Enable disable time definitions.
9397 08339
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Product data
Rev. August 2002
Philips Semiconductors
PTN3331
High speed differential line driver
Package outline
TSSOP16: plastic thin shrink small outline package; leads; body width SOT403-1
index
detail
scale
DIMENSIONS original dimensions) UNIT max. 1.10 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.65 0.75 0.50 0.13 0.40 0.06
Notes Plastic metal protrusions 0.15 maximum side included. Plastic interlead protrusions 0.25 maximum side included. OUTLINE VERSION SOT403-1 REFERENCES JEDEC MO-153 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-04-04 99-12-27
TSSOP16 package outline (SOT403-1).
9397 08339 Koninklijke Philips Electronics N.V. 2002. rights reserved.
Product data
Rev. August 2002
Philips Semiconductors
PTN3331
High speed differential line driver
SO16: plastic small outline package; leads; body width
SOT109-1
index detail
scale
DIMENSIONS (inch dimensions derived from original dimensions) UNIT inches max. 1.75 0.25 0.10 1.45 1.25 0.25 0.01 0.49 0.36 0.25 0.19 10.0 0.16 0.15 1.27 1.05 0.039 0.016 0.028 0.020 0.25 0.01 0.25 0.01
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.050 0.041 0.228
0.028 0.004 0.012
Note Plastic metal protrusions 0.15 maximum side included. OUTLINE VERSION SOT109-1 REFERENCES 076E07 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
SO16 package outline (SOT109-1).
9397 08339 Koninklijke Philips Electronics N.V. 2002. rights reserved.
Product data
Rev. August 2002
Philips Semiconductors
PTN3331
High speed differential line driver
Soldering
14.1 Introduction soldering surface mount packages
This text gives very brief insight complex technology. more in-depth account soldering found Data Handbook IC26; Integrated Circuit Packages (document order number 9398 90011). There soldering method that ideal surface mount packages. Wave soldering still used certain surface mount ICs, suitable fine pitch SMDs. these situations reflow soldering recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste suspension fine solder particles, flux binding agent) applied printed-circuit board screen printing, stencilling pressure-syringe dispensing before package placement. Several methods exist reflowing; example, convection convection/infrared heating conveyor type oven. Throughput times (preheating, soldering cooling) vary between seconds depending heating method. Typical reflow peak temperatures range from top-surface temperature packages should preferable kept below thick/large packages, below small/thin packages.
14.3 Wave soldering
Conventional single wave soldering recommended surface mount devices (SMDs) printed-circuit boards with high component density, solder bridging non-wetting present major problems. overcome these problems double-wave soldering method specifically developed. wave soldering used following conditions must observed optimal results:
double-wave soldering method comprising turbulent wave with high
upward pressure followed smooth laminar wave.
packages with leads sides pitch (e):
larger than equal 1.27 footprint longitudinal axis preferred parallel transport direction printed-circuit board; smaller than 1.27 footprint longitudinal axis must parallel transport direction printed-circuit board. footprint must incorporate solder thieves downstream end.
packages with leads four sides, footprint must placed angle
transport direction printed-circuit board. footprint must incorporate solder thieves downstream side corners.
9397 08339
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Product data
Rev. August 2002
Philips Semiconductors
PTN3331
High speed differential line driver
During placement before soldering, package must fixed with droplet adhesive. adhesive applied screen printing, transfer syringe dispensing. package soldered after adhesive cured. Typical dwell time seconds mildly-activated flux will eliminate need removal corrosive residues most applications.
14.4 Manual soldering
component first soldering diagonally-opposite leads. voltage less) soldering iron applied flat part lead. Contact time must limited seconds When using dedicated tool, other leads soldered operation within seconds between
14.5 Package related soldering information
Table Package[1] BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, PLCC[4], LQFP, QFP, TQFP SSOP, TSSOP,
Suitability surface mount packages wave reflow soldering methods Soldering method Wave suitable suitable[3] suitable recommended[4][5] recommended[6] Reflow[2] suitable suitable suitable suitable suitable
more detailed information packages refer (LF)BGA Application Note (AN01026); order copy from your Philips Semiconductors sales office. surface mount (SMD) packages moisture sensitive. Depending upon moisture content, maximum temperature (with respect time) body size package, there risk that internal external package cracks occur vaporization moisture them (the called popcorn effect). details, refer Drypack information Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These packages suitable wave soldering. versions with heatsink bottom side, solder cannot penetrate between printed-circuit board heatsink. versions with heatsink side, solder might deposited heatsink surface. wave soldering considered, then package must placed angle solder wave direction. package footprint must incorporate solder thieves downstream side corners. Wave soldering suitable LQFP, TQFP packages with pitch larger than definitely suitable packages with pitch equal smaller than 0.65 Wave soldering suitable SSOP TSSOP packages with pitch equal larger than 0.65 definitely suitable packages with pitch equal smaller than
Revision history
Table Date 20020806 Revision history CPCN Description Product data. Initial version. Engineering Change Notice 853-2362 28701 dated 2002 August
Koninklijke Philips Electronics N.V. 2002. rights reserved.
9397 08339
Product data
Rev. August 2002
Philips Semiconductors
PTN3331
High speed differential line driver
Data sheet status
Data sheet status[1] Objective data Preliminary data Product status[2] Development Qualification Definition This data sheet contains data from objective specification product development. Philips Semiconductors reserves right change specification manner without notice. This data sheet contains data from preliminary specification. Supplementary data will published later date. Philips Semiconductors reserves right change specification without notice, order improve design supply best possible product. This data sheet contains data from product specification. Philips Semiconductors reserves right make changes time order improve design, manufacturing supply. Changes will communicated according Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Product data
Production
Please consult most recently issued data sheet before initiating completing design. product status device(s) described this data sheet have changed since this data sheet published. latest information available Internet
Definitions
Short-form specification data short-form specification extracted from full data sheet with same type number title. detailed information relevant data sheet data handbook. Limiting values definition Limiting values given accordance with Absolute Maximum Rating System (IEC 60134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections specification implied. Exposure limiting values extended periods affect device reliability. Application information Applications that described herein these products illustrative purposes only. Philips Semiconductors make representation warranty that such applications will suitable specified without further testing modification.
Disclaimers
Life support These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips Semiconductors customers using selling these products such applications their risk agree fully indemnify Philips Semiconductors damages resulting from such application. Right make changes Philips Semiconductors reserves right make changes, without notice, products, including circuits, standard cells, and/or software, described contained herein order improve design and/or performance. Philips Semiconductors assumes responsibility liability these products, conveys licence title under patent, copyright, mask work right these products, makes representations warranties that these products free from patent, copyright, mask work right infringement, unless otherwise specified.
Contact information
additional information, please visit sales office addresses, send e-mail
9397 08339
Fax: 24825
Koninklijke Philips Electronics N.V. 2002. rights reserved.
Product data
Rev. August 2002
Philips Semiconductors
PTN3331
High speed differential line driver
Contents
14.1 14.2 14.3 14.4 14.5 Description Features Applications Ordering information Functional diagram Pinning information Pinning description Functional description Function table Limiting values. Recommended operating conditions. Static characteristics. Dynamic characteristics Test figures. Package outline Soldering Introduction soldering surface mount packages Reflow soldering Wave soldering Manual soldering Package related soldering information Revision history Data sheet status Definitions Disclaimers
Koninklijke Philips Electronics N.V. 2002. Printed U.S.A
rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights. Date release: August 2002 Document order number: 9397 08339

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