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MATRA HARRIS FAB FOR PALC22V10D


PRODUCT DESCRIPTION (for qualification)

Qualification Report
June 1995, Version 1.0
MATRA HARRIS FAB FOR PALC22V10D
PRODUCT DESCRIPTION (for qualification)
Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied: Marketing Part #: Cypress Division: Die Size (stepping): PALC22V10D Cypress Semiconductor Corporation, PLD Group 7C3221E 7C322D 106 mils x 135 mils What ID markings on Die: Device Description: FLASH ERASABLE REPROGRAMABLE CMOS PLD Overall Die (or Mask) REV Level (pre-requisite for qualification): Cypress Qualification completion / Marketing Availability Dates (Current REV):
TECHNOLOGY / FAB PROCESS DESCRIPTION
Generic Process Technology / Design Rule (µ-drawn): Gate Oxide Material / Thickness (MOS): Name / Location of Die Fab (prime) Facility: Die Fab Line ID / Wafer Process ID:
CYPRESS SEMICONDUCTOR PAGE 3
PLASTIC PACKAGE / ASSEMBLY DESCRIPTION
CYPRESS SEMICONDUCTOR PAGE 4
OTHER INFORMATION
For approval by similarity, identify other devices using the same basic die with bonding or metal mask options or test selections and explain:
If Cypress is planning any changes in the near future, identify change (Qtr / Yr) in: Die Design Rev. / Shrink: Fab / Assembly site change: Other Devices to be qualified in this technology: Other Packages to be qualified for this device: ESD Voltage Rating (per MIL STD-008, Method 3018): Flammability Classification (UL-94V): Alternate Fab / Assembly Locations: Assembly: Cypress Bangkok, Thailand (PDIP) Anam, Korea / Hyundai, Korea (PLCC) PLCC 2, 200V (HBM) 1, 500V (CDM) Die Process Change: Cross Licensee / Licensor:
CYPRESS SEMICONDUCTOR PAGE 5
PRODUCT INFORMATION FOR QUALIFICATION BY SIMILARITY
Process Line ID ID PALC22V10D-PC PALC22V10D-JC 7 ns 24.3 PDIP to 28S PLCC 15 ns 7C3221E 106 x 135 0.65µ FLASH 22 9 Plasma Ox + Oxynitride Sumitomo Omedata-Indonesia Anam-Korea 2200V HBM 1500V CDM
CYPRESS SEMICONDUCTOR PAGE 6
DEVICE RELIABILITY SUMMARY
Device Type(s): Pkg Description: PALC22V10D 24-pin Plastic DIP, 300-mil Wafer Fab: Assembly: Fab 9 - Mattra Harris, France Omedata, Indonesia
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) - Early Failure Rate Device PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC Fab Lot# 9441081 9442083 9443084 9443084 Assy Lot# 349413168 349413496 349414067 349501766 48 Hours 0 / 524 0 / 451 0 / 73 0 / 677 Cumulative 0 / 17171
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) - Latent Failure Rate Device PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC Fab Lot# 9441091 9442083 9504085 Assy Lot # 349413168 349413496 349501766 80 Hours 0 / 118 0 / 119 0 / 1182 500 Hours 0 / 118 0 / 119 0 / 1163 Cumulative 0 / 353
High Temperature Steady State Life Test (HTSSL, 5.75V, 150°C) Device PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC Fab Lot# 9441081 9442083 9443084 9504085 Assy Lot# 349413168 349413496 349414067 349501766 80 Hours 0 / 844 0 / 85 0 / 85 0 / 83 168 Hours 0 / 825 0 / 85 0 / 85 0 / 83 Cumulative 0 / 335
16 EOS 1 EOS 2 EOS 1 EOS 2 EOS
CYPRESS SEMICONDUCTOR PAGE 7
DEVICE RELIABILITY SUMMARY
Device Type(s): Pkg Description: PALC22V10D 24-pin Plastic DIP, 300-mil Wafer Fab: Assembly: Fab 9 - Mattra Harris, France Omedata, Indonesia
Temperature Cycle (Condition C, -65°C to 150°C) Device PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC Fab Lot# 9441081 9442083 9443084 9504085 Assy Lot# 349413168 349413496 349414067 349501766 300 Cycles 0 / 51 0 / 51 0 / 51 0 / 45 1000 Cycles 0 / 51 0 / 51 0 / 51 0 / 45 Cumulative 0 / 198
Data Retention Bake, Plastic Package Device (No bias, 165°C) Device PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC Fab Lot# 9441081 9442083 9443084 9504085 Assy Lot# 349413168 349413496 349414067 349501766 168 Cycles 0 / 85 0 / 85 0 / 85 0 / 80 552 Hours 0 / 85 0 / 85 0 / 85 0 / 80 Hours Cumulative 0 / 335
Long Life Verification (LLVA, 5.75V, 150°C) Device PALC22V10D-PC Fab Lot# 9504085 Assy Lot# 349501766 1000 Hours 0 / 116 Cumulative 0 / 116
CYPRESS SEMICONDUCTOR PAGE 8
DEVICE RELIABILITY SUMMARY
Device Type(s): Pkg Description: PALC22V10D 24-pin Plastic DIP, 300-mil Wafer Fab: Assembly: Fab 9 - Mattra Harris, France Omedata, Indonesia
Cold Life Test (LTOL, 6.5V, -45°C) Device PALC22V10D-PC Fab Lot# 9441081 Assy Lot# 349413168 500 Hours 0 / 51 1000 Hours 0 / 51 Cumulative 0 / 51
CYPRESS SEMICONDUCTOR PAGE 9
DEVICE RELIABILITY SUMMARY
Device Type(s): Pkg Description: PALC22V10D 24-pin Plastic DIP, 300-mil Wafer Fab: Assembly: Fab 9 - Mattra Harris, France Omedata, Indonesia
Other miscellaneous tests Age Bond Strength : Passed Current Density : Passed