Static PRODUCT DESCRIPTION (for qualification) Information p
|
|
|
Top Searches for this datasheet
CY6264
Static
PRODUCT DESCRIPTION (for qualification)
Information provided this document intended generic qualification technically describes Cypress part supplied: Marketing Part Device Description: Cypress Division: Size (stepping): CY7C6264 SRAM Cypress Semiconductor Corporation REV. 7C185B 4/1994 mils mils What markings Die:
Overall Mask) Level (pre-requisite qualification): Cypress Qualification completion/Marketing Availability Dates (Current REV):
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number Metal Layers: Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process Polyimide CMOS, Double Poly, Single Metal /0.8 SiO2 Cypress Semiconductor, Bloomington, Fab3 Generic Process Technology/Design Rule (µ-drawn): Metal Composition: 500A 1200A TiW, 8500A SiAl, 500A None 4,000A 15,000 Oxynitride
PAGE
CYPRESS SEMICONDUCTOR
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Epoxy Thermocompression Copper Solder Plated, 85%Sn, 15%Pb Silver Attach Dim: Attach Material: Wire Material/Size: Hyundai, Korea KOREA-H/S31 mils mils Silver Epoxy Gold 28-pin, 330-mil SOIC mils side Sumitomo EME-6300H(R)
PAGE
CYPRESS SEMICONDUCTOR
OTHER INFORMATION
approval similarity, identify other devices using same basic with bonding metal mask options test selections explain: CY7C161, CY7C162, CY7C164, CY7C166, CY7C185, CY7C187 Cypress planning changes near future, identify change (Qtr/Yr) Design Rev./Shrink: Fab/Assembly site change: Other Packages qualified this device: Voltage Rating (per STD-008, Method 3018): Flammability Classification (UL-94V): Alternate Fab/Assembly Locations: None Assembly >4,000V Other Devices qualified this technology: Process Change: Cross Licensee/Licensor:
Please attach following Qualification Reliability data revision Package type, assembly sites identified above (mark included): HAST (5.5V, 130°C, 85%RH, 15psig) Temperature Cycles (-65°C 150°C) Temperature Cycles (-40°C 165°C) Data Retention Bake, Plastic (165°C) Data Retention Bake, Hermetic (250°C) Autoclave (PCT, 121°C, 100%RH) Operating Life (temp): Steady State Life (HTSSL, 5.75V, 150°C) Temperature Humidity Bias (5.5V, 85°C, 85%RH) Latchup Testing Tests (MIL-STD 883, method 3015) Other: Current Density Input Capacitance Read Record Life Test Internal Water Vapor Aged Bond Strength 150°C
PAGE
CYPRESS SEMICONDUCTOR
PAGE
CYPRESS SEMICONDUCTOR
PRODUCT INFORMATION QUALIFICATION SIMILARITY
Product Family: Division: SRAM Family Cypress Semiconductor Rated Speed (all pkgs) Size/ Type (all fabs) Size (stepping) Design Rule Fabrication Passivation Mold Type Compound (all pkgs) Primary Assembly Line Location Volt Rating
Supplier's Part Number
Process Line
CY6264 -xxSC 28.3 SOIC 7C185B 0.8µ CMOS, Oxynitride Sumitomo Hyundai, Korea >4,000V
PAGE
CYPRESS SEMICONDUCTOR
DEVICE RELIABILITY SUMMARY
Marketing Part: Description: CY6264 28-pin, 330-mil SOIC Wafer Fab: Assembly: Bloomington, Hyundai, Korea
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Early Failure Rate Device CY7C6264 CY7C6264 CY7C6264 CY7C6264 CY7C6264 3402940 3401905 3404115 3401905 3403004 Assy 49402048 219401134 49403408 219401135 219403358 Hours 0/520 0/520 0/3281 (1EOS) 0/1848 0/902 Cumulative 0/7071
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Latent Failure Rate Device CY7C6264 CY7C6264 CY7C6264 Lot# 3401905 3219339 3218278 Assy 219401134 84726 84725 Hours 0/120 0/194 0/196 Hours1 Cumulative 0/510 0/194 0/196
High Temperature Dynamic Operating Life, Family data2 (HTOL, 5.75V, 150°C) Latent Failure Rate Device CY7C6264 CY7C6264 Lot# 3306711 3247325 Assy 100291 94840 Hours 0/122 0/270 Hrs) Hours 0/122 0/270 1000 Hours 0/122 Cumulative 0/392
Cypress previous qualification #92281. 256K SRAM, Technology, Reliability Monitor #M34004 #M33016.
PAGE
CYPRESS SEMICONDUCTOR
DEVICE RELIABILITY SUMMARY
Marketing Part: Description: CY7C6264 28-pin, 330-mil SOIC Wafer Fab: Assembly: Bloomington, Hyundai, Korea
High Accelerated Saturation Test (HAST, 5.5V, 140°C, 85%RH) Precondition Temperature Cycles Condition (-65°C 150°C) Device CY7C6264 CY7C6264 Lot# 3402940 3401905 Assy 49402048 219401134 Hours 0/45 0/45 Cumulative 0/90
Temperature Cycle (Condition -65°C 150°C) Device CY7C6264 CY7C6264 Lot# 3402940 3401905 Assy 49402048 219401134 Cycles 0/45 0/45 1000 Cycles 0/45 0/45 Cumulative 0/90
Temperature Cycle Family data3 (JEDEC22, Condition -40°C 125°C) Precondition hours Pressure Cooker Test (PCT, bias, 121°C, 100%RH, 15psig) Device CY7C199 Lot# 3309792 Assy 98573/4/6 Cycles 0/81 1000 Cycles 0/81 Cumulative 0/81
Temperature Cycle Family data4 (Condition -65°C 150°C) Precondition hours Pressure Cooker Test (PCT, bias, 121°C, 100%RH, 15psig) Device CY7C199 CY7C199 Lot# 3340141 3340141 Assy 219306146 219306147 Cycles 0/54 0/45 Cumulative 0/99
256K SRAM, Technology, Reliability Monitor M32007 256K SRAM, Technology, Qualification #93372
PAGE
CYPRESS SEMICONDUCTOR
DEVICE RELIABILITY SUMMARY
Marketing Part: Description: CY7C6264 28-pins, 300-mil SOIC Wafer Fab: Assembly: Bloomington, Hyundai, Korea
Autoclave (PCT, bias, 121°C, 100%RH, 15psig) Precondition Temperature Cycles Conditon (-65°C 150°C) Device CY7C6264 CY7C6264 Lot# 3402940 3401905 Assy 49402048 219401134 Hours 0/45 0/45 Cumulative 0/90
PAGE
CYPRESS SEMICONDUCTOR
Device Reliability Summary
SRAM, SHRINK CY7C6264 Electrostatic Discharge Human Body Model Circuit 883, Method 3015 >+4,000V Unit >-4,000V >+4,000V Unit >-4,000V >+4,000V Unit >-4,000V (Highest passing voltage, +10% Guard-banded)
Latchup Testing Cypress Internal Latch-up Procedure Tests: lots) 0/10 Current Injection 200mA Trigger Socket Temp 125°C
Other recent searches
SN74LVC - SN74LVC SN74LVC Datasheet
LVCHXXXXA - LVCHXXXXA LVCHXXXXA Datasheet
MHW7222BN - MHW7222BN MHW7222BN Datasheet
HM72A - HM72A HM72A Datasheet
BGA2003 - BGA2003 BGA2003 Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
