DICE CODIFICATION CODIFICATION JUNCTION IT(RMS) VD
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SCR's TRIACS
DICE
CODIFICATION
CODIFICATION
JUNCTION
IT(RMS) VDRM 1/10 METALLIZATION DELIVERY FORM
UNCTION RIAC TECHNIC MESA TECHNOLOGY MESA PLANAR PLANAR TOPGLASS TOPGLASS CODE FRONT SIDE NiAu PbSn PbSnAg BACK SIDE NiAu PbSn (183°C) PbSnAg (300°C) NiAg ALNiAu
TOPGLASS
SENSITIVITY TRIAC TRIAC
SENSITIVE STANDARD
cribed wafer, tested, defects inked. wafer, ring expanded. Electrically orted deliv ered waffle Chips electrically isually sorted deliv ered waffle wafer, frame.
1/21
MANUFACTURING FLOW CHART
MESA TECHNOLOGY
WAFER MANUFACTURING (diffusion, metallization)
GATE
DICE SEPARATION
100% ELECTRICAL TEST DELIVERY FORM CHIPS delivered compartment CODE
100% VISUAL INSPECTION CHIPS visually sorted delivered compartment INSPECTION
inspection done through sampling batches SUBGROUP VISUAL MECHANICAL ELECTRICAL 25°C SAMPLING LEVEL 0.40 0.40
2/21
MANUFACTURING FLOW CHART
PLANAR TOPGLASS TECHNOLOGIES
WAFER MANUFACTURING (diffusion, metallization)
GATE
DELIVERY FORM
CODE
100% ELECTRICAL TEST
WAFER defective items inked
DICE SEPARATION
EXPANDED WAFER standard ring pair, defective items inked
EXPANDED WAFER FRAME defective items inked
INSPECTION
PREFERED DELIVERY FORM
inspection done through sampling batches SUBGROUP VISUAL MECHANICAL ELECTRICAL 25°C SAMPLING LEVEL 0.40 0.40
3/21
TECHNOLOGY
MESA TECHNOLOGY
METALLIZATION
CATHODE GATE
GLASS
METALLIZATION
ANODE
PLANAR TECHNOLOGY
LLIZA
oxyde
cathode
gate
oxyde
anode
LIZA
TOPGLASS TECHNOLOGY
METALLIZA TION cathode
GLASS
gate
anode
ALLIZA TION
4/21
DRAWING
RING PAIR code)
186mm
6+0.1/-0
170mm
5/21
DRAWING
FRAME code) Dimensions milimeters
60.20 43.29
63.50 43.29
85.70
212.00
4.00
212.00
COMPARTMENT code)
COVER
HOLES
COVER ANTISTATIC PAPER
COMPARTMENTED TRAY
85.70
6/21
TRIACS
TECHNOLOGY MESAGLASS
VDRM=VRRM IT(MS) JCM-08 JCMW08 JCM-10 JCMW10 JCM-12 JCMW12 JCM-16 JCMW16 JCM-25 JCMW25 JCM-40 JCMW40 JCM-60 JCMW60
1000
TECHNOLOGY TOPGLASS
VDRM=VRRM IT(RMS) JCT-04 JCTW04 JCTW08 JCTW12 JCTW16 JCTW20
NOTE Leakage currents specified luminous intensity max. types with VDRM VRRM 1000 IDRM IRRM specified coated chips.
7/21
SCR's
TECHNOLOGY MESAGLASS
VDRM=VRRM IT(RMS)
1000
1200
JTML
JTM-04
JTM-10
JTM-16
JTM-20
JTM-30
JTM-45
JTM-70
TECHNOLOGY PLANAR TOPGLASS
VDRM=VRRM IT(RMS)
JTPL01
JTTL02
JTTL04
NOTE Leakage currents specified luminous intensity max. types with VDRM VRRM 1000 IDRM IRRM specified coated chips.
8/21
TRIACS FOUR QUADRANTS
VDRM TYPES ITSM VTM@Imax dv/dt 0.67xVDRM TJ=125°C (V/µs) (di/dt)c 125°C (A/ms) Thick. DICE Dim. (mm) D1xD2 Metal.
VRRM 125°C TP=10ms QIII (mA) TJ=25°C
IT(RMS) IDRM/IRRM=10 JCM-08-020 JCM-08-040 JCM-08-060 JCM-08-080
200-600
2*-4-5 Metalli.
IT(RMS) IDRM/IRRM=10 JCM-10-020 JCM-10-040 JCM-10-060 JCM-10-080
TJ=25°C 200-600 3.3x3.3 2*-4-5 Metalli.
IT(RMS) IDRM/IRRM=10 JCM-12-020 JCM-12-040 JCM-12-060 JCM-12-080
TJ=25°C 200-600 3.5x3.5 2*-4-5 Metalli.
IT(RMS) IDRM/IRRM=10 JCM-16-020 JCM-16-040 JCM-16-060 JCM-16-080 25°C
TJ=25°C 22.5 200-600 2*-4-5 Metalli.
Prefered
TECHNOLOGY DELIVERY FORM PACKAGING Base
MESA
VIEW
Gate
Example
Junction
CURRENT (RMS) METALLIZATION
DELIVERY FORM
MESA STANDARD TRIAC 9/21
(VDRM)x1/10
TRIACS FOUR QUADRANTS
VDRM TYPES ITSM VTM@Imax dv/dt 0.67xVDRM TJ=125°C (V/µs) (di/dt)c 125°C (A/ms) Thick. DICE Dim. (mm) D1xD2 Metal.
VRRM 125°C TP=10ms QIII (mA) TJ=25°C
IT(RMS) IDRM/IRRM=20 JCM-25-020 JCM-25-040 JCM-25-060 JCM-25-080
13.5
200-600
5.0x5.0
2*-4-5 Metal.
IT(RMS) IDRM/IRRM=20 JCM-40-020 JCM-40-040 JCM-40-060 JCM-40-080
TJ=25°C 21.5 2*-4-5 200-600 6.35x6.35 Metal.
IT(RMS) IDRM/IRRM=20 JCM-60-020 JCM-60-040 JCM-60-060 JCM-60-080 25°C
TJ=25°C 200-600 8.5x8.5 2-4-5* Metal.
Prefered
TECHNOLOGY DELIVERY FORM PACKAGING Base 6.35 6.35
MESA
VIEW
Gate
Example
Junction
CURRENT (RMS) METALLIZATION
DELIVERY FORM
MESA STANDARD TRIAC
(VDRM)x1/10 10/21
THREE QUADRANTS SNUBBERLESS TRIACS
VDRM TYPES ITSM QIII (mA) VTM@Imax dv/dt 0.67xVDRM TJ=125°C (V/µs) (di/dt)c 125°C (A/ms) Thick. DICE Dim. (mm) D1xD2 Metal.
VRRM 125°C TP=10ms
IT(RMS) IDRM/IRRM=10 JCMW08-020 JCMW08-040 JCMW08-060 JCMW08-060
TJ=25°C 200-600 2*-4-5 3.0x3.0 Metal.
IT(RMS) IDRM/IRRM=10 JCMW10-020 JCMW10-040 JCMW10-060 JCMW10-060
TJ=25°C 1.75 200-600 2*-4-5 3.3x3.3 Metal.
IT(RMS) IDRM/IRRM=10 JCMW12-020 JCMW12-040 JCMW12-060 JCMW12-060
TJ=25°C 200-600 2*-4-5 3.5x3.5 Metal.
IT(RMS) IDRM/IRRM=10 JCMW16-020 JCMW16-040 JCMW16-060 JCMW16-060
TJ=25°C 22.5 200-600 2*-4-5 Metal.
IT(RMS) IDRM/IRRM=20 JCMW25-020 JCMW25-040 JCMW25-060 JCMW25-060 JCMW25-100 1000
TJ=25°C 200-600 2*-4-5 5.0x5.0 Metal.
IT(RMS) IDRM/IRRM=20 JCMW40-020 JCMW40-040 JCMW40-060 JCMW40-060 JCMW40-100 1000
TJ=25°C 2-4-5* 200-600 6.35x6.35 Metal.
IT(RMS) IDRM/IRRM=20 JCMW60-020 JCMW60-040 JCMW60-060 JCMW60-060 JCMW60-100 25°C 1000
TJ=25°C 200-600 2-4-5* 8.5x8.5 Metal.
Prefered
11/21
THREE QUADRANTS SNUBBERLESS TRIACS
TECHNOLOGY DELIVERY FORM PACKAGING Base 6.35 6.35 Base
MESA Multiple always
VIEW
Gate
Example
Junction
CURRENT (RMS) METALLIZATION
DELIVERY FORM
MESA SNUBBERLESS TRIAC
(VDRM)x1/10
12/21
SENSITIVE TRIACS FOUR QUADRANTS
VDRM TYPES ITSM VTM@Imax dv/dt 0.67xVDRM =125°C (V/µs) (di/dt)c 125°C (A/ms) Thick. typ. DICE Dim. (mm) D1xD2 Metal.
VRRM 125°C TP=10ms QIII (mA)
IT(RMS) IDRM/IRRM=10 JCT-04-020 JCT-04-040 JCT-04-060
25°C 2x1.6
TECHNOLOGY DELIVERY FORM wafer
TOPGLASS 2055
VIEW
Base unit delivery
wafer
Gate
Example
Junction
CURRENT (RMS) METALLIZATION
DELIVERY FORM
(VDRM)x1/10
13/21
THREE QUADRANTS SNUBBERLESS TRIACS
VDRM TYPES ITSM QIII (mA) VTM@Imin dv/dt 0.67xVDRM =125°C (V/µs) (di/dt)c 125°C (A/ms Thick. typ. DICE Dim. (mm) D1xD2 Metal.
VRRM 125°C TP=10ms
IT(RMS) IDRM/IRRM=10 JCTW04-040 JCTW04-060
TJ=25°C 1.75 2.6x2.6
IT(RMS) IDRM/IRRM=10 JCTW08-040 JCTW08-060
TJ=25°C 1.75 3.2x3.2
IT(RMS) IDRM/IRRM=10 JCTW12-040 JCTW12-060
TJ=25°C 1.60 3.75x3.75
IT(RMS) IDRM/IRRM=10 JCTW16-040 JCTW16-060
TJ=25°C 1.60 22.5 4.2x4.2
IT(RMS) IDRM/IRRM=10 JCTW20-040 JCTW20-060 25°C
TJ=25°C 1.70 4.5x4.5
TECHNOLOGY DELIVERY FORM Max. wafer 2.6x2.6 3.2x3.2 3.75x3.75 4.2x4.2 4.5x4.5 Base unit delivery
TOPGLASS wafer
VIEW
Gate
Example
Junction
CURRENT (RMS) METALLIZATION
DELIVERY FORM
(VDRM)x1/10 14/21
SENSITIVE SCR's
VDRM TYPES VRRM ITSM (mA) VTM@Imax TJ=25°C dv/dt 0.67xVDRM TJ=110°C (V/µs) Thick. DICE Dim. (mm) D1xD2 Metal.
110°C TP=10ms IT(RMS) IDRM/IRRM=10 JTML03-010 JTML03-020 JTML03-040 JTML03-060 25°C
RGK=
200-600
2.54X1.8
Metal.
TECHNOLOGY DELIVERY FORM Base 2.54
MESA
Example
Junction
CURRENT (RMS) METALLIZATION
DELIVERY FORM
MESA SENSITIVE SCR's
(VDRM)x1/10
15/21
STANDARD SCR's
VDRM TYPES VRRM ITSM (mA) VTM@Imax dv/dt 0.67xVDRM TJ=125°C (V/µs) Thick. DICE Dim. (mm) D1xD2 Metal.
125°C TP=10ms IT(RMS) IDRM/IRRM=10 JTM-04-020 JTM-04-040 JTM-04-060 JTM-04-080
TJ=25°C 200-600 2.6X2.6 2-4*-5 Metal.
IT(RMS) IDRM/IRRM=10 JTM-10-020 JTM-10-040 JTM-10-060 JTM-10-080
TJ=25°C 200-600 2.8x2.8 2*-4-5 Metal.
IT(RMS) IDRM/IRRM=10 JTM-16-020 JTM-16-040 JTM-16-060 JTM-16-080 JTM-16-100 JTM-16-120 25°C 1000 1200
TJ=25°C 2*-4-5 Metal.
200-600
3.5x3.5
Prefered
TECHNOLOGY DELIVERY FORM Base
MESA
VIEW
Gate
Example
Junction
CURRENT (RMS) METALLIZATION
DELIVERY FORM
MESA SCR'S
(VDRM)x1/10
16/21
STANDARD SCR's
VDRM TYPES VRRM ITSM (mA) TJ=25°C 2*-4-5 200-600 4.42x4.42 Metal. VTM@Imax dv/dt 0.67xVDRM TJ=125°C (V/µs) Thick. DICE Dim. (mm) D1xD2 Metal.
125°C TP=10ms IT(RMS) IDRM/IRRM=10 JTM-20-020 JTM-20-040 JTM-20-060 JTM-20-080 JTM-20-100 JTM-20-120 1000 1200
IT(RMS) IDRM/IRRM=20 JTM-30-020 JTM-30-040 JTM-30-060 JTM-30-080 JTM-30-100 JTM-30-120 1000 1200
TJ=25°C 200-600 5.0x5.0 2*-4-5 Metal.
IT(RMS) IDRM/IRRM=20 JTM-45-020 JTM-45-040 JTM-45-060 JTM-45-080 JTM-45-100 JTM-45-120 1000 1200
TJ=25°C 2-4-5* 200-600 6.35x6.35 Metal.
IT(RMS) IDRM/IRRM=20 JTM-70-020 JTM-70-040 JTM-70-060 JTM-70-080 JTM-70-100 JTM-70-120 25°C TECHNOLOGY DELIVERY FORM Base 4.42 4.42 6.35 6.35 1000 1200
TJ=25°C 200-600 8.5x8.5 2*-4-5 Metal.
Prefered MESA
VIEW
Gate
Example
Junction
CURRENT (RMS) METALLIZATION
DELIVERY FORM
17/21
(VDRM)x1/10
SENSITIVE SCR's
VDRM TYPES
ITSM
(mA)
VTM@Imax
dv/dt 0.67xVDRM TJ=125°C (V/µs) Thick.
DICE Dim. (mm) D1xD2 Metal.
VRRM 125°C TP=10ms
IT(RMS) 0.8A IDRM/IRRM=10 JTPL01-020 JTPL01-030 JTPL01-040 TJ=25°C
25°C 0.76x0.76
TECHNOLOGY DELIVERY FORM Max. wafer
PLANAR 6370
Base unit delivery
wafer
Example
Junction
CURRENT (RMS) METALLIZATION
DELIVERY FORM
(VDRM)x1/10
18/21
SENSITIVE SCR's
VDRM TYPES VRRM ITSM (mA) VTM@Imax 25°C 1.45 25°C 2x1.6 1.48x1.33 dv/dt 0.67xVDRM TJ=125°C (V/µs) Thick. typ. DICE Dim. (mm) D1xD2 Metal.
125°C TP=10ms IT(RMS) IDRM/IRRM=10 JTTL02-020 JTTL02-040 JTTL02-060
IT(RMS) IDRM/IRRM=20 JTTL04-020 JTTL04-040 JTTL04-060 TJ=25°C
TECHNOLOGY DELIVERY FORM Max. wafer 1.48x1.33 2x1.6 Base unit delivery
TOPGLASS 3400 2055 wafer
Example
Junction
CURRENT (RMS) METALLIZATION
DELIVERY FORM
(VDRM)x1/10
19/21
OPTO SCR's
VDRM TYPES ITSM GAAS source (mw/cm2) VTM@Ityp dv/dt 0.67xVDRM TJ=125°C (V/µs) Thick. typ. DICE Dim. (mm) D1xD2 Metal.
VRRM 125°C TP=10ms
IT(RMS) IDRM/IRRM=10 JLO-03-020 JLO-03-040 TJ=25°C
25°C 1.3x1.3
TECHNOLOGY DELIVERY FORM Max. wafer 1.3x1.3 Base unit delivery
PLANAR
VIEW
2500 wafer
Effective trigger irradiance
Gate
Example
Junction
CURRENT (RMS) METALLIZATION
DELIVERY FORM
(VDRM)x1/10
20/21
Information furnished believed accurate reliable. However, SGS-THOMSON Microelectronics assumes responsability consequences such information infringement patents other rights third parties which result from use. license granted implication otherwise under patent patent rights SGS-THOMSON Microelectronics. Specifications mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. SGS-THOMSON Microelectronics products authorized critical components life support devices systems without express written approval SGS-THOMSON Microelectronics. 1995 SGS-THOMSON Microelectronics Printed Italy rights reserved. SGS-THOMSON Microelectronics GROUP COMPANIES Australia Brazil France Germany Hong Kong Italy Japan Korea Malaysia Malta Morocco Netherlands Singapore Spain Sweden Switzerland Taiwan Thailand United Kingdom U.S.A.
21/21
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