PRODUCT DESCRIPTION (for qualification) Information provided this

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

PRODUCT DESCRIPTION (for qualification) Information provided this

Datasheet Thumbnail

Top Searches for this datasheet

BICMOS CHEMICAL MECHANICAL POLISHING (CMP)
PRODUCT DESCRIPTION (for qualification)
Information provided this document intended generic qualification technically describes Cypress part supplied: Marketing Part Device Description: CY7B145/CY7B185/PAL16L8 SRAM (CY7B145) SRAM (CY7B185) PAL20 Series (PAL16L8) Cypress Semiconductor Corporation REV. (CY7B145) REV. (CY7B185) REV. (PAL16L8) 7B145A 6A185A/B 6A310C Oct/1994
Cypress Division:
Overall Mask) Level (pre-requisite qualification):
Size (stepping):
(CY7B145) (CY7B185) (PAL16L8)
What markings Die:
Cypress Qualification completion/Marketing Availability Dates (Current REV):
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number Metal Layers: Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process Polyimide BiCMOS Double Poly, Double Metal SiO2 Cypress Semiconductor Round Rock, Fab2/SM2 Generic Process Technology/Design Rule (µ-drawn): Metal Composition: Metal Ti/TiW, 1%SiAl, Metal 1%SiAl None
PLTO 15,000K Oxynitride
PAGE
CYPRESS SEMICONDUCTOR
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Assembly Line Process Copper (Olin 194) Solder Plated, 85%Sn, 15%Pb Silver Spot Paste Thermosonic Attach Dim: Attach Material: Wire Material/Size: Anam, Korea KOREA-A/S32 mils mils (PAL16L8) mils mils (CY7B145) Silver Epoxy Gold 28-Lead PLCC (PAL16L8) 68-Lead PLCC (CY7B145) mils side (PAL16L8) mils side (CY7B145) Sumitomo EME-6300H(R)
Name/Location Assembly (prime) facility:
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Assembly Line Process Paste Thermosonic Copper (Olin 194) Solder Plated, 85%Sn, 15%Pb Silver Spot Attach Dim: Attach Material: Wire Material/Size: Omedata, Indonesia INDNS-O/S32 mils mils (CY7B185) Silver Epoxy Gold 28-Lead, 300-Mil (CY7B185) mils side Sumitomo EME-6300H(R)
Name/Location Assembly (prime) facility:
PAGE
CYPRESS SEMICONDUCTOR
OTHER INFORMATION
approval similarity, identify other devices using same basic with bonding metal mask options test selections explain: BiCMOS SRAM Cypress planning changes near future, identify change (Qtr/Yr) Design Rev./Shrink: Fab/Assembly site change: Other Devices qualified this technology: Other Packages qualified this device: Voltage Rating (per STD-008, Method 3018): Flammability Classification (UL-94V): Alternate Fab/Assembly Locations: None Assembly >2,000V Process Change: Cross Licensee/Licensor: BiCMOS SRAM
Please attach following Qualification Reliability data revision Package type, assembly sites identified above (mark included): HAST (5.5V, 140°C, 85%RH, 15psig) Temperature Cycles (-65°C 150°C) Temperature Cycles (-40°C 165°C) Data Retention Bake, Plastic (165°C) Data Retention Bake, Hermetic (250°C) Autoclave (PCT, 121°C, 100%RH) Operating Life (temp): Steady State Life (HTSSL, 5.75V, 150°C) Temperature Humidity Bias (5.5V, 85°C, 85%RH) Latchup Testing Tests (MIL-STD 883, method 3015) Other: Class Test Analysis Sort E-Test JESD22-A112 Moisture Sensity 150°C
PAGE
CYPRESS SEMICONDUCTOR
Marketing Part: Description:
CY7B145/CY7B185/PAL16L8 28-Lead/68-Lead PLCC 28-Lead
DEVICE RELIABILITY SUMMARY
Wafer Fab: Assembly:
Round Rock, Anam, Korea (PLCC) Omedata, Indonesia (SOIC)
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Early Failure Rate Device CY7B185-VC CY7B145-JC CY7B145-JC Assy Lot# 349410143 349409870 349411006 2427759 2425640 2426726 Hours 0/513 0/1085 0/1043 Cumulative 0/2641
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Latent Failure Rate Device CY7B145-JC CY7B145-JC Assy Lot# 349409870 349411006 Lot# 2425640 2426726 Hours 0/120 Hours 0/120 0/120 Cumulative 0/240
High Temperature Steady State Life Test (HTSSL, 5.75V, 150°C) Device CY7B185-VC CY7B145-JC Assy Lot# 349410143 349409870 Lot# 2427759 2425640 Hours 0/81 0/80 Hours 0/81 Cumulative 0/161
Temperature Cycle (Condition -65°C 150°C), Precondition Hrs. Pressure Cooker Test Device CY7C185-VC PAL16L8-JC CY7B145-JC CY7B145-JC CY7B145-JC Assy Lot# 349410143 349409678 349409870 349411006 349411453 Lot# 2427759 2425615 2425640 2426726 2430020 Cycles 0/81 0/46 0/48 0/50 0/50 1000 Cycles 1000 Cycles Cumulative 0/275 0/46
PAGE
CYPRESS SEMICONDUCTOR
Marketing Part: Description:
DEVICE RELIABILITY SUMMARY CY7B145/CY7B185/PAL16L8 Wafer Fab: 28-Lead/68-Lead PLCC Assembly: 28-Lead SOIC
Round Rock, Anam, Korea (PLCC) Omedata, Indonesia (SOIC)
Autoclave (PCT, bias, 121°C, 100%RH, 15psig), Precondition Temperature Cycle Device CY7B185-VC PAL16L8-JC CY7B145-JC CY7B145-JC CY7B145-JC Assy Lot# 349410143 349409678 349409870 349411006 349411453 Lot# 2427759 2425615 2425640 2426726 2430020 Hours 0/54 0/46 0/49 0/50 0/50 Cumulative 0/249
High Accelerated Saturation Test (HAST, 5.5V, 140°C, 85%RH, 15psig), Precondition Hrs. (121°C, 100% Device CY7B185-VC PAL16L8-JC CY7B145-JC CY7B145-IC CY7B145-JC Assy Lot# 349410143 349409678 349309870 349411006 349411453 Lot# 2427759 2425615 2425640 2426726 2430020 Hours 0/53 0/46 0/48 0/50 0/50 Miscellaneous Results Class Test Analysys Sort-Etest JESD22-A112 Moisture Sensitivity Level Pass Pass Pass Cumulative 0/247

PRODUCT DESCRIPTION (for qualification) Information provided this

Top Searches for this datasheet

Other recent searches