RFID Development Guide with Microchip's RFID Devices Author: Youb

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RFID Development Guide with Microchip's RFID Devices Author: Youb

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AN830
RFID Development Guide with Microchip's RFID Devices
Author: Youbok Lee, Ph.D. Microchip Technology Inc. Since direct attachment reduces step making package, widely used cost high volume applications such smart labels. direct attachment achieved with different methods: wire bonding flip-chip with bumped die. flip-chip, needs special bumping die's bond pads. Typically bump material made gold with approximately height. flip-chip assembly process attaches bumped area antenna traces. Several bumping flip chip assembly methods available RFID tags. wire bonding method needs relatively simple process attachment. directly wirebonded antenna, covers wire bonded area with black colored epoxy glob top. small volume production, wire-bonding method still less expensive than using flip-chip process. However, less efficient high volume production. flip-chip method preferred high volume production. read range RFID greatly affected tag's size, tuning, circuit device's power consumption data modulation depth. tag's size must chosen depending application cost constraints. Tags must tuned precisely reader's carrier frequency long range applications. Since tag's antenna circuit consists combination components, tolerance component often causes variation read range between tags. Once inductance designed, tolerance typically within Therefore, tag's tuning variation mostly capacitance tolerance. capacitance used antenna circuit must chosen carefully. example, tolerance must kept within capacitor's factor should greater than operating frequency maximize read range performance. internal resonant capacitors MCRF451/452/455 MCRF360 devices made with silicon oxide. Their tolerance approximately less than devices same wafer within ~10% from different wafers. Their factor greater than 13.56 MHz. capacitance tolerance results variations read range between tags. Therefore, read range variation (about 10%) concern internal capacitor's tolerance, MCRF450 MCRF355 used with external capacitor that smaller tolerance (within 2~5%).
passive RFID contains RFID integrated circuit (IC), resonant capacitor (C), antenna (L), shown Figure antenna capacitor form parallel resonant circuit. circuit must tuned reader's carrier frequency maximum performance (read range). most common antenna types RFID tagging applications are: wire-wound coil etched printed/stamped) spiral inductor dielectric substrate. antenna types typically determined carrier frequency, tag's package type, performance, assembly cost factors. example, frequency kHz) tags need inductance. This inductance achieved with hundreds turns wire. This kind inductance cannot obtained economically with etched antenna, with wire-wound antenna. However, medium frequency MHz) tags need inductance. This inductance achieved with turns wire etched printed/stamped) spiral inductor dielectric substrate. After antenna type chosen, next step attach silicon device antenna. There basic methods device attachment: using chip-on-board (COB) direct attachment antenna. commonly used wire-wound antennas direct attachment etched (printed/stamped) antenna types. made packaging resonant capacitor RFID device together same package. external terminals antenna attachment. inductance antenna determined COB's resonant capacitor value reader's carrier frequency. antenna attached COB`s external terminals welding soldering. Because most COBs used cards which need meet card standard thickness (0.76 specification, typical thickness approximately Although package designed protect internal silicon device during card lamination process which involves mechanical pressure with temperature, care needed prevent mechanical cracks device. popular package types IOA2(MOA2) from Taiwan World from Inc. USA.
2002 Microchip Technology Inc.
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modulation transistor 13.56 devices placed between antenna VSS. This transistor creates junction capacitance between pads. This junction capacitance relatively lossy compared on-board capacitors. However, MCRF450, MCRF451, MCRF455 MCRF360 affected junction capacitance. MCRF452, this lossy junction capacitance parallel with second internal resonant capacitor. resulting loaded circuit MCRF452 about 5~10% lower than that other devices. capacitance inductance also trimmed within percent using proper tuning mechanism. Various design assistance tuning methods that subject pending patent applications available from Microchip Technology Inc. factor tag's antenna circuit primarily governed antenna's resistance. Therefore, antenna must designed have minimum resistance within given physical constraint. antenna resistance becomes smaller with thicker gauge wire etched metallic traces with wider trace width. Etched antennas with four-turn spiral inductor card sized dimension easily made less than with proper dimensional choice. this case, unloaded (antenna only) greater than 100. loaded (antenna with device) needs greater than long range applications. Microchip's 13.56 devices consume less than power during reading. This about times less than other similar devices available from competitors industry today. This reduced power consumption means there will more available power backscattering (re-radiation), which results longer read range. conventional RFID tags, data sent damping undamping antenna voltage. However, high circuit, very difficult damp voltage with high speed (high data rate). Therefore, difficult send data with 100% modulation with conventional method. overcome this problem, Microchip's current 13.56 devices designed shift circuit's tuning frequency instead damping coil voltage directly. This achieved shorting un-shorting element resonant antenna circuit. Microchip's devices have modulation transistor between antenna VSS. frequency tuning element should placed parallel with modulation transistor (antenna VSS). modulation transistor shorts frequency switching element when turns (sending data "Hi"), releases when turns (sending data "Lo"). When switching element released, circuit tunes reader's carrier frequency causing circuit develop maximum voltage. When switching element shorted, circuit tunes away from carrier frequency, therefore, developing less voltage. reader monitors changes tag's coil voltage, reconstructs modulation data. Refer Microchip's application Note AN707 (DS00707) more details this feature. device requires three connection points external antenna circuit: antenna antenna VSS. This order switch resonant frequency (tuned detuned) shorting un-shorting element between antenna VSS. MCRF452, antenna internally connected second internal capacitor between antenna VSS. Figure various external circuit configurations each device. resonant frequency determined component combination between antenna VSS. circuit must tuned precisely reader's carrier frequency best read range performance. Microchip's 13.56 devices designed send data with 100% modulation with appropriate external circuit configuration. modulation depth determined much tag's coil voltage changed when sends data from "Hi" "Lo" vice versa. 13.56 devices, this directly related separation between tuned detuned frequencies. detuned frequency result shorting frequency switching component between antenna VSS. This component value typically optimized between one-third one-half total value. example, three turns between antenna antenna turn between antenna made four-turn spiral inductor. shorting element (between antenna VSS) capacitor, same value capacitor chosen element between antenna simplicity. MCRF355 MCRF450 include identical capacitors series, externally device. capacitor connected between antenna between antenna VSS. MCRF452 does require external capacitors since device internal capacitors. MCRF452 best choice sense unit production cost. However, highest performance, MCRF450 recommended. Various circuit configurations each device shown Figure
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2002 Microchip Technology Inc.
AN830
FIGURE PASSIVE RFID CONFIGURATION
RFID Device Antenna Antenna
RFID Device (MCRF452)
Internal Resonant Capacitor
Configuration RFID devices (MCRF200 MCRF250)
Configuration MCRF452.
RFID Antenna Antenna
RFID Device
Internal Resonant Capacitor
Configuration (MCRF200/250, MCRF355, MCRF450, MCRF452)
Configuration 13.56 RFID devices with internal resonant capacitor. (MCRF360/ MCRF451/455)
Antenna
RFID Device Antenna
RFID Device
Configuration 13.56 RFID devices with internal resonant capacitor (MCRF355 MCRF450)
Configuration 13.56 RFID devices with internal resonant capacitor. external components. (MCRF355 MCRF450)
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FIGURE ASSEMBLY PROCESS
Make Finished (card lamination, plastic molding, etc) Final Product Test Prepare Capacitor (MCRF200/250) Prepare Antenna Coil (Note: includes capacitor) Make Finished (card lamination, plastic molding, etc) Final Product Test
Make
Make Inlay (Antenna coil COB)
Inlay Test
Final Function Test
Make
Make Inlay (Antenna coil COB)
Inlay Test
Final Function Test
Method
Prepare Antenna Coil Prepare (MCRF452) Prepare Capacitor Note: MCRF355/450: Need capacitor (MCRF450/355) MCRF452: capacitor needed Prepare Antenna substrate (Etch/print/stamp) Method
Make Inlay (Direct wire bonding antenna)
Make Finished (card lamination, plastic molding, etc) Final Product
13.56 Prepare
Method
DS00830B-page
Inlay Test
Final Function Test
Note: MCRF360/451/452/455: external capacitor needed MCRF355/450: need external capacitor
Prepare Antenna substrate (Etch/print/stamp) Make Inlay (Antenna coil COB)
Make Finished (card lamination, plastic molding, etc) Final Product
Bumping Flip-Chip Assembly (MCRF355/360/450/451/452/455)
Inlay Test
Final Function Test
(Flip-chip process attachment antenna) Note: Method Make with Method Make with direct wire bonding etched/printed/stamped antenna Method Make with flip-chip process using bumped
2002 Microchip Technology Inc.
AN830
LAYOUT EXTERNAL ANTENNA CIRCUITS MCRF DEVICES
Table shows internal resonant capacitance 13.56 MCRF devices their inductance requirements. external circuit configuration these devices shown Figure MCRF452 includes internal capacitors series (C1: between antenna between antenna VSS). device shorts un-shorts when sends data "Hi" "Lo", respectively. MCRF452 needs only connection points (antenna VSS) external antenna. When MCRF452 used COB, does require extra capacitor. MCRF452 good candidate both direct attachment COB. assembly processing steps various methods shown Figure MCRF451, MCRF455 MCRF360 requires three connection points external antenna (antenna antenna VSS). These devices used effectively direct attachment (wire bonding flip-chip) antenna. Here summary 13.56 devices: direct attachment antenna: MCRF355, MCRF360, MCRF450, MCRF451, MCRF452, MCRF455. COB: MCRF355, MCRF450, MCRF452.
TABLE
Devices
13.56 DEVICE FEATURES
Programming Internal Anti-collision Memory Resonant Capacitor
(typically tags/second many tags/second) bits
Read Range
Application
Availability
Die, wafer, wafer frame, bumped, SOIC, PDIP
MCRF355 Contact factory programming
Multiple reading tags, meters book store library book toys/gaming tools, airline baggage tracking, access control asset tracking Multiple reading writing tags, book store library applications, toys/gaming tools, airline baggage tracking, access control, asset tracking inventory management
MCRF360 MCRF450 Contactless (read energized tags) bits
MCRF451 MCRF452 MCRF455
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TABLE
Devices MCRF200
DEVICE FEATURES
Programming contactless factory programming Anti-collision Memory bits Applications Access control, animal tagging, 11784/11785 FDX-B, compatible most existing RFID devices (FSK, ASK, options) Multiple tagging applications Availability Die, wafer, wafer frame, SOIC, PDIP,
MCRF250
contactless factory programming Factory contact programming
bits
MCRF202
bits
Sensing application with external sensor input
Die, wafer, wafer frame, SOIC, PDIP
TABLE
INTERNAL RESONANT CAPACITANCE 13.56 MCRF DEVICES
Resonant Capacitance (Antenna VSS) (Parasitic Input Capacitance) ±10% External Inductance Connection External Requirement Antenna Circuit 13.56 Lead Frame Depending external capacitor value 1.45 ±10% Antenna pads
Device Name MCRF450
Reference This device requires three connections external circuit. Good both direct attachment. This device requires three connections external circuit. Good direct wire bonding etched antenna.
MCRF451
Antenna pads
MCRF452
±10%
4.591 ±10%
Antenna pads This device requires only antenna connections. Good both direct attachment COB. Antenna pads Antenna pads This device requires three connections external circuit. Good direct wire bonding etched antenna. This device requires three connections external circuit. Good direct wire bonding etched antenna.
MCRF455
±10%
2.76 ±10%
MCRF360
±10%
±10%
Note:
internal capacitance value bumped about higher than unbumped die's capacitor.
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2002 Microchip Technology Inc.
AN830
FIGURE MCRF450/451/452/455 LAYOUT
View (Notch edge wafer)
1590.6
FCLK
865.2
900.1
1037.6
1071.5
Ant.
Ant.
1613 Note: Coordinate units MCRF45X Data Sheet mechanical dimensions. size after saw: 1840.5 2277.3 1.8405 2.2773 72.46 89.66 Bond size: 0.089 0.089
size before saw: 1904.0 2340.8 1.904 2.3408 74.96 92.16
Ant. Connected antenna coil Ant. Connected antenna coils MCRF450/451/455, connected MCRF452. VSS: Connected antenna coil (VSS substrate). FCLK: device test only. Leave floating connect VSS. CLK: Connect VSS. VDD: device test only. Leave floating.
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FIGURE EXTERNAL CIRCUIT CONFIGURATION DSTEMP
tuned detuned inductors capacitor Ant.
Total antenna inductance between Ant. Ant. Note: Substrate MCRF450 Where: mutual inductance coupling coefficient inductors
inductor capacitors Ant. tuned Ant. Note: Substrate MCRF450 detuned
Note:
Input parasitic capacitance between Antenna pads application notes, AN710 AN830 antenna circuit design.
FIGURE
EXTERNAL CIRCUIT CONFIGURATION DSTEMP
Ant. MCRF451 Internal Resonant Capacitor (Cres_100) External Antenna Coil External Antenna Coil detuned
Int. Res. Cap.
Ant. Note: Substrate
tuned
Total antenna inductance between Ant.
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AN830
FIGURE
Ant.
EXTERNAL CIRCUIT CONFIGURATION DSTEMP
MCRF452
50.6 Int. Res. Cap. 65.4
Internal Resonant Capacitor between Ant. pads: CRES_2_50 parasitic capacitor
Ant. Note: Substrate
tuned
detuned )50.6
FIGURE
EXTERNAL CIRCUIT CONFIGURATION MCRF455
MCRF455 Internal Resonant Capacitor (Cres_50) tuned detuned
Ant.
Int. Res. Cap.
Total antenna inductance between Ant. Ant. Substrate
Note:
External Antenna Coil External Antenna Coil
Note:
application notes AN710 antenna circuit design Figure through Figure
2002 Microchip Technology Inc.
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FIGURE MCRF 355/360 LAYOUT
(Notch edge wafer)
1162.4
250.2 458.4 767.2 1158
VPRG 1513
432.6
1157.4
1417
size before saw: 1417 1513 55.79 59.57
size after saw: 1353.8 1450.34 53.3 57.1
Bond size:
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AN830
FIGURE EXTERNAL ANTENNA CIRCUITS MCRF355 MCRF360
Carrier Interrogator Modulated Data
Ant.
Where:
MCRF355 Ant.
Mutual inductance between
Carrier Interrogator Modulated Data
Ant.
MCRF355 Ant.
-C1C2
Ant. Carrier Interrogator Ant. Modulated Data MCRF360
Where: Mutual inductance between
2002 Microchip Technology Inc.
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FIGURE LAYOUT MCRF200/280
Device Test Only RESET
Antenna connection VSS, VCC, RESET, I/O: connect antenna.
size before saw: 1121.5 1738.4 44.15 68.44
size after saw: 1059.18 1673.86 41.7 65.9
Bond size:
FIGURE
EXTERNAL ANTENNA CONFIGURATION MCRF200/250/202
Input capacitance:
MCRF200/250/202
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AN830
13.56 DEVICES
Microchip offers package types from different vendors: IOA2 made International Semiconductor Technology Inc. (IST) Taiwan, WORLD WORLD types made Inc. USA. Similar packages also available from Kiho Electronics Korea, Dynacard Hong Woei Taiwan, Hana Microelectronics Century Electronics Thailand. Tables show various COBs their internal capacitor values. capacitors made with silicon oxide with less than tolerance. used Standard 7810 7816-1 (85.6 0.76 card, typical thickness about Figures show IOA2 WORLD package types, respectively. inductance requirements Microchip's COBs shown Tables Inductance calculations various configurations shown Microchip's Application Note AN710. Additional detailed coil design methods also available from Microchip Technology Inc.
TABLE
13.56 DEVICES
Resonant capacitance (Antenna VSS) ±10% External Inductance Requirement 13.56 3.36 3.36 3.28 4.591 ±10%
Name MCRF450/7M MCRF355/7M MCRF355/6C MCRF452 Note:
Type IOA2 IOA2 WORLD IOA2 WORLD
Thickness 0.40 0.40 0.41 0.40
Manufacturer International Semiconductor Technology (IST) Taiwan International Semiconductor Technology (IST) Taiwan Inc. Available from Inc.
COBs except MCRF452 dual silicon capacitor made Quick Inc.
TABLE
DEVICES
Resonant capacitance (Antenna VSS) 1000 1000 1000 1000 External Inductance Requirement 1.62 4.91 1.62 4.91 1.62 4.91 1.62 4.91
Name MCRF200/1M MCRF200/3M MCRF200/1C MCRF200/3C MCRF250/1M MCRF250/3M MCRF250/1C MCRF250/3C
Type IOA2 IOA2 World World IOA2 IOA2 World World
Thickness 0.40 0.41 0.41 0.40 0.41 0.41
Manufacturer International Semiconductor Technology (IST) Taiwan International Semiconductor Technology (IST) Taiwan Inc. Inc. International Semiconductor Technology (IST) Taiwan International Semiconductor Technology (IST) Taiwan Inc. Inc.
2002 Microchip Technology Inc.
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FIGURE IOA2 PACKAGE TYPE
FIGURE
WORLD PACKAGE TYPE
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AN830
FIGURE IOA2 PACKAGE
Thickness
9.50 1.58
6.27 5.21
4.23 1.85 9.50
Detail 5.00 R0.16 (2X) 0.40 (max.)
9.50
Antenna Coil Connection
1.50
1.06
R1.30
9.65 9.65
2.00
0.60(4X)
31.84 35.00
0.80(2X)
9.65
4.90
9.65 9.65
0.30 (ref Note
5.90
3.88
3.75
Note: Reject hole device testing gate mark (Option) Total package thickness excludes punching burr
R0.20(4X)
1.94 5.60
2.375
2002 Microchip Technology Inc.
2.52
0.60(2X)
8.00 .53(4X)
DS00830B-page
5.10 6.88
R0.20
AN830
13.56 WITH DIRECT ATTACHMENT ANTENNA
13.56 devices used effectively cost smart label applications. These smart labels made direct attachment antenna. attachment achieved with direct wire bonding flip-chip method. flip-chip, die's must bumped with proper material such gold. Since 13.56 needs only inductance, antenna easily made thin dielectric substrate with spiral turns metallic traces. antenna mostly etched with copper aluminum material thin paper-like substrate. choice etched, printed, stamped antenna trade-off between cost performance. 13.56 tag, factor antenna very important long read range applications. factor inversely proportional resistance antenna trace. been determined that etched antenna less resistive inexpensive than printed antenna with conductive material. However, very large antenna size (greater than 4"), both etching stamping processes waste much unwanted material. Therefore, printed wired antennas should considered alternative. Microchip offers gold-bumped wafers flip-chip process. Table shows bump specifications Microchip products. bumped wafer from Microchip extra polyimide passivation layer thickness). This extra dielectric layer prevents possible electrical shorting between bare antenna circuit. Figure shows example MCRF355/360 with direct attachment (wire bonded) etched antenna trace. resonant capacitor required MCRF360 device. contact programming pads shown used program device Contact mode customers need program after assembly. MCRF45x devices programmed contactlessly interrogator. External capacitor required MCRF451, MCRF452, MCRF455 devices. Inductance calculations various configurations shown Microchip's Application Note, AN710.
TABLE
BUMP SPECIFICATIONS
Four corner pads (FCLK, VSS, Antenna Antenna pads Covered polyimide >99.9% pure After Anneal: Knoops Before Anneal: Knoops gm/mil height µm/sec Within die: Within wafer: Wafer wafer:
Bumped (MCRF45X) Bumped (MCRF355/360) Other area except bumped pads Thickness polyimide Bump Material Bump Hardness Bump Shear Strength Bump Height Bump Height Uniformity
Bump Size Under Bump Metallization
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AN830
FIGURE EXAMPLE DIRECT WIRE BONDING MCRF355/360 ANTENNA
Antenna VPRG
Jump Wire MCRF355 with wire bonding Resonant Capacitor Contact Programming Pads (MCRF355/360 only)
VPRG
Antenna
Layout MCRF355/360 Substrate Metal trace Antenna
B5AU1
Antenna
FCLK
Layout MCRF45x
FIGURE
EXAMPLE VARIOUS 13.56 RFID TAGS
2002 Microchip Technology Inc.
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ASSEMBLY WITH MCRF DEVICES
purpose chip-on-board (COB) integrate RFID device capacitor together same package. package designed protect internal devices from external environments also easy coil attachment. Besides Microchip's IOA2 World types which made special lead frame, also made small with epoxy glob top. Both capacitor wire-bonded together small covered with black-colored epoxy material protection. black color protects device from light source. Refer Figure wire bond connection between device capacitor. Figures show MCRF200/250, MCRF355, MCRF452, MCRF450 anatomy, respectively. MCRF200/ needs capacitor. MCRF355 MCRF450 need dual capacitor. MCRF452 same MCRF450, doesn't require capacitor. test procedure each described following section.
FIGURE
ANATOMY
Non-conductive glue Capacitor Wire Bond
MCRF200/250 Metal Lead Frame External Coil Connection Pads
FIGURE
MCRF355 ANATOMY
Non-conductive glue Dual Capacitor Wire Bond
Dual Capacitor
Ant. Ant.
MCRF355 Metal Lead Frame
External Coil Connection Pads
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AN830
FIGURE MCRF452 ANATOMY
Non-conductive glue Wire Bond
Ant. Ant. MCRF452
Metal Lead Frame
External Coil Connection Pads
FIGURE
MCRF450 ANATOMY
Dual Capacitor Wire Bond Non-conductive glue Dual Capacitor
Ant. Ant.
MCRF450
Metal Lead Frame
External Coil Connection Pads
2002 Microchip Technology Inc.
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AN830
TEST PROCEDURES
manufacturers test during after final assembly. test typically consists open/ short test function test. Most manufacturers conducting 100% open/short test sample function test. device outputs modulation signal when voltage across greater than 9~10 VPP. voltage should exceed VPP. When test performed using Microchip's Contactless Programmer, customer tell whether device actually blank not.
(MCRF200/250)
MCRF200 MCRF250 include unpackaged RFID (die) unpackaged silicon capacitor (die). Microchip offers modules with both 1000 capacitors. test verifies that both capacitor connected properly lead frame. open/short test ensures correct wire bonding from lead frame. This open/short test does guarantee connection capacitor, however, capacitor tested with capacitance meter. capacitance measurement possible, functional test used instead with proper sample size. MCRF200 MCRF250 time contactlessly programmable (OTP) devices. Although these devices require special pulse sequence enable Programming mode, unprogrammed (blank) device could accidently enter Programming mode with high voltage, lock memory array. voltage less than must used unprogrammed test. These unprogrammed MCRF200/250 COBs must handled carefully. However, factory programmed device (SQTP) higher voltage testing. Refer MCRF200 MCRF250 data sheets more information contactless programming.
MCRF200/MCRF250 Function Test Procedure.
CONTACTLESS PROGRAMMER SET-UP:
Prepare microIDContactless Programmer RFLab software personal computer (PC). Connect power supply Contactless Programmer. Connect Programmer your RS-232 cable. "RFLab125". Click "File" from menu RFLab select "microID Programmer". Select "comm port" (1,2,3, etc).
TEST COIL SET-UP:
Place test coil (RFID antenna coil) "Contactless Programmer" shown Figure Make sure coil placed center placement area programmer. secure coil programmer with tape necessary. Place holding pins (clips pogo pins) coil (see Figure 21).
OPEN-SHORT TEST:
Force pass Voltage VPP.
SAMPLE TEST
Connect sample holder pins test coil. Click "Blank Check" button RFLab menu your blank (good), green appears RFLab with message "Device Blank". device already programmed), appears with message "Device Present". Note Please contact Microchip Technology Inc. further assistance. click "Program" button unless want program device. can't reprogram once been programmed.
FUNCTIONAL TEST:
functional test done measuring modulation signal. must attached coil exposed tester's field. with factory programmed device (SQTP) mostly done with reader which outputs signal measures responses from tag. with blank device (unprogrammed COB), functional test done with reader Microchip's MCRF200 Contactless Programmer. reader used test, output power must kept possible. exceed more than across pads. sees greater than VPP, enter Programming mode accidently program with field.
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AN830
FIGURE CONTACTLESS PROGRAMMER TEST SET-UP
microID Contactless Programmer (125 kHz)
Place RFID test coil center this area
Place microID Sample here
Contactless Programmer
pogo Test Coil
Test Coil
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13.56 (MCRF355, MCRF450/452)
MCRF355 MCRF450 includes dual silicon capacitor: capacitor (C1) between antenna another capacitor (C2) between antenna pads. Microchip's 13.56 includes dual capacitors. dual capacitance chosen match inductance access control card type properly. Different capacitor values used other types applications. Figures show IOA2 WORLD type package, respectively. Drawings each shown Figures
MCRF450 MCRF452 TEST:
Open/Short Test (forward reverse excitations) Force (forward) pass 6V~8V. Force (reverse) pass 0.2V~0.6V.
Capacitance Measurement MCRF450 requires dual capacitor. This capacitor must tested properly connected lead frame. MCRF452 does require external capacitor since MCRF452 device includes dual on-chip capacitor. internal capacitor tested wafer probe prior shipment. Therefore, open/short sample function tests should sufficient MCRF452 COB. Functional Test tested monitoring manchester encoded modulation. device configured Talk First mode (TTF), outputs its' data when sees FRR/ command, soon energized. default device fast read Read Talk First (RTF) mode. this case, requires set) cleared) initiate communication with reader. When receives command, outputs 32-bit with Manchester encoded data rate. This test performed using Microchip's MCRF45x system development kit.
MCRF355 TEST:
Open/Short Test (forward reverse excitations) Force (forward) pass 0.5V~1.2V. Force (reverse) pass 0.2V~0.6V. Measure capacitance COB. tested monitoring manchester encoded modulation. outputs data soon energized. Attach proper RFID coil (inductor) bring into reader's field measure modulated data. MCRF355 MCRF355/45x reader used this test.
Capacitance Measurement Functional Test
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2002 Microchip Technology Inc.
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EFFECT READ RANGE CAPACITANCE VARIATION 13.56
read range greatly affected tuning conditions antenna circuit reader carrier frequency) factor antenna circuit. inductance must designed yield minimum resistance possible highest factor. capacitor both must chosen have following criteria maximum read range: factor must greater than 13.56 MHz, voltage rating must greater than VDC, Optimum capacitance tolerance: variation capacitance inductance results change resonant frequency tuned antenna circuit. When circuit detuned from reader's carrier frequency, develops less voltage. This results shorter read range. Table shows capacitance variation from tuned circuit resonant frequency read range. Figure shows read range changes capacitance value from tuned circuit. reference long range reader used data Table Figure results indicate that component variation critical long range applications. example, difference capacitance value reduces read range about from maximum range. also shows that capacitance difference from tuned condition reduces read range about inch from maximum range inches) that available tuned condition. data also indicates that component variation becomes less significant short read range applications.
TABLE
VARIATION CAPACITANCE VALUE RESONANT FREQUENCY RESULTING READ RANGE
Resonant Frequency (MHz) 13.56 13.3896 13.3273 13.3119 13.2692 13.255 13.1964 13.1473 13.1055 13.0544 13.0042 12.9613 12.9151 12.8672 12.8221 12.7698 12.7243 12.6701 12.6257 12.5869 12.5377 12.4936 12.4166 12.3711 12.1186 12.0222 Read Range (inches) 28.5 27.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 12.5
Capacitance Variation (pF) from Tuned Condition 10.3 11.3 12.3 13.3 14.3 15.3 16.3 17.3 18.3 19.3 20.3 22.3 23.3 29.3 31.6
2002 Microchip Technology Inc.
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Capacitance Variation (pF) from Tuned Condition 43.3 63.3 120.3 160.3 220.3 247.3 275.3 Resonant Frequency (MHz) 11.731 11.0744 9.597 8.9006 7.7304 7.7465 7.204 Read Range (inches) 0.25
FIGURE
READ RANGE CHANGES CAPACITANCE FROM TUNED VALUE
REFERENCES
MCRF200 Data Sheet, DS21219 MCRF250 Data Sheet, DS21267 MCRF355/360 Data Sheet, DS21283 MCRF45X Data Sheet, DS40232 Microchip Technology Inc., Appl. Note AN707, "MCRF355/360 Application Note: Mode Operation External Resonant Circuit" Microchip Technology Inc., Appl. Note AN710, "Antenna Circuit Design RFID applications" MicroID13.56 RFID Design Guide, Microchip Technology Inc., DS21299 MicroID125 RFID Design Guide, Microchip Technology Inc., DS51115
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2002 Microchip Technology Inc.
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Trademarks Microchip name logo, Microchip logo, KEELOQ, MPLAB, PIC, PICmicro, PICSTART MATE registered trademarks Microchip Technology Incorporated U.S.A. other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode Total Endurance trademarks Microchip Technology Incorporated U.S.A. other countries. Serialized Quick Turn Programming (SQTP) service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2002, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved.
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Microchip received QS-9000 quality system certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona July 1999 Mountain View, California March 2002. Company's quality system processes procedures QS-9000 compliant PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001 certified.
2002 Microchip Technology Inc.
DS00830B page
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2002 Microchip Technology Inc.

RFID Development Guide with Microchip's RFID Devices Author: Youb

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