Temperature Sensor Backgrounder designer also contend with chips

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Temperature Sensor Backgrounder designer also contend with chips

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TB066
Temperature Sensor Backgrounder
designer also contend with chips that enough vaporize water during normal operation (though recommended). Thermal management systems this kind departure from that past. It's delicate science where attention must paid thermal issues throughout mechanical electrical design. System temperature design points must carefully picked thermal balance designed with precision skill watchmaker. Thermal response these systems profiled during acceptance testing assure they meet design criteria. addition, system thermal safeguards (insurance policies) installed prevent against thermal runaway event system placed environment, suffers catastrophic malfunction. Among these safeguards special temperature sensing components collectively referred Temperature Sensors.
INTRODUCTION
History shown that consumers have almost insatiable appetite even greater computing horsepower. you're enough remember, mere thought cryptic software programs creeping along your platform just years forces almost irrepressible grin. However, greater computing horsepower became available, needs grew direct proportion: more capable system, more could perform, more depended With this dependence came even greater demands portability match life style highly mobile society. System manufacturers quickly realized that their next generation equipment must faster, more versatile smaller. increasing performance while reducing system size paradox itself creates other problems. Increasing system performance requires both advanced digital chip architectures faster system clock rates. More advanced architectures result greater amount circuitry on-chip. Higher system clock rates cause chips hotter (primarily because energy losses from parasitic circuit effects). result, thermal problems arise from larger amount circuitry each chip running considerably faster (and therefore hotter) than ever before. This problem exacerbated small physical space which modern systems packaged (e.g. notebook form factor). Since heat cannot removed quickly, careful thermal management techniques must incorporated into every modern system design.
ENTER TEMPERATURE SENSOR
Early Temperature Sensors were electromechanical devices consisting switch composed dissimilar metals. Each metal different rate expansion with temperature. When heat applied, difference expansion rates caused unbalanced force generated causing switch open. switch cooled off, forces equalized switch closed. This approach both crude unreliable because continuous temperature cycling caused metal switch fatigue ultimately break resulting sensor failure. However, because there were viable alternatives, this technology wide spread. later years, several companies offered simple solid state temperature sensors that relied electrical changes materials with increasing temperature. These devices (among them: thermistors, RTDs simple semiconductor temperature sensors) were superior their electromechanical predecessors. However, they required external circuitry linearize translate voltage current outputs into electronic signals usable system. board space consumed added circuitry added cost manual calibration made these solutions less attractive design community large. wasn't until last decade that semiconductor manufacturers began combine solid state temperature sensing application-specific peripheral circuitry into single device, thus, providing total system solution single small package. Temperature Sensors this type commonly referred Smart Temperature Sensors.
THEN
Removing heat from system once "hammer chisel" exercise: average system packaged aluminum enclosure with lots surface area adequate heat sinking. Even that wasn't enough, finned heat sink muffin could added increase effective heatsink area. system designer paid only moderate attention thermal design always knew could brute force heatsink area most cases. There also plenty space most systems, airflow free unrestricted. Compare this present notebook computer where designer neither luxury large heatsink surface area, "wide open spaces" uncluttered circuit assemblies. that's enough,
2003 Microchip Technology Inc.
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TB066
SMART TEMPERATURE SENSOR MARKET
Smart Temperature Sensor's ability translate measured temperature into electronic signal directly usable system fueled their popularity. Today, application-optimized Smart Temperature Sensors used across wide range applications. They safeguard expensive chips high performance computers, protect output drivers linear power amplifiers perform wide variety cooling system control other thermal protection management functions. Smart Temperature Sensors with linear outputs (i.e. those that produce voltage, current digital code directly proportional measured temperature) used sensing elements process control equipment, laboratory instruments other direct measurement applications. They offer intrinsic benefits small size, reliable accurate operation, minimum external components installed cost. Most Smart Temperature Sensors supplied packages small that they mounted proximity devices they protect. This combination features fueled explosive growth these devices into market. voltages 2.7V easy hookup state-of-theart power supplies. small size operating voltage capability allows TC623 mounted under near) system chip, hottest component system (Figure some cases, second TC623 mounted motherboard measure internal ambient temperature system. TC623 furnishes three digital outputs: LIMIT, HIGH LIMIT CONTROL. LIMIT HIGH LIMIT outputs become active when measured temperature exceeds temperature trip points determined resistors HIGH inputs. CONTROL output provides correct logic driving cooling fan. becomes active when temperature equals HIGH value inactive when temperature reaches value (Figure actual use, TC623 used temperature monitor holistic thermal protection scheme. outputs connected microcontroller, ASIC other piece control logic dedicated responding active output from TC623. example typical thermal safeguard design using TC623 might like this: assume desktop computer having normal operating temperature 65°C maximum allowable temperature 85°C. TC623 installed close physical contact with chip (see Figure TC623 input programmed trip point temperature 70°C (5°C above normal) HIGH input trip point 80°C (5°C below maximum). Under normal operating conditions, operating temperature never exceeds 70°C TC623 outputs remain off. assume user relocates computer very tight location with inadequate airflow cooling. internal temperature computer begins rising temperature increases. When temperature reaches 70°C, TC623 LIMIT becomes active system responds reducing clock speed, thereby lowering power dissipation reducing rate temperature increase. temperature continues rise, more aggressive steps must taken. When temperature reaches HIGH setting 80°C, HIGH LIMIT CONTROL outputs both become active. CONTROL output starts cooling while HIGH LIMIT output reduces clock speed even further. this point, system might notify user that system running over temperature. HIGH LIMIT output persists after given time interval, very serious problem indicated system might respond powering down DRAM save user's work).
TC623 SMART TEMPERATURE SENSOR
Recent mandates calling more power efficient, "green" have caused many power-saving techniques learned developing notebook computers applied desktop computers well. Among these techniques reduction system power dissipation lowering power supply voltage from 3.3V. This helps reduce amount heat generated system, increases system power efficiency helps extend operating time battery-powered systems. Although newer processors, like Pentium®, 3.3V, they still enough require careful thermal design system safeguards, even desktop applications. internals modern desktop notebook have specific thermal profiles over normal system operating conditions. That temperatures internal components will rise only high because thermal characteristics system "fixed" system design itself. Thermal safeguards installed system designer only warn system when temperatures exceed thermal design. This caused malfunction operating system high ambient temperature. TC623 Smart Temperature Sensor designed specifically warn system impending thermal overload situation. TC623 consists user-programmable temperature detector built-in temperature sensor 0.150 wide, 8-pin surface mount package (see Figure specifically designed operate power supply
DS91066A-page
2003 Microchip Technology Inc.
TB066
Temp Sensor
TC623
Temperature Detector HIGH LIMIT HIGH LIMIT CONTROL Digital Outputs
Programming Resistors
FIGURE
TC623 Smart Temperature Sensor
Stainless Steel Strap Microprocessor TC623 Board Socket Applications Microprocessor Board Surface Mount Applications
TC623
FIGURE
TC623 Direct Board Mounting
Regulate Option Regulate Option HIGH LIMIT High Point Limit Point Temperature Programmable Hysteresis Regulate Option
Limit Output
High Limit Output
Control Output
FIGURE
Using resistors, TC623 give output from 125°C
2003 Microchip Technology Inc.
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TB066
SUMMARY
satisfy demand smaller, more powerful PCs, system designers have aggressively reduced enclosures designed faster processors. However, that power stuffed into cramped quarters produces heat that threatens only processor, also entire system. Microchip's Smart Temperature Sensors cost devices that safequard against this problem. more information effective thermal management products, contact your nearest Microchip sales office listed back this publication visit website www.microchip.com.
DS91066A-page
2003 Microchip Technology Inc.
Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable."
Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act.
Information contained this publication regarding device applications like intended through suggestion only superseded updates. your responsibility ensure that your application meets with your specifications. representation warranty given liability assumed Microchip Technology Incorporated with respect accuracy such information, infringement patents other intellectual property rights arising from such otherwise. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, under intellectual property rights.
Trademarks Microchip name logo, Microchip logo, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, MATE PowerSmart registered trademarks Microchip Technology Incorporated U.S.A. other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Accuron, dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerTool, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel Total Endurance trademarks Microchip Technology Incorporated U.S.A. other countries. Serialized Quick Turn Programming (SQTP) service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2003, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved.
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Microchip received QS-9000 quality system certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona July 1999 Mountain View, California March 2002. Company's quality system processes procedures QS-9000 compliant PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001 certified.
2003 Microchip Technology Inc.
DS91066A page
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02/12/03
DS91066A-page
2003 Microchip Technology Inc.

Temperature Sensor Backgrounder designer also contend with chips

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