PALC22V10D PRODUCT DESCRIPTION (for qualification) Informati
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FLASH ERASABLE CMOS CONVERSION
PALC22V10D
PRODUCT DESCRIPTION (for qualification)
Information provided this document intended generic qualification technically describes Cypress part supplied: Marketing Part Cypress Division: Size (stepping): PALC22V10D Cypress Semiconductor Corporation, Group Rev. 7C322D Feb, 1995 mils mils What markings Die: Device Description: FLASH ERASABLE REPROGRAMABLE CMOS Overall Mask) Level (pre-requisite qualification):
Cypress Qualification completion/Marketing Availability Dates (Current REV):
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number Metal Layers: Metal Composition: Metal 1200A TiW, 6,000A 500A Metal 1,200A 9,000A
Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: None
3,000A TEOS 15,000A Oxynitride Double Poly, Double Metal 0.65µm
Generic Process Technology/Design Rule (µ-drawn): Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process
SiO2 Control gate Pass gate Erase gate Cypress Semiconductor, Jose, FLASH22D
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PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Silver Spot Paste Thermosonic Copper Solder Plated, 85%Sn, 15%Pb Attach Dim: Attach Material: Wire Material/Size: Alpha-x P243A mils mils Silver Epoxy Gold 24-pin, 300-mil Plastic mils side Sumitomo EME-6300H(R)
Cypress Bangkok, Thailand
HERMETIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Paste Ultrasonic None Alloy Solder Dipped, 63%Sn, 37%Pb Attach Dim: Attach Material: Wire Material/Size: Silver Glass Aluminum 1.25 24-pin, 300-mil CerDIP mils side
Cypress Bangkok, Thailand Alpha-X D243B
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OTHER INFORMATION
approval similarity, identify other devices using same basic with bonding metal mask options test selections explain: None Cypress planning changes near future, identify change (Qtr/Yr) None Design Rev./Shrink: Fab/Assembly site change: Other Packages qualified this device: Voltage Rating (per STD-008, Method 3018): Flammability Classification (UL-94V): Alternate Fab/Assembly Locations: None Assembly Anam, Korea (PLCC) Omedata, Indonesia (PDIP) None Other Devices qualified this technology: PLCC/LCC 4400V Process Change: Cross Licensee/Licensor: None None
Please attach following Qualification Reliability data revision Package type, assembly sites identified above (mark included): HAST (5.5V, 140°C, 85%RH, 15psig) Temperature Cycles (-65°C 150°C) Data Retention Bake, Plastic (165°C) Data Retention Bake, Hermetic (250°C) Autoclave (PCT, 121°C, 100%RH) Tests (MIL-STD 883, method 3015) Operating Life (temp): Latchup Testing Steady State Life (HTSSL, 5.75V, 125°C) Temperature Humidity Bias (5.5V, 85°C, 85%RH) Other: Current Density Input Capacitance 150°C
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PRODUCT INFORMATION QUALIFICATION SIMILARITY Product Family: Division: Supplier's Part Number Flash CMOS (PALC22V10D) Cypress Semiconductor Rated Speed Size/ Type Revision Size (stepping) Design Rule Fabrication Passivation Mold Type Compound Assembly Line Location Volt Rating
Process Line PALC22V10D PALC22V10D PALC22V10D PALC22V10D -**PC -**JC -**DC -**LC 24.3 PDIP PLCC 24.3 CDIP 7C322D 0.65µ FLASH Plasma Oxynitride Sumitomo Cypress Bangkok, Thailand >4400V
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DEVICE RELIABILITY SUMMARY
Device Type(s): Description: PALC22V10D 24-pin, 300-mil PDIP 24-pin, 300-mil CDIP Wafer Fab: Assembly: Jose, Cypress Bangkok, Thailand
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Early Failure Rate Device PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC PALC22V10D-DC Assy Lot# 219309061 219309149 219307576 219308389 219308867 219400128 Lot# 1345909 1344899 1336695 1340815 1344888 1345908 Hours Hours 0/359 0/357 0/336 0/337 0/337 0/337 Cumulative 0/2063
0/3361 0/337 0/337
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Latent Failure Rate Device PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC PALC22V10D-DC Assy Lot# 219309061 219309149 219307576 219308389 219308867 219400128 Lot# 1345909 1344899 1336695 1340815 1344888 1345908 Hours 0/359 0/357 0/119 0/119 0/119 0/337 Hours Cumulative 0/1410 0/119 0/119 0/337
Group Subgroup Life Test (HTOL, 5.75V, 150°C) Device PALC22V10D-DMB Assy Lot# 219308431 Lot# 1336695 Hours 0/80 Cumulative 0/80
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DEVICE RELIABILITY SUMMARY Device Type(s): Description: PALC22V10D 24-pin, 300-mil PDIP 24-pin, 300-mil CDIP Wafer Fab: Assembly: Jose, Cypress Bangkok, Thailand
High Temperature Steady State Life Test (HTSSL, 5.75V, 150°C) Latent Failure Rate Device PALC22V10D-PC PALC22V10D-DC PALC22V10D-PC PALC22V10D-PC Assy Lot# 219308867 219400128 219307576 219308389 Lot# 1344888 1345908 1336695 1340815 Hours 0/79 0/79 0/79 1/1342 Hours 0/79 0/79 0/79 0/133 Cumulative 1/371
Data Retention Bake (DRET, Bias, 165°C) Device PALC22V10D-PC PALC22V10D-DC PALC22V10D-PC PALC22V10D-PC Assy Lot# 219308867 219400128 219307576 219308389 Lot# 1344888 1345908 1336695 1340815 Hours 0/79 0/79 0/79 0/79 Hours 0/79 0/79 0/79 0/79 Cumulative 0/316
High Accelerted Saturation Test (HAST, 5.5V, 140°C), precondition (Condition Device PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC Assy Lot# 219308867 219307576 219308389 Lot# 1344888 1336695 1340815 Hours 0/48 0/48 0/48 Cumulative 0/144
Temperature Cycle (TC, -65°C 150°C) Device PALC22V10D-PC PALC22V10D-PC PALC22V10D-PC PALC22V10D-DC Assy Lot# 219308867 219307576 219308389 219400128 Lot# 1344888 1336695 1340815 1345908 Cycles Cycles 0/48 0/48 0/48 0/48 1000 Cycles Cumulative 0/192
Metal defect.
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DEVICE RELIABILITY SUMMARY Device Type(s): Description: PALC22V10D 24-pin, 300-mil PDIP 24-pin, 300-mil CDIP Wafer Fab: Assembly: Jose, Cypress Bangkok, Thailand
Long Life Verification (LLVA, 5.75V, 150°C) Device PALC22V10D-PC Assy Lot# 219307576 Lot# 1336695 1000 Hours 0/1263 Cumulative 0/126
Temperature Operating Life (LTOL, 6.5V, -45°C) Device PALC22V10D-PC Assy Lot# 219307576 Lot# 1336695 Hours 0/48 1000 Hours 0/474 Cumulative 0/48
EOS. EOS.
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Device Reliability Summary
FLASH CMOS PALC22V10D Electrostatic Discharge Human Body Model Circuit 883, Method 3015 +4400V +4400V Unit Unit -4400V -4400V
+4400V Unit -4400V (Highest passing voltage, +10% Guard-banded) Latchup Testing Cypress Internal Latch-up Procedure Tests: Current Injection 200mA Trigger Socket Temp 125°C
Other miscellaneous tests Input/Output capacitance Passed Current Density: Passed
Other qualifications that affect this product family process Qual 92151 Qualification Description FULL QUALIFICATION FLASH 22V10D
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