PRODUCT DESCRIPTION (for qualification) Information provided this

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256K PROM 128K PROM REDESIGNED MARKETING PART NUMBER CY27C256 CY27C128 CY7C251 CY7C254 DEVICE DESCRIPTION Power Switch Reprogrammable PROM Power Switch Reprogrammable PROM Power Switch Reprogrammable PROM Reprogrammable PROM
PRODUCT DESCRIPTION (for qualification)
Information provided this document intended generic qualification technically describes Cypress part supplied: Marketing Part Device Description: Cypress Division: Size (stepping): 256K/128K PROM Cypress Semiconductor Corporation Rev. 7C256A/7C251A/7C254A 12/1993 12/1993 mils mils What markings Die:
Overall Mask) Level (pre-requisite qualification): Cypress Qualification completion/Marketing Availability Dates (Current REV):
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number Metal Layers: Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process CMOS, Double Poly, Double Metal 0.8µm SiO2 245A Cypress Semiconductor Round Rock, (Fab2) PLD20DHK Generic Process Technology/Design Rule (µ-drawn): Metal Composition: Metal 1%SiAl, Metal 1%SiAl None
4,000A 15,000A Oxynitride
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Epoxy Thermosonic Copper Solder plated, 85%Sn, 15%Pb Silver Attach Dim: Attach Material: Wire Material/Size: Omedata, Indonesia Indns-O/ P286 mils mils Silver Epoxy Gold 28-pin, 600-mil Plastic (CY27C256/CY27C128/CY7C254) mils side Sumitomo EME-6300H(R)
CYPRESS SEMICONDUCTOR PAGE
HERMETIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Paste Ultrasonic Alloy Solder Dipped, 63%Sn, 37%Pb Silver Attach Dim: Attach Material: Wire Material/Size: Alpha-X W283 mils mils Silver Glass Aluminum 1.25 28-pin, 300-mil Windowed CerDIP (CY7C251) mils side
Cypress Semiconductor, Bangkok, Thailand
HERMETIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Paste Ultrasonic Alloy Solder Dipped, 63%Sn, 37%Pb Silver Attach Dim: Attach Material: Wire Material/Size: Alpha-X W286 mils mils Silver Glass Aluminum 1.25 28-pin, 600-mil Windowed CerDIP (CY27C256/CY27C128/CY7C254) mils side
Cypress Semiconductor, Bangkok, Thailand
CYPRESS SEMICONDUCTOR PAGE
OTHER INFORMATION
approval similarity, identify other devices using same basic with bonding metal mask options test selections explain:
Cypress planning changes near future, identify change (Qtr/Yr) Design Rev./Shrink: Fab/Assembly site change: Other Devices qualified this technology: Other Packages qualified this device: Process Change: Cross Licensee/Licensor: CY7C271/274/277/279/285/286/287 CY27C256: PLCC, CDIP, LCC, WLCC, PDIP CY27C128: PDIP, PLCC, CDIP,LCC, WLCC CY7C251/254: PDIP, CDIP, LCC, WLCC >2,000V None Assembly Omedata, Indonesia
Voltage Rating (per STD-008, Method 3018): Flammability Classification (UL-94V): Alternate Fab/Assembly Locations:
Qualification Reliability data revision Package type, assembly sites identified above (mark included): HAST (5.5V, 140°C, 85%RH, 15psig) Temperature Cycles (-65°C 150°C) Temperature Cycles (-40°C 125°C) Data Retention Bake, Plastic (165°C) Data Retention Bake, Hermetic (250°C) Autoclave (PCT, 121°C, 100%RH) Tests (MIL-STD 883, method 3015) Operating Life (temp): Latchup Testing Steady State Life (HTSSL, 5.75V, 150°C) High Bias (7.0V, 125°C) Read Record Other: Other: Internal Water Vapor Current Density 150°C
CYPRESS SEMICONDUCTOR PAGE
PRODUCT INFORMATION QUALIFICATION SIMILARITY
Product Family: Division: 256K/128K PROM Cypress Semiconductor, Bangkok Thailand Rated Speed Size/ Type Revision Size (stepping) Design Rule Fabrication Passivation Mold Assembly Volt Type Compound Line Rating Location Availability (mm/yy)
Supplier's Part Number
Process Line CY27C256 -**JC -**PC -**WC/WMB -**DMB -**LMB -**QMB PLCC 28.6 PDIP 28.6 WCDIP 28.6 CDIP WLCC 7C256A 0.8µ CMOS Oxynitride Sumitomo Alphatech, >2,000V Bangkok, Hysol Thailand 12/1993
CY27C128 -**JC PLCC -**PC 28.6 PDIP -**WC/WMB 28.6 WCDIP CY7C251 -**PC -**WC/WMB -**DMB -**LMB -**QMB -**PC -**WC/WMB -**DMB -**QMB 28.3 PDIP 28.3 WCDIP 28.3 CDIP WLCC 28.6 PDIP 28.6 WCDIP 28.6 CDIP WLCC
27C128A
0.8µ
CMOS
Oxynitride Oxynitride
Sumitomo Hysol
Alphatec, Bangkok, Thailand
>2,000v
12/1993
7C251B
0.8µ
CMOS
Sumitomo Alphatech, >2,000V Bangkok, Hysol Thailand
12/1993
CY7C254
7C254B
0.8µ
CMOS
Oxynitride
Sumitomo Alphatech, >2,000V Bangkok, Hysol Thailand
12/1993
CYPRESS SEMICONDUCTOR PAGE
Marketing Part: Description:
CY27C128/CY27C256/CY7C251/ CY7C254 28-pin, 600-mil PDIP 28-pin, 300-mil WCDIP 28-pin, 600-mil WCDIP
DEVICE RELIABILITY SUMMARY
Wafer Fab: Assembly:
Round Rock, Cypress Jose, Alphatech, Bangkok, Thailand
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Early Failure Rate Device 7C251-WC 7C256-PC Lot# 2334869 2330541 Hours 0/1007 1/999 Cumulative 0/2006
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Latent Failure Rate Device 7C251-WC 7C256-PC Lot# 2334869 2330541 Hours 0/116 0/116 Hours 0/116 0/116 Cumulative 0/232
Group Subgroup Life Test (HTOL, 5.75V, 150°C) Device 7C256WMB Lot# 2334869 Hours 0/80 Cumulative 0/80
High Temperature Steady State Life Test (HTSSL, 5.75V, 150°C) Device 7C254-WC 7C256-PC Lot# 2334869 2330541 Hours 0/76 0/153 Hours 0/76 0/73 Cumulative 0/229
Data Retention Bake, Plastic Packaged Devices bias, 165°C) Device 7C256-PC Lot# 2330541 Hours 0/76 Hours 0/76 Cumulative 0/76
CYPRESS SEMICONDUCTOR PAGE
Data Retention Bake, Hermetic Packaged Devices bias, 250°C) Device 7C254-WC Lot# 2334869 Hours 0/76 Hours 0/76 Cumulative 0/76
Temperature Cycle (JEDEC -40°C 125°C) Device 7C256-PC Lot# 2330541 Cycles 0/45 Temperature Cycle (Condition -65°C 150°C) Device 7C251-WC 7C256-PC Lot# 2334869 2330541 Cycles 0/47 0/45 Autoclave (PCT, bias, 121°C, 100%RH, 15psig) Device 7C256-PC Lot# 2330541 Hours 0/45 High Accelerated Saturation Test (HAST, 5.5V, 140°C, 85%RH, 15psig) Device 7C256-PC Lot# 2330541 Hours 0/45 High Bias 7.0V, 125°C, Device 7C251-WC Lot# 2334869 Hours 0/129 Cumulative 0/129 Cumulative 0/45 Cumulative 0/45 Cycles 1000 Cycles 0/47 Cumulative 0/92 Cumulative 0/45
CYPRESS SEMICONDUCTOR PAGE
Device Reliability Summary
256K/128K PROM Electrostatic Discharge Human Body Model Circuit 883, Method 3015 >+2,000V Unit >-2,000V >+2,000V Unit >-2,000V >+2,000V Unit >-2,000V (Highest passing voltage, +10% Guard-banded)
Latchup Testing Cypress Internal Latch-up Procedure Tests: Current Injection 200mA Trigger Socket Oscillation 7.5V 1MHz Temp 150°C

PRODUCT DESCRIPTION (for qualification) Information provided this

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