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BF998WR N-channel dual-gate MOS-FET Product specification Superse
Top Searches for this datasheetBF998WR N-channel dual-gate MOS-FET Product specification Supersedes data 1995 File under Discrete Semiconductors, SC07 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FET FEATURES High forward transfer admittance Short channel transistor with high forward transfer admittance input capacitance ratio noise gain controlled amplifier GHz. APPLICATIONS applications with supply voltage, such television tuners professional communications equipment. DESCRIPTION Depletion type field-effect transistor plastic microminiature SOT343R package with source substrate interconnected. transistor protected against excessive input voltage surges integrated back-to-back diodes between gates source. CAUTION device supplied antistatic package. gate-source input must protected against static discharge during transport handling. Marking code: BF998WR PINNING SYMBOL source drain gate gate DESCRIPTION view MAM198 Fig.1 Simplified outline (SOT343R) symbol. QUICK REFERENCE DATA SYMBOL Ptot Cig1-s drain current total power dissipation operating junction temperature forward transfer admittance input capacitance gate reverse transfer capacitance noise figure PARAMETER drain-source voltage CONDITIONS MIN. TYP. MAX. UNIT 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FET LIMITING VALUES accordance with Absolute Maximum Rating System (IEC 134). SYMBOL Ptot Tstg Note Device mounted printed-circuit board. PARAMETER drain-source voltage drain current gate current gate current total power dissipation storage temperature operating junction temperature Tamb Fig.2; note CONDITIONS MIN. BF998WR MAX. +150 +150 UNIT MLD154 handbook, halfpage Ptot (mW) Tamb Fig.2 Power derating curve. 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FET THERMAL CHARACTERISTICS SYMBOL Notes Device mounted printed-circuit board. temperature soldering point source lead. STATIC CHARACTERISTICS unless otherwise specified. SYMBOL V(BR)G1-SS V(BR)G2-SS V(P)G1-S V(P)G2-S IDSS IG1-SS IG2-SS PARAMETER gate 1-source breakdown voltage gate 2-source breakdown voltage gate 1-source cut-off voltage gate 2-source cut-off voltage drain-source current gate cut-off current gate cut-off current CONDITIONS VG2-S IG1-S VG1-S IG2-S VG2-S VG1-S VG2-S VG1-S VG2-S VG1-S VG1-S VG2-S MIN. PARAMETER thermal resistance from junction ambient thermal resistance from junction soldering point CONDITIONS note note BF998WR VALUE UNIT MAX. -2.5 UNIT DYNAMIC CHARACTERISTICS Common source; Tamb VG2-S unless otherwise specified. SYMBOL Cig1-s Cig2-s PARAMETER forward transfer admittance input capacitance gate input capacitance gate drain-source capacitance noise figure MHz; BSopt CONDITIONS pulsed; MIN. TYP. 1.05 MAX. UNIT reverse transfer capacitance MHz; BSopt 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FET BF998WR MGC471 MGC470 (mA) (mA) -0.1 -0.2 -0.3 -0.4 -0.5 Tamb VG2-S Tamb Fig.3 Transfer characteristics; typical values. Fig.4 Output characteristics; typical values. MGC472 MGC473 (mS) (mS) -1600 -1200 -800 -400 (mV) (mA) Tamb Tamb Fig.5 Drain current function gate voltage; typical values. Fig.6 Forward transfer admittance function drain current; typical values. 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FET BF998WR MGC474 MGC475 (mS) (pF) VG1-S VDS(V) Tamb VG2-S MHz; Tamb Fig.7 Forward transfer admittance function gate voltage; typical values. Fig.8 Output capacitance function drain-source voltage; typical values. MGC476 MGC477 (pF) (pF) -2.4 -1.6 -0.8 VG1-S (mV) VG2-S VG2-S MHz; Tamb VG1-S MHz; Tamb Fig.9 Gate input capacitance function gate 1-source voltage; typical values. Fig.10 Gate input capacitance function gate 2-source voltage; typical values. 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FET BF998WR MGC466 (mS) (µS) MGC467 (deg) (MHz) (MHz) VG2-S Tamb VG2-S Tamb Fig.11 Input admittance function frequency; typical values. Fig.12 Reverse transfer admittance phase function frequency; typical values. MGC468 MGC469 (mS) (mS) (deg) (MHz) (MHz) VG2-S Tamb VG2-S Tamb Fig.13 Forward transfer admittance phase function frequency; typical values. Fig.14 Output admittance function frequency; typical values. 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FET BF998WR VAGC input input BB405 input BB405 output MGC481 turns copper wire, internal diameter turns copper wire, internal diameter Tapped approximately half turn from cold side, adjust adjusted Fig.15 Gain control testcircuit MHz. 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FET BF998WR VAGC input 0.5-3.5 2-18 0.5-3.5 input 4-40 MGC480 turns copper wire, without spacing, internal diameter silvered copper wire, above ground plane. silvered copper wire, above ground plane. Fig.16 Gain control test circuit MHz. MGC479 MGC478 (dB) (dB) IDSS= IDSS= VAGC(V) VAGC(V) MHz; Tamb MHz; Tamb Fig.17 Automatic gain control characteristics measured circuit Fig.15. Fig.18 Automatic gain control characteristics measured circuit Fig.16. 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FET PACKAGE OUTLINE BF998WR handbook, full pagewidth 1.00 1.35 1.15 0.25 0.10 MSB367 Dimensions Fig.19 SOT343R. 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FET DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values BF998WR This data sheet contains target goal specifications product development. This data sheet contains preliminary data; supplementary data published later. This data sheet contains final product specifications. Limiting values given accordance with Absolute Maximum Rating System (IEC 134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections specification implied. Exposure limiting values extended periods affect device reliability. Application information Where application information given, advisory does form part specification. LIFE SUPPORT APPLICATIONS These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips customers using selling these products such applications their risk agree fully indemnify Philips damages resulting from such improper sale. 1997 Philips Semiconductors worldwide company Argentina: South America Australia: Waterloo Road, NORTH RYDE, 2113, Tel. 9805 4455, Fax. 9805 4466 Austria: Computerstr. A-1101 WIEN, P.O. 213, Tel. 1010, Fax. 1210 Belarus: Hotel Minsk Business Center, Bld. 1211, Volodarski Str. 220050 MINSK, Tel. +375 733, Fax. +375 Belgium: Netherlands Brazil: South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, James Bourchier Blvd., 1407 SOFIA, Tel. +359 211, Fax. +359 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. 7381 China/Hong Kong: Hong Kong Industrial Technology Centre, Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: South America Czech Republic: Austria Denmark: Prags Boulevard 1919, DK-2300 COPENHAGEN Tel. 2636, Fax. 0044 Finland: Sinikalliontie FIN-02630 ESPOO, Tel. +358 615800, Fax. +358 61580920 France: Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. 6161, Fax. 6427 Germany: D-20097 HAMBURG, Tel. Fax. Greece: 25th March Street, 17778 TAVROS/ATHENS, Tel. 4894 339/239, Fax. 4814 Hungary: Austria India: Philips INDIA Ltd, Band Building, floor, 254-D, Annie Besant Road, Worli, MUMBAI 025, Tel. 8541, Fax. 0966 Indonesia: Singapore Ireland: Newstead, Clonskeagh, DUBLIN Tel. +353 7640 000, Fax. +353 7640 Israel: RAPAC Electronics, Kehilat Saloniki 18053, AVIV 61180, Tel. +972 0444, Fax. +972 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza Novembre 20124 MILANO, Tel. 6752 2531, Fax. 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. 3740 5130, Fax. 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. 1412, Fax. 1415 Malaysia: Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. 5214, Fax. 4880 Mexico: 5900 Gateway East, Suite 200, PASO, TEXAS 79905, Tel. +9-5 7381 Middle East: Italy Netherlands: Postbus 90050, 5600 EINDHOVEN, Bldg. Tel. 82785, Fax. 88399 Zealand: Wagener Place, C.P.O. 1041, AUCKLAND, Tel. 4160, Fax. 7811 Norway: Manglerud 0612, OSLO, Tel. 8000, Fax. 8341 Philippines: Philips Semiconductors Philippines Inc., Valero Salcedo Village, P.O. 2108 MCC, MAKATI, Metro MANILA, Tel. 6380, Fax. 3474 Poland: Lukiska 04-123 WARSZAWA, Tel. 2831, Fax. 2327 Portugal: Spain Romania: Italy Russia: Philips Russia, Usatcheva 35A, 119048 MOSCOW, Tel. 6918, Fax. 6919 Singapore: Lorong Payoh, SINGAPORE 1231, Tel. 2538, Fax. 6500 Slovakia: Austria Slovenia: Italy South Africa: S.A. PHILIPS Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. 7430 Johannesburg 2000, Tel. 5911, Fax. 5494 South America: Rocio 220, floor, Suite 04552-903 Paulo, PAULO Brazil, Tel. 2333, Fax. 1849 Spain: Balmes 08007 BARCELONA, Tel. 6312, Fax. 4107 Sweden: Kottbygatan Akalla, S-16485 STOCKHOLM, Tel. 2000, Fax. 2745 Switzerland: Allmendstrasse 140, CH-8027 Tel. 2686, Fax. 7730 Taiwan: Philips Semiconductors, Chien Rd., Sec. TAIPEI, Taiwan Tel. +886 2134 2865, Fax. +886 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. 4090, Fax. 0793 Turkey: Talatpasa Cad. 80640 Tel. 2770, Fax. 6707 Ukraine: PHILIPS UKRAINE, Patrice Lumumba str., Building Floor 252042 KIEV, Tel. +380 2776, Fax. +380 0461 United Kingdom: Philips Semiconductors Ltd., Bath Road, Hayes, MIDDLESEX 5BX, Tel. 5000, Fax. 8421 United States: East Arques Avenue, SUNNYVALE, 94088-3409, Tel. 7381 Uruguay: South America Vietnam: Singapore Yugoslavia: PHILIPS, Pasica 5/v, 11000 BEOGRAD, Tel. +381 344, Fax.+381 other countries apply Philips Semiconductors, Marketing Sales Communications, Building BE-p, P.O. 218, 5600 EINDHOVEN, Netherlands, Fax. 24825 Philips Electronics N.V. 1997 Internet: SCA55 rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights. Printed Netherlands 117067/00/02/pp12 Date release: 1997 Document order number: 9397 02671 Other recent searchesWS317L - WS317L WS317L Datasheet MT9KDF12872PZ - MT9KDF12872PZ MT9KDF12872PZ Datasheet MT9KDF25672PZ - MT9KDF25672PZ MT9KDF25672PZ Datasheet MPC500 - MPC500 MPC500 Datasheet LPC1311 - LPC1311 LPC1311 Datasheet LPC1313 - LPC1313 LPC1313 Datasheet LPC1342 - LPC1342 LPC1342 Datasheet LPC1343 - LPC1343 LPC1343 Datasheet GA600GD25S - GA600GD25S GA600GD25S Datasheet DS3112RD - DS3112RD DS3112RD Datasheet CLM6121 - CLM6121 CLM6121 Datasheet CLM6321 - CLM6321 CLM6321 Datasheet 1775664 - 1775664 1775664 Datasheet
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