CMOS SRAM 512K Super Power Voltage Full CMOS Static Revision

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CMOS SRAM 512K Super Power Voltage Full CMOS Static Revision

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K6F8016V3M Family
CMOS SRAM
512K Super Power Voltage Full CMOS Static
Revision History
Revision History
Initial draft Finalized Errata correction Change tWHZ 20ns 70ns product. Change 25ns 55ns product. 30ns 70ns product.
Draft Date
July 1999 April 2000
Remark
Preliminary Final
attached datasheets provided SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve right change specifications products. SAMSUNG Electronics will answer yourquestions about device. have questions, please contact SAMSUNG branch offices.
Revision April 2000
K6F8016V3M Family
FEATURES
Process Technology: Full CMOS Organization: 512K Power Supply Voltage: 3.0~3.6V Data Retention Voltage: 1.5V(Min) Three state output Compatible Package Type: 44-TSOP2-400F/R
CMOS SRAM
GENERAL DESCRIPTION
K6F8016V3M families fabricated SAMSUNGs advanced full CMOS process technology. families support various operating temperature ranges have small package user flexibility system design. families also support data retention voltage battery back-up operation with data retention current.
512K Super Power Voltage Full CMOS Static
DUCT FAMILY
Power Dissipation Product Family K6F8016V3M-B K6F8016V3M-F Operating Temperature Commercial(0~70°C) Industrial(-40~85°C) Range Speed Standby (ISB1, Typ.) 0.5µA Operating (ICC1, Max) Type
3.0~3.6V
551)/70ns
44-TSOP2-400F/R
parameter measured with 30pF test load.
DESCRIPTION
I/OI I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 I/O8 I/O16 I/O15 I/O14 I/O13 I/O12 I/O11 I/O10 I/O9 I/O16 I/O15 I/O14 I/O13 I/O12 I/O11 I/O10 I/O9 I/OI I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 I/O8
FUNCTIONAL BLOCK DIAGRAM
gen. Precharge circuit.
Addresses
44-TSOP2 Forward
44-TSOP2 Reverse
select
Memory array 1024 rows columns
I/O1~I/O8
Data cont Data cont Data cont
Circuit Column select
I/O9~I/O16
Name A0~A18
Function Chip Select Input Output Enable Input Write Enable Input Address Inputs
Name
Function Power Ground Upper Byte(I/O9~16) Lower Byte(I/O1~8)
Column Addresses
Control Logic
I/O1~I/O16 Data Inputs/Outputs
SAMSUNG ELECTRONICS CO., LTD. reserves right change products specifications without notice.
Revision April 2000
K6F8016V3M Family
PRODUCT LIST
Commercial Temperature Products(0~70°C) Part Name K6F8016V3M-TB55 K6F8016V3M-TB70 K6F8016V3M-RB55 K6F8016V3M-RB70 Function 44-TSOP2-F, 55ns, 3.3V 44-TSOP2-F, 70ns, 3.3V 44-TSOP2-R, 55ns, 3.3V 44-TSOP2-R, 70ns, 3.3V
CMOS SRAM
Industrial Temperature Products(-40~85°C) Part Name K6F8016V3M-TF55 K6F8016V3M-TF70 K6F8016V3M-RF55 K6F8016V3M-RF70 Function 44-TSOP2-F, 55ns, 3.3V 44-TSOP2-F, 70ns, 3.3V 44-TSOP2-R, 55ns, 3.3V 44-TSOP2-R, 70ns, 3.3V
FUNCTIONAL DESCRIPTION
I/O1~8 High-Z High-Z High-Z Dout High-Z Dout High-Z I/O9~16 High-Z High-Z High-Z High-Z Dout Dout High-Z Mode Deselected Output Disabled Output Disabled Lower Byte Read Upper Byte Read Word Read Lower Byte Write Upper Byte Write Word Write Power Standby Active Active Active Active Active Active Active Active
Note means dont care. (Must high state)
ABSOLUTE MAXIMUM RATINGS1)
Item Voltage relative Voltage supply relative Power Dissipation Storage temperature Operating Temperature Symbol VIN, VOUT TSTG Ratings -0.2 VCC+0.5V -0.2 Unit
Stresses greater than those listed under "Absolute Maximum Ratings" cause permanent damage device. Functional operation should restricted recommended operating condition. Exposure absolute maximum rating conditions extended periods affect reliability.
Revision April 2000
K6F8016V3M Family
RECOMMENDED OPERATING CONDITIONS1)
Item Supply voltage Ground Input high voltage Input voltage Symbol -0.23)
CMOS SRAM
Vcc+0.2
Unit
Note: Commercial products: TA=0 70°C, otherwise specified. Industrial products: TA=-40 85°C, otherwise specified. Overshoot: VCC+2.0V case pulse width 20ns. Undershoot: -2.0V case pulse width 20ns. Overshoot undershoot sampled, 100% tested.
CAPACITANCE (f=1MHz, TA=25°C)
Item Input capacitance Input/Output capacitance
Capacitance sampled, 100% tested.
Symbol
Test Condition VIN=0V VIO=0V
Unit
OPERATING CHARACTERISTICS
Item Input leakage current Output leakage current Operating power supply current Average operating current Output voltage Output high voltage Standby Current(TTL) Standby Current(CMOS) Symbol ICC1 ICC2 ISB1 VIN=Vss CS=VIH, OE=VIH WE=VIL, VIO=Vss IIO=0mA, CS1=VIL, WE=VIH, VIN=VIH
Cycle time=1µs, 100%duty, IO=0mA, CS0.2V, VIN0.2V VCC-0.2V
Test Conditions
Unit
Cycle time=Min, IIO=0mA, 100% duty, CS=VIL, VIN=VIL
2.1mA -1.0mA CS=VIH, Other inputs=VIH CSVcc-0.2V, Other inputs=0~Vcc
Super power product=10µA with special handling.
Revision April 2000
K6F8016V3M Family
OPERATING CONDITIONS
TEST CONDITIONS(Test Load Input/Output Reference)
Input pulse level: 2.2V Input rising falling time: Input output reference voltage:1.5V Output load(see right): CL=100pF+1TTL CL=30pF+1TTL
CMOS SRAM
VTM3) R12)
CL1)
R22)
Including scope capacitance =3070, =3150 V=2.8V
CHARACTERISTICS (Vcc=3.0~3.6V, Commercial Products: TA=0 70°C, Industrial products: TA=-40 85°C)
Speed Bins Parameter List Symbol Read Cycle Time Address Access Time Chip Select Output Output Enable Valid Output Access Time Read Chip Select Low-Z Output Enable Low-Z Output Output Enable Low-Z Output Chip Disable High-Z Output Disable High-Z Output Output Disable High-Z Output Output Hold from Address Change Write Cycle Time Chip Select Write Address Set-up Time Address Valid Write Valid Write Write Write Pulse Width Write Recovery Time Write Output High-Z Data Write Time Overlap Data Hold from Write Time Write Output Low-Z tBLZ tOLZ tBHZ tOHZ tWHZ 55ns 70ns Units
DATA RETENTION CHARACTERISTICS
Item data retention Data retention current Data retention set-up time Recovery time Symbol tSDR tRDR Test Condition CSVcc-0.2V Vcc=1.5V, CSVcc-0.2V data retention waveform
Unit
Super power product=4µA with special handling.
Revision April 2000
K6F8016V3M Family
TIMMING DIAGRAMS
CMOS SRAM
TIMING WAVEFORM READ CYCLE(1) (Address Controlled, CS=OE=VIL, WE=VIH, or/and LB=VIL)
Address Data Previous Data Valid Data Valid
TIMING WAVEFORM READ CYCLE(2) (WE=VIH)
Address
tBHZ tOLZ tBLZ Data Valid tOHZ
Data
High-Z
NOTES (READ CYCLE) tOHZ defined time which outputs achieve open circuit conditions referenced output voltage levels. given temperature voltage condition, tHZ(Max.) less than tLZ(Min.) both given device from device device interconnection.
Revision April 2000
K6F8016V3M Family
TIMING WAVEFORM WRITE CYCLE(1)
Controlled)
CMOS SRAM
Address tCW(2) tWP(1) tAS(3) Data High-Z tWHZ Data Data Undefined Data Valid High-Z tWR(4)
TIMING WAVEFORM WRITE CYCLE(2) Controlled)
Address tAS(3) tWP(1) Data Data Valid tCW(2) tWR(4)
Data
High-Z
High-Z
Revision April 2000
K6F8016V3M Family
TIMING WAVEFORM WRITE CYCLE(3) (UB, Controlled)
Address tCW(2) tAS(3) tWP(1) Data Data Valid tWR(4)
CMOS SRAM
Data
NOTES (WRITE CYCLE)
High-Z
High-Z
write occurs during overlap(t write begins when goes goes with asserting single byte operation simultaneously asserting double byte operation. write ends earliest transition when goes high goes high. measured from beginning write write. measured from going write. measured from address valid beginning write. measured from write address change. applied case write ends going high.
DATA RETENTION WAVE FORM
controlled
3.0V tSDR Data Retention Mode tRDR
2.2V CSVCC 0.2V
Revision April 2000
K6F8016V3M Family
PACKAGE DIMENSION
THIN SMALL OUTLINE PACKAGE TYPE (400F)
CMOS SRAM
Unit: millimeters
0~8° 0.25 0.010
0.45 ~0.75 0.018 0.030
11.76±0.20 0.463±0.008
10.16 0.400
0.50 0.020
1.00±0.10 0.039±0.004 1.20 MAX. 0.047
0.15
0.002
18.81 MAX. 0.741 18.41±0.10 0.725±0.004
0.805 0.032
0.35± 0.10 0.014±0.004
0.80 0.0315
0.05 MIN. 0.002
0.10 0.004
THIN SMALL OUTLINE PACKAGE TYPE (400R)
0.25 0.010
0~8°
0.45 ~0.75 0.018 0.030
11.76±0.20 0.463±0.008
10.16 0.400
0.50 0.020
1.00±0.10 0.039±0.004 1.20 MAX. 0.047
0.15
.004 .006
18.81 MAX. 0.741 18.41± 0.10 0.725±0.004
0.805 0.032
0.35±0.10 0.014±0.004
0.80 0.0315
0.05 MIN. 0.002
0.10 0.004
Revision April 2000

CMOS SRAM 512K Super Power Voltage Full CMOS Static Revision

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