| The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers. |
BF908WR N-channel dual-gate MOS-FET Preliminary specification Fil
Top Searches for this datasheetBF908WR N-channel dual-gate MOS-FET Preliminary specification File under Discrete Semiconductors, SC07 1995 Philips Semiconductors Philips Semiconductors Preliminary specification N-channel dual-gate MOS-FET FEATURES High forward transfer admittance Short channel transistor with high forward transfer admittance input capacitance ratio noise gain controlled amplifier GHz. APPLICATIONS applications with supply voltage, such television tuners professional communications equipment. DESCRIPTION Depletion type field effect transistor plastic microminiature SOT343R package. transistor protected against excessive input voltage surges integrated back-to-back diodes between gates source. CAUTION device supplied antistatic package. gate-source input must protected against static discharge during transport handling. QUICK REFERENCE DATA SYMBOL Ptot Cig1-s drain current total power dissipation operating junction temperature forward transfer admittance input capacitance gate reverse transfer capacitance noise figure PARAMETER drain-source voltage CONDITIONS MIN. TYP. Marking code: BF908WR PINNING SYMBOL source drain gate gate DESCRIPTION view MAM198 Fig.1 Simplified outline (SOT343R) symbol. MAX. UNIT 1995 Philips Semiconductors Preliminary specification N-channel dual-gate MOS-FET LIMITING VALUES accordance with Absolute Maximum Rating System (IEC 134). SYMBOL Ptot Tstg Note Device mounted printed-circuit board. PARAMETER drain-source voltage drain current gate current gate current total power dissipation storage temperature operating junction temperature Tamb Fig.2; note CONDITIONS MIN. BF908WR MAX. +150 +150 UNIT MLD154 handbook, halfpage Ptot (mW) Tamb Fig.2 Power derating curve. 1995 Philips Semiconductors Preliminary specification N-channel dual-gate MOS-FET THERMAL CHARACTERISTICS SYMBOL Notes Device mounted printed-circuit board. temperature soldering point source lead. STATIC CHARACTERISTICS unless otherwise specified. SYMBOL V(BR)G1-SS V(BR)G2-SS V(P)G1-S V(P)G2-S IDSS IG1-SS IG2-SS PARAMETER gate 1-source breakdown voltage gate 2-source breakdown voltage gate 1-source cut-off voltage gate 2-source cut-off voltage drain-source current gate cut-off current gate cut-off current CONDITIONS VG2-S IG1-S VG1-S IG2-S MIN. TYP. PARAMETER thermal resistance from junction ambient thermal resistance from junction soldering point CONDITIONS note note BF908WR VALUE UNIT MAX. -1.5 UNIT VG2-S VG1-S VG2-S VG1-S VG2-S VG1-S VG1-S VG2-S DYNAMIC CHARACTERISTICS Common source; Tamb VG2-S unless otherwise specified. SYMBOL Cig1-s Cig2-s PARAMETER forward transfer admittance input capacitance gate input capacitance gate drain-source capacitance reverse transfer capacitance noise figure MHz; BSopt MHz; GSopt; BSopt CONDITIONS pulsed; MIN. TYP. MAX. UNIT 1995 Philips Semiconductors Preliminary specification N-channel dual-gate MOS-FET BF908WR handbook, halfpage MRC281 (mA) VG2-S handbook, halfpage MRC282 (mA) VG1-S -0.1 -0.2 -0.6 -0.4 -0.2 VG1-S -0.3 VG2-S Fig.3 Transfer characteristics; typical values. Fig.4 Output characteristics; typical values. (mS) MRC280 (mS) MRC276 VG2-S (mA) Fig.5 Forward transfer admittance function drain current; typical values. Fig.6 Forward transfer admittance function junction temperature; typical values. 1995 Philips Semiconductors Preliminary specification N-channel dual-gate MOS-FET PACKAGE OUTLINE BF908WR 1.00 1.35 1.15 0.25 0.10 MSB367 Dimensions Fig.7 SOT343R. 1995 Philips Semiconductors Preliminary specification N-channel dual-gate MOS-FET DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values BF908WR This data sheet contains target goal specifications product development. This data sheet contains preliminary data; supplementary data published later. This data sheet contains final product specifications. Limiting values given accordance with Absolute Maximum Rating System (IEC 134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections specification implied. Exposure limiting values extended periods affect device reliability. Application information Where application information given, advisory does form part specification. LIFE SUPPORT APPLICATIONS These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips customers using selling these products such applications their risk agree fully indemnify Philips damages resulting from such improper sale. 1995 Other recent searchesVN920 - VN920 VN920 Datasheet VN920-B5 - VN920-B5 VN920-B5 Datasheet VN920SO - VN920SO VN920SO Datasheet STS17NF3LL - STS17NF3LL STS17NF3LL Datasheet STD7NB60K - STD7NB60K STD7NB60K Datasheet SN74AVCH1T45 - SN74AVCH1T45 SN74AVCH1T45 Datasheet NP32N055HHE - NP32N055HHE NP32N055HHE Datasheet NP32N055IHE - NP32N055IHE NP32N055IHE Datasheet K4S280832M - K4S280832M K4S280832M Datasheet
Privacy Policy | Disclaimer |