PRODUCT DESCRIPTION (for qualification) Information provided this

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4K/8K PROM PROM20 PROCESS FAMILY MARKETING PART NUMBER CY7C225A CY7C235A CY7C281/2A DEVICE DESCRIPTION Registered PROM 1024 Registered PROM 1024 PROM
PRODUCT DESCRIPTION (for qualification)
Information provided this document intended generic qualification technically describes Cypress part supplied: Marketing Part Device Description: Cypress Division: Size (stepping): CY7C225A/CY7C235A/CY7C281A 4K/8K PROM Cypress Semiconductor Corporation Rev. 7C225B/7C235B/7C281B May/93 mils mils What markings Die:
Overall Mask) Level (pre-requisite qualification): Cypress Qualification completion/Marketing Availability Dates (Current REV):
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number Metal Layers: Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process None CMOS, Double Poly, Metal 0.8µm SiO2 245A Cypress Semiconductor, Round Rock, (Fab Generic Process Technology/Design Rule (µ-drawn): Metal Composition: None Metal 1%SiAl, 4,000A 15,000A Oxynitride
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Copper Solder Dipped, 63%Sn, 37%Pb 80/20 Solder plate Silver spot Syringe Dispenser Thermalsonic Attach Dim: Attach Material: Wire Material/Size: Alphatech, Bangkok, Thailand ALPHA-X/ mils 160mils Epoxy filled Gold 24-pin, 300-mil Plastic 86.5 mils side Sumitomo EME-6300H(R)
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HERMETIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Alloy Solder Dipped, 63%Sn, 37%Pb Bare Ceramic Dispense Ultrasonic Attach Dim: Attach Material: Wire Material/Size: Alphatech, Bangkok, Thailand Alpha-X mils mils Silver Glass Aluminum 1.25 24-pin, 300-mil Windowed/Non-windowed CerDIP mils side
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OTHER INFORMATION
approval similarity, identify other devices using same basic with bonding metal mask options test selections explain: Metal Mask Options Cypress planning changes near future, identify change (Qtr/Yr) Design Rev./Shrink/Date: Fab/Assembly site change/Date: Other Packages qualified this device: Voltage Rating (per STD-008, Method 3018): Flammability Classification (UL-94V): Alternate Fab/Assembly Locations: Assembly Hyundai, Korea Please attach following Qualification Reliability data revision Package type, assembly sites identified above (mark included): HAST (5.5V, 130°C, 85%RH, 15psig) Temperature Cycle (-65°C 150°C) Data Retention Bake, Plastic (165°C) Data Retention Bake, Hermetic (250°C) Autoclave (PCT, 121°C, 100%RH) Tests (MIL-STD 883, method 3015) Operating Life (temp): Latchup Testing Steady State Life (HTSSL, 5.75V, 150°C) Temperature Humidity Bias (5.5V, 85°C, 85%RH) Other: Other: 150°C UL-94V0 None None Process Change/Date: Cross Licensee/Licensor/Date: None LCC, PLCC >2,000V None None
Other Devices qualified this technology:
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PRODUCT INFORMATION QUALIFICATION SIMILARITY
Product Family: Division: 4K/8K PROM2 Cypress Semiconductor Size/ Type Revision Size (stepping) Design Rule Fabrication Passivation Mold Assembly Volt Type Compound Line Rating Location Availability (mm/yy)
Supplier's Part Number Rated Speed
Process Line CY7C225A -xxPC -xxJC -xxDMB -xxLMB -xxPC -xxJC -xxDMB -xxLMB -xxKMB -xxPC -xxJC -xxDMB -xxLMB -xxKMB -xxPC -xxDMB 18ns 40ns 24.3 PDIP PLCCP 24.3 CDIP 7C225B 0.8µ CMOS Oxynitride Sumitomo Alphatech, >2,000V Bangkok, Thailand
CY7C235A
18ns 40ns
24.3 PDIP 7C235B PLCC 24.3 CDIP CPACK 24.3 PDIP 7C281B PLCC 24.3 CDIP CPACK 24.6 PDIP 24.6 CDIP 7C282B
0.8µ
CMOS
Oxynitride
Sumitomo Alpahtech, >2,000V Bangkok, Thailand
CY7C281A
25ns 45ns
0.8µ
CMOS
Oxynitride
Sumitomo Alphatech, >2,000V Bangkok, Thailand
CY7C282A
25ns 45ns
0.8µ
CMOS
Oxynitride
Sumitomo Alphatech, >2,000V Bangkok, Thailand
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DEVICE RELIABILITY SUMMARY
Marketing Part: Description: CY7C245A 24-pin, 300-mil PDIP 24-pin, 300-mil CDIP 24-pin, 300-mil WCDIP Wafer Fab: Assembly: Round Rock, Cypress Jose,
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Early Failure Rate Device 7C225B-DM 7C235B-PC 7C281B-PC 7C291E-WC 7C245E-WMB Lot# 98469 98470 98471 49300103 98343 Hours 0/400 0/395 0/365 0/400 0/400 Cumulative 0/1960
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Latent Failure Rate Device 7C225B-WC 7C235B-PC 7C281B-PC 7C291E-WC 7C245E-WMB Lot# 98469 98470 98471 49300103 98343 Hours 0/400 0/395 0/365 0/400 0/400 Hours 0/400 0/395 0/365 0/400 0/400 Cumulative 0/1960
High Temperature Steady State Life Test (HTSSL, 5.75V, 150°C) Device 7C225B-WC 7C235B-PC 7C281B-PC 7C291E-WC 7C245E-WMB Lot# 98468 98470 98471 49300103 98343 Hours 0/76 0/76 0/76 0/76 0/76 Hours 0/76 0/76 0/76 0/76 0/76 Cumulative 0/380
Group Subgroup1, Life TEST (HTOL, 5.75V, 150°C) Device 7C245E Lot# 98343 Hours 0/77 Cumulative 0/77
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DEVICE RELIABILITY SUMMARY
4K/8K 0.8µ PROM FAMILY Electrostatic Discharge Human Body Model Circuit 883, Method 3015 >+2,000V Unit >-2,000V >+2,000V Unit >-2,000V >+2,000V Unit >-2,000V (Highest passing voltage, +10% Guard-banded)
Other qualifications that affect this product family process Qual Number 91211 91412 Description PROM FAMILY (Hermetic) PROM FAMILY (Plastic)

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