CY7C182 PRODUCT DESCRIPTION (for qualification) Information provi

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CY7C182 PRODUCT DESCRIPTION (for qualification) Information provi

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CY7C182
PRODUCT DESCRIPTION (for qualification) Information provided this document intended generic qualification technically describes Cypress part supplied: Marketing Part Device Description: Cypress Division: Size (stepping): CY7C182 Static Cypress Semiconductor Corporation 7C182A/B 7C182A/B mils mils What markings Die:
Overall Mask) Level (pre-requisite qualification): Cypress Qualification completion/Marketing Availability Dates (Current REV):
TECHNOLOGY/FAB PROCESS DESCRIPTION Number Metal Layers: Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process Polyimide (PIQ3600) CMOS, SiO2 Cypress Semiconductor, Round Rock, (Fab RAM21HYGO Generic Process Technology/Design Rule (µ-drawn): Metal Composition: Teos, Oxynitride Metal Si-Al, w/Ti barrier
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Assembly Line Process Copper Solder Dipped, 63%Sn, 37%Pb Silver Automatic Dispenser Thermocompression Attach Dim: Attach Material: Wire Material/Size: Alphatech, Bangkok, Thailand ALPHA-X/P2831 mils mils Silver Epoxy Gold 28-pin, 300-mil Plastic mils side, mils side Sumitomo EME-6300H(R)
Name/Location Assembly (prime) facility:
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CYPRESS SEMICONDUCTOR
HERMETIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Alloy Solder Dipped, 63%Sn, 37%Pb Silver Automatic Automatic Attach Dim: Attach Material: Wire Material/Size: Alphatech, Bangkok, Thailand D283C mils mils Silver Glass Aluminum 1.25 28-pin, 300-mil CerDIP 15.5 mils side, mils side
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CYPRESS SEMICONDUCTOR
OTHER INFORMATION approval similarity, identify other devices using same basic with bonding metal mask options test selections explain:
Cypress planning changes near future, identify change (Qtr/Yr) Design Rev./Shrink: Fab/Assembly site change: Other Devices qualified this technology: Other Packages qualified this device: Voltage Rating (per STD-008, Method 3018): Flammability Classification (UL-94V): Alternate Fab/Assembly Locations: None Assembly Process Change: Cross Licensee/Licensor: 7C185 REV. SOIC >2,000V
Please attach following Qualification Reliability data revision Package type, assembly sites identified above (mark included): HAST (5.5V, 130°C, 85%RH, 15psig) Temperature Cycles (-40°Cto 125°C) Temperature Cycles (-65°Cto 150°C) Data Retention Bake, Plastic (165°C) Data Retention Bake, Hermetic (250°C) Autoclave (PCT, 121°C, 100%RH) Tests (MIL-STD 883, method 3015) Operating Life (temp): Latchup Testing Steady State Life (HTSSL, 5.75V, 150°C) Temperature Humidity Bias (5.5V, 85°C, 85%RH) Other: Other: Capacitance Internal Water Vapor 150°C
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CYPRESS SEMICONDUCTOR
PRODUCT INFORMATION QUALIFICATION SIMILARITY Product Family: Division: Supplier's Part Number Static Cypress Semiconductor Rated Speed Size/ Type Revision Size (stepping) Design Rule Fabrication Passivation Mold Assembly Volt Type Compound Line Rating Location Availability (mm/yy)
Process Line CY7C182 -**PC -**VC -**SC -**DC 28.3 PDIP 28.3 CDIP 0.65µ CMOS Oxynitride Sumitomo Alphatech, >2,000V Bangkok, Hysol Thailand 12/93
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CYPRESS SEMICONDUCTOR
Marketing Part: Description:
DEVICE RELIABILITY SUMMARY CY7C182 Wafer Fab: 28-pin, 300-mil PDIP Assembly: 28-pin, 300-mil CDIP
Round Rock, Alphatech, Bangkok, Thailand
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Early Failure Rate Device CY7C182-PC CY7C182-PC CY7C182-PC CY7C185-PC CY7C185-PC CY7C185-PC Lot# 2249987 2301194 2434379 3404115 3401905 3403004 Hours 0/1055 0/1000 0/14981 0/38212 0/18482 0/9022 Cumulative 0/8169
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Latent Failure Rate Device CY7C182-PC CY7C182-PC Lot# 2249987 2301194 Hours 0/200 0/135 Hours 1/1993 0/135 Cumulative 1/334
Group Subgroup Life Test (HTOL, 5.75V, 150°C) Device CY7C182-PC Lot# 2302239 Hours 0/80 High Temperature Steady State Life Test (HTSSL, 5.75V, 150°C) Device CY7C182-PC CY7C182-PC
Cumulative 0/80
Lot# 2249987 2301194
Hours 0/764 0/80
Hours 0/76 0/80
Cumulative 0/156
#94451. Family data, QTP# 94012. Trapped Charge, #92511-1L2. hours, #92511-1H1.
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CYPRESS SEMICONDUCTOR
Temperature Cycle (Condition -40°C 125°C) Device CY7C182-PC Lot# 2249987 Cycles 0/45 1000 Cycles 0/45 Cumulative 0/45
Temperature Cycle (Condition -65°C 150°C) Device CY7C182-DMB Lot# 2302239 Cycles 0/47 1000 Cycles 0/465 Cumulative 0/46
Autoclave (PCT, bias, 121°C, 100%RH, 15psig) Device CY7C182-PC Lot# 2249987 Hours 0/45 Hours Cumulative 0/45
High Accelerated Saturation Test (HAST, 5.5V, 130°C, 85%RH, 15psig) Device CY7C182-PC Lot# 2249987 Hours 0/45 High Bias 7.0V) Device CY7C182-PC Lot# 2249987 Hours 0/113 Hours 0/113 1000 Hours 0/113 Cumulative 0/1136 Hours Cumulative 0/45
Leakage, 92511-2BT1 EOS, 92511-1LL1 92511-1LL2
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CYPRESS SEMICONDUCTOR
Device Reliability Summary
Electrostatic Discharge Human Body Model >+2,000V >+2,000V >+2,000V Unit Unit >-2,000V >-2,000V >-2,000V >-2,000V >-2,000V >-2,000V
Unit Charged Devcie Model >+2,000V Unit >+2,000V Unit >+2,000V Unit
Latchup Testing Cypress Internal Latch-up Procedure Tests: Current Injection 200mA Trigger Socket Oscillation 7.5V 1MHz Temp 150°C

CY7C182 PRODUCT DESCRIPTION (for qualification) Information provi

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